Shatil Haque, Ph.D. - Publications
Affiliations: | 2000 | Virginia Polytechnic Institute and State University, Blacksburg, VA, United States |
Area:
Materials Science Engineering, Packaging Engineering, Electronics and Electrical EngineeringYear | Citation | Score | |||
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2001 | Haque S, Siddabattula K, Craven M, Wen S, Liu X, Boroyevich D, Lu G. Design issues of a three-dimensional packaging scheme for power modules Microelectronics Reliability. 41: 295-305. DOI: 10.1016/S0026-2714(00)00208-0 | 0.486 | |||
2000 | Haque S, Lu G, Goings J, Sigmund J. Characterization of interfacial thermal resistance by acoustic micrography imaging Microelectronics Reliability. 40: 465-476. DOI: 10.1016/S0026-2714(99)00239-5 | 0.53 | |||
1999 | Haque S, Stinnett WA, Nelson DJ, Lu G. Thermal management of power electronics modules packaged by a stacked-plate technique Microelectronics Reliability. 39: 1343-1349. DOI: 10.1016/S0026-2714(99)00055-4 | 0.56 | |||
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