| Year |
Citation |
Score |
| 2020 |
Raj N, Breedveld V, Hess DW. Flow control in fully enclosed microfluidics paper based analytical devices using plasma processes Sensors and Actuators B-Chemical. 320: 128606. DOI: 10.1016/J.Snb.2020.128606 |
0.333 |
|
| 2019 |
Raj N, Breedveld V, Hess DW. Fabrication of fully enclosed paper microfluidic devices using plasma deposition and etching. Lab On a Chip. 19: 3337-3343. PMID 31501838 DOI: 10.1039/C9Lc00746F |
0.343 |
|
| 2019 |
Lin H, Rosu C, Jiang L, Sundar VA, Breedveld V, Hess DW. Nonfluorinated Superhydrophobic Chemical Coatings on Polyester Fabric Prepared with Kinetically Controlled Hydrolyzed Methyltrimethoxysilane Industrial & Engineering Chemistry Research. 58: 15368-15378. DOI: 10.1021/Acs.Iecr.9B02471 |
0.366 |
|
| 2019 |
McGlothin C, Rosu C, Jiang L, Breedveld V, Hess DW. Lowering protein fouling by rational processing of fluorine-free hydrophobic coatings Surfaces and Interfaces. 17: 100370. DOI: 10.1016/J.Surfin.2019.100370 |
0.379 |
|
| 2018 |
Rosu C, Lin H, Jiang L, Breedveld V, Hess DW. Sustainable and long-time 'rejuvenation' of biomimetic water-repellent silica coating on polyester fabrics induced by rough mechanical abrasion. Journal of Colloid and Interface Science. 516: 202-214. PMID 29408106 DOI: 10.1016/J.Jcis.2018.01.055 |
0.356 |
|
| 2018 |
Jang Y, Choi WT, Johnson CT, García AJ, Singh PM, Breedveld V, Hess DW, Champion JA. Inhibition of Bacterial Adhesion on Nanotextured Stainless Steel 316L by Electrochemical Etching. Acs Biomaterials Science & Engineering. 4: 90-97. PMID 29333490 DOI: 10.1021/Acsbiomaterials.7B00544 |
0.331 |
|
| 2017 |
Yang X, Liu X, Hess DW, Breedveld V. Underwater Oil Droplet Splitting on a Patterned Template. Langmuir : the Acs Journal of Surfaces and Colloids. PMID 29120647 DOI: 10.1021/Acs.Langmuir.7B03604 |
0.346 |
|
| 2017 |
Jiang L, Tang Z, Clinton RM, Breedveld V, Hess DW. Two-Step Process to Create "Roll-Off" Superamphiphobic Paper Surfaces. Acs Applied Materials & Interfaces. PMID 28225585 DOI: 10.1021/Acsami.7B00829 |
0.492 |
|
| 2017 |
Jiang L, Park-Lee KJ, Clinton RM, Tang Z, Breedveld V, Hess DW. Mechanical durability of liquid repellent coatings Surface and Coatings Technology. 328: 182-191. DOI: 10.1016/J.Surfcoat.2017.08.007 |
0.407 |
|
| 2017 |
Choi WT, Yang X, Breedveld V, Hess DW. Creation of wettability contrast patterns on metallic surfaces via pen drawn masks Applied Surface Science. 426: 1241-1248. DOI: 10.1016/J.Apsusc.2017.08.215 |
0.428 |
|
| 2016 |
Choi WT, Oh K, Singh PM, Breedveld V, Hess DW. Wettability control of stainless steel surfaces via evolution of intrinsic grain structures Journal of Materials Science. 51: 5196-5206. DOI: 10.1007/S10853-016-9821-Y |
0.425 |
|
| 2016 |
Jiang L, Tang Z, Clinton RM, Hess DW, Breedveld V. Fabrication of highly amphiphobic paper using pulp debonder Cellulose. 1-15. DOI: 10.1007/S10570-016-1048-1 |
0.324 |
|
| 2016 |
Tang Z, Li H, Hess DW, Breedveld V. Effect of chain length on the wetting properties of alkyltrichlorosilane coated cellulose-based paper Cellulose. 1-13. DOI: 10.1007/S10570-016-0877-2 |
0.382 |
|
| 2016 |
Tang Z, Xie L, Hess DW, Breedveld V. Fabrication of amphiphobic softwood and hardwood by treatment with non-fluorinated chemicals Wood Science and Technology. 1-17. DOI: 10.1007/S00226-016-0854-9 |
0.361 |
|
| 2015 |
