Jipu Lei, Ph.D. - Publications
Affiliations: | 2005 | University of North Texas, Denton, TX, United States |
Area:
Analytical ChemistryYear | Citation | Score | |||
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2006 | Lei J, Rudenja S, Magtoto N, Kelber JA. Cu electrodeposition on Ru(0001): Perchlorate dissociation and its effects on Cu deposition Thin Solid Films. 497: 121-129. DOI: 10.1016/J.Tsf.2005.10.057 | 0.651 | |||
2005 | Liu J, Lei J, Magtoto N, Rudenja S, Garza M, Kelber JA. The effects of an iodine surface layer on ru reactivity in air and during Cu electrodeposition Journal of the Electrochemical Society. 152: G115-G121. DOI: 10.1149/1.1842072 | 0.53 | |||
2003 | Wang C, Lei J, Bjelkevig C, Rudenja S, Magtoto N, Kelber J. Electrodeposition of adherent copper film on unmodified tungsten Thin Solid Films. 445: 72-79. DOI: 10.1016/S0040-6090(03)01239-2 | 0.445 | |||
2002 | Wang C, Lei J, Rudenja S, Magtoto N, Kelber J. Seedless electrodeposition of Cu on unmodified tungsten Electrochemical and Solid-State Letters. 5: C82-C84. DOI: 10.1149/1.1498015 | 0.537 | |||
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