Huffman C, Hess DW, De Marneffe JF, Sekine M, De Gendt S. Preface to the focus issue on atomic layer etch and clean Ecs Journal of Solid State Science and Technology. 4: Y7. DOI: 10.1149/2.0151506Jss |
0.36 |
|
| 2015 |
Choi T, Hess DW. Chemical Etching and Patterning of Copper, Silver, and Gold Films at Low Temperatures Ecs Journal of Solid State Science and Technology. 4. DOI: 10.1149/2.0111501Jss |
0.431 |
|
| 2015 |
Choi T, Hess DW. Etching of Ag and Au films in CH4-based plasmas at low temperature Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 33: 12202. DOI: 10.1116/1.4902332 |
0.358 |
|
| 2015 |
Tang Z, Hess DW, Breedveld V. Fabrication of oleophobic paper with tunable hydrophilicity by treatment with non-fluorinated chemicals Journal of Materials Chemistry A. 3: 14651-14660. DOI: 10.1039/C5Ta03520A |
0.389 |
|
| 2015 |
Xie L, Tang Z, Jiang L, Breedveld V, Hess DW. Creation of superhydrophobic wood surfaces by plasma etching and thin-film deposition Surface and Coatings Technology. 281: 125-132. DOI: 10.1016/J.Surfcoat.2015.09.052 |
0.5 |
|
| 2014 |
Hess DW. Low temperature plasma etching of copper, silver and gold films Ecs Transactions. 61: 91-96. DOI: 10.1149/06103.0091ecst |
0.338 |
|
| 2014 |
Sherpa SD, Kunc J, Hu Y, Levitin G, De Heer WA, Berger C, Hess DW. Local work function measurements of plasma-fluorinated epitaxial graphene Applied Physics Letters. 104. DOI: 10.1063/1.4866783 |
0.323 |
|
| 2014 |
Westafer RS, Levitin G, Hess DW, Bergin MH, Hunt WD. Detection of ppb ozone using a dispersive surface acoustic wave reflective delay line with integrated reference signal Sensors and Actuators B-Chemical. 192: 406-413. DOI: 10.1016/J.Snb.2013.10.104 |
0.305 |
|
| 2013 |
Li L, Breedveld V, Hess DW. Design and fabrication of superamphiphobic paper surfaces. Acs Applied Materials & Interfaces. 5: 5381-6. PMID 23647359 DOI: 10.1021/Am401436M |
0.392 |
|
| 2013 |
Choi T, Levitin G, Hess DW. Mechanistic Considerations in Plasma-Assisted Etching of Ag and Au Thin Films Ecs Journal of Solid State Science and Technology. 2. DOI: 10.1149/2.012306Jss |
0.358 |
|
| 2013 |
Choi T, Levitin G, Hess DW. Low Temperature Cu Etching Using CH4-Based Plasmas Ecs Journal of Solid State Science and Technology. 2. DOI: 10.1149/2.002312Jss |
0.302 |
|
| 2013 |
Li L, Roethel S, Breedveld V, Hess DW. Creation of low hysteresis superhydrophobic paper by deposition of hydrophilic diamond-like carbon films Cellulose. 20: 3219-3226. DOI: 10.1007/S10570-013-0078-1 |
0.424 |
|
| 2013 |
Li L, Breedveld V, Hess DW. Hysteresis controlled water droplet splitting on superhydrophobic paper Colloid and Polymer Science. 291: 417-426. DOI: 10.1007/S00396-012-2755-2 |
0.377 |
|
| 2012 |
Li L, Breedveld V, Hess DW. Creation of superhydrophobic stainless steel surfaces by acid treatments and hydrophobic film deposition. Acs Applied Materials & Interfaces. 4: 4549-56. PMID 22913317 DOI: 10.1021/Am301666C |
0.387 |
|
| 2012 |
Casciato MJ, Levitin G, Hess DW, Grover MA. Synthesis of Cu(2)ZnSnS(4) micro- and nanoparticles via a continuous-flow supercritical carbon dioxide process. Chemsuschem. 5: 1186-9. PMID 22707477 DOI: 10.1002/Cssc.201200171 |
0.362 |
|
| 2012 |
Xiu Y, Liu Y, Balu B, Hess DW, Wong C. Robust Superhydrophobic Surfaces Prepared With Epoxy Resin and Silica Nanoparticles Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 395-401. DOI: 10.1109/Tcpmt.2011.2177088 |
0.8 |
|
| 2012 |
Casciato MJ, Kim S, Lu JC, Hess DW, Grover MA. Optimization of a Carbon Dioxide-Assisted Nanoparticle Deposition Process Using Sequential Experimental Design with Adaptive Design Space Industrial & Engineering Chemistry Research. 51: 15807-15807. DOI: 10.1021/Ie2028574 |
0.343 |
|
| 2012 |
Casciato MJ, Kim S, Lu JC, Hess DW, Grover MA. Optimization of carbon dioxide-assisted nanoparticle deposition process with uncertain design space Computer Aided Chemical Engineering. 31: 1191-1195. DOI: 10.1016/B978-0-444-59506-5.50069-9 |
0.309 |
|
| 2012 |
Casciato MJ, Levitin G, Hess DW, Grover MA. Controlling the properties of silver nanoparticles deposited on surfaces using supercritical carbon dioxide for surface-enhanced Raman spectroscopy Journal of Nanoparticle Research. 14: 836. DOI: 10.1007/S11051-012-0836-2 |
0.433 |
|
| 2011 |
Levitin G, Hess DW. Surface reactions in microelectronics process technology. Annual Review of Chemical and Biomolecular Engineering. 2: 299-324. PMID 22432621 DOI: 10.1146/Annurev-Chembioeng-061010-114249 |
0.437 |
|
| 2011 |
Riccardi CS, Hess DW, Mizaikoff B. Surface-modified ZnSe waveguides for label-free infrared attenuated total reflection detection of DNA hybridization. The Analyst. 136: 4906-11. PMID 21994915 DOI: 10.1039/C0An00504E |
0.301 |
|
| 2011 |
Wu F, Levitin G, Hess DW. Temperature Effects and Optical Emission Spectroscopy Studies of Hydrogen-Based Plasma Etching of Copper Journal of the Electrochemical Society. 159. DOI: 10.1149/2.015202Jes |
0.75 |
|
| 2011 |
Wu F, Levitin G, Hess DW. Mechanistic considerations of low temperature hydrogen-based plasma etching of Cu Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 29: 11013. DOI: 10.1116/1.3520461 |
0.779 |
|
| 2010 |
Xiu Y, Liu Y, Hess DW, Wong CP. Mechanically robust superhydrophobicity on hierarchically structured Si surfaces. Nanotechnology. 21: 155705. PMID 20332558 DOI: 10.1088/0957-4484/21/15/155705 |
0.768 |
|
| 2010 |
Liu Y, Xiu Y, Hess DW, Wong CP. Silicon surface structure-controlled oleophobicity. Langmuir : the Acs Journal of Surfaces and Colloids. 26: 8908-13. PMID 20205405 DOI: 10.1021/La904686C |
0.781 |
|
| 2010 |
Balu B, Berry AD, Patel KT, Breedveld V, Hess DW. Directional mobility and adhesion of water drops on patterned superhydrophobic surfaces Journal of Adhesion Science and Technology. 25: 627-642. DOI: 10.1163/016942410X525849 |
0.795 |
|
| 2010 |
Pande AA, Levitin G, Hess DW. Formulation of Selective Etch Chemistries for Silicon Dioxide–Based Films Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3374176 |
0.411 |
|
| 2010 |
Wu F, Levitin G, Hess DW. Patterning of Cu Films by a Two-Step Plasma Etching Process at Low Temperature Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3314292 |
0.781 |
|
| 2010 |
Wu F, Levitin G, Hess DW. Low-Temperature Etching of Cu by Hydrogen-Based Plasmas Acs Applied Materials & Interfaces. 2: 2175-2179. DOI: 10.1021/Am1003206 |
0.772 |
|
| 2009 |
Balu B, Berry AD, Hess DW, Breedveld V. Patterning of superhydrophobic paper to control the mobility of micro-liter drops for two-dimensional lab-on-paper applications. Lab On a Chip. 9: 3066-75. PMID 19823721 DOI: 10.1039/B909868B |
0.789 |
|
| 2009 |
Song IG, Timmons C, Levitin G, Hess DW. Photoresist Removal Using Alternative Chemistries and Pressures Solid State Phenomena. 303-310. DOI: 10.4028/Www.Scientific.Net/Ssp.145-146.303 |
0.458 |
|
| 2009 |
Xiu Y, Liu Y, Hess DW, Wong C. Superhydrophobic Silicon Surfaces with Low Light Reflectivity Mrs Proceedings. 1158. DOI: 10.1557/Proc-1158-F03-07 |
0.778 |
|
| 2009 |
Balu B, Kim JS, Breedveld V, Hess DW. Tunability of the adhesion of water drops on a superhydrophobic paper surface via selective plasma etching Journal of Adhesion Science and Technology. 23: 361-380. DOI: 10.1163/156856108X383547 |
0.805 |
|
| 2009 |
Xiu Y, Xiao F, Hess DW, Wong C. Superhydrophobic optically transparent silica films formed with a eutectic liquid Thin Solid Films. 517: 1610-1615. DOI: 10.1016/J.Tsf.2008.09.081 |
0.793 |
|
| 2008 |
Xiu Y, Zhang S, Yelundur V, Rohatgi A, Hess DW, Wong CP. Superhydrophobic and low light reflectivity silicon surfaces fabricated by hierarchical etching. Langmuir : the Acs Journal of Surfaces and Colloids. 24: 10421-6. PMID 18710271 DOI: 10.1021/La801206M |
0.784 |
|
| 2008 |
Xiu Y, Hess DW, Wong CP. UV and thermally stable superhydrophobic coatings from sol-gel processing. Journal of Colloid and Interface Science. 326: 465-70. PMID 18656893 DOI: 10.1016/J.Jcis.2008.06.042 |
0.779 |
|
| 2008 |
Wiedemair J, Balu B, Moon JS, Hess DW, Mizaikoff B, Kranz C. Plasma-deposited fluorocarbon films: insulation material for microelectrodes and combined atomic force microscopy-scanning electrochemical microscopy probes. Analytical Chemistry. 80: 5260-5. PMID 18510344 DOI: 10.1021/Ac800246Q |
0.794 |
|
| 2008 |
Balu B, Breedveld V, Hess DW. Fabrication of "roll-off" and "sticky" superhydrophobic cellulose surfaces via plasma processing. Langmuir : the Acs Journal of Surfaces and Colloids. 24: 4785-90. PMID 18315020 DOI: 10.1021/La703766C |
0.819 |
|
| 2008 |
Xiu Y, Hess DW, Wong CP. UV-Resistant and Superhydrophobic Self-Cleaning Surfaces Using Sol–Gel Processes Journal of Adhesion Science and Technology. 22: 1907-1917. DOI: 10.1163/156856108X320050 |
0.774 |
|
| 2008 |
Timmons CL, Hess DW. Photoresist and Fluorocarbon Postplasma Etch Residue Removal Using Electrochemically Generated Radical Anions Journal of the Electrochemical Society. 155: H771. DOI: 10.1149/1.2965533 |
0.364 |
|
| 2008 |
Xiu Y, Zhu L, Hess DW, Wong CP. Relationship between Work of Adhesion and Contact Angle Hysteresis on Superhydrophobic Surfaces The Journal of Physical Chemistry C. 112: 11403-11407. DOI: 10.1021/Jp711571K |
0.806 |
|
| 2007 |
Dobbs GT, Balu B, Young C, Kranz C, Hess DW, Mizaikoff B. Mid-infrared chemical sensors utilizing plasma-deposited fluorocarbon membranes. Analytical Chemistry. 79: 9566-71. PMID 18020310 DOI: 10.1021/Ac070832G |
0.818 |
|
| 2007 |
Xiu Y, Zhu L, Hess DW, Wong CP. Hierarchical silicon etched structures for controlled hydrophobicity/superhydrophobicity. Nano Letters. 7: 3388-93. PMID 17929875 DOI: 10.1021/Nl0717457 |
0.813 |
|
| 2007 |
Zhu L, Hess DW, Wong C. Assembly of Fine-Pitch Carbon Nanotube Bundles for Electrical Interconnect Applications Mrs Proceedings. 990. DOI: 10.1557/Proc-0990-B10-01 |
0.699 |
|
| 2007 |
Wong C, Zhu L, Hess DW, Wong CP. Sol-Gel Process Derived Superhydrophobic Silica Thin Films for Antistiction of MEMS Devices Mrs Proceedings. 990. DOI: 10.1557/Proc-0990-B05-02 |
0.763 |
|
| 2007 |
Sinha A, Hess DW, Henderson CL. A novel top surface imaging approach utilizing direct area selective atomic layer deposition of hard masks Proceedings of Spie - the International Society For Optical Engineering. 6519. DOI: 10.1117/12.712458 |
0.652 |
|
| 2007 |
Sinha A, Hess DW, Henderson CL. Transport behavior of atomic layer deposition precursors through polymer masking layers: Influence on area selective atomic layer deposition Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 25: 1721-1728. DOI: 10.1116/1.2782546 |
0.589 |
|
| 2007 |
Simões AZ, Riccardi CS, Cavalcante LS, Longo E, Varela JA, Mizaikoff B, Hess DW. Ferroelectric fatigue endurance of Bi4−xLaxTi3O12 thin films explained in terms of x-ray photoelectron spectroscopy Journal of Applied Physics. 101: 084112. DOI: 10.1063/1.2719013 |
0.325 |
|
| 2007 |
Tamirisa PA, Levitin G, Kulkarni NS, Hess DW. Plasma etching of copper films at low temperature Microelectronic Engineering. 84: 105-108. DOI: 10.1016/J.Mee.2006.08.012 |
0.816 |
|
| 2007 |
Zhu L, Xu J, Xiao F, Jiang H, Hess DW, Wong C. The growth of carbon nanotube stacks in the kinetics-controlled regime Carbon. 45: 344-348. DOI: 10.1016/J.Carbon.2006.09.014 |
0.68 |
|
| 2006 |
Xiu Y, Zhu L, Hess DW, Wong CP. Biomimetic creation of hierarchical surface structures by combining colloidal self-assembly and Au sputter deposition. Langmuir : the Acs Journal of Surfaces and Colloids. 22: 9676-81. PMID 17073496 DOI: 10.1021/La061698I |
0.81 |
|
| 2006 |
Zhu L, Xu J, Xiu Y, Sun Y, Hess DW, Wong CP. Electrowetting of aligned carbon nanotube films. The Journal of Physical Chemistry. B. 110: 15945-50. PMID 16898749 DOI: 10.1021/Jp063265U |
0.813 |
|
| 2006 |
Zhu L, Hess DW, Wong CP. Monitoring carbon nanotube growth by formation of nanotube stacks and investigation of the diffusion-controlled kinetics. The Journal of Physical Chemistry. B. 110: 5445-9. PMID 16539482 DOI: 10.1021/Jp060027Q |
0.706 |
|
| 2006 |
Zhu L, Sun Y, Hess DW, Wong CP. Well-aligned open-ended carbon nanotube architectures: an approach for device assembly. Nano Letters. 6: 243-7. PMID 16464043 DOI: 10.1021/Nl052183Z |
0.695 |
|
| 2006 |
Kulkarni NS, Tamirisa P, Levitin G, Kasica RJ, Hess DW. Low Temperature Plasma Etching of Copper for Minimizing Size Effects in sub-100 nm Features Mrs Proceedings. 914. DOI: 10.1557/Proc-0914-F09-08 |
0.791 |
|
| 2006 |
Sinha A, Hess DW, Henderson CL. A top surface imaging method using area selective ALD on chemically amplified polymer photoresist films Electrochemical and Solid-State Letters. 9. DOI: 10.1149/1.2335939 |
0.651 |
|
| 2006 |
Levitin G, Timmons C, Hess DW. Photoresist and Etch Residue Removal Effect of Surface Energy and Interfacial Tension Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2203096 |
0.43 |
|
| 2006 |
Sinha A, Hess DW, Henderson CL. Area-selective ALD of titanium dioxide using lithographically defined poly(methyl methacrylate) films Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2184068 |
0.604 |
|
| 2006 |
Song I, Spuller M, Levitin G, Hess DW. Photoresist and Residue Removal Using Gas-Expanded Liquids Journal of the Electrochemical Society. 153: G314. DOI: 10.1149/1.2171824 |
0.74 |
|
| 2006 |
Luo Q, Dragomir-Cernatescu I, Snyder RL, Rees WS, Hess DW. Comparison of Nitrided HfO2 Films Deposited in O2 and N2O by Direct Liquid Injection CVD Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2128119 |
0.4 |
|
| 2006 |
Sinha A, Hess DW, Henderson CL. Area selective atomic layer deposition of titanium dioxide: Effect of precursor chemistry Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 2523-2532. DOI: 10.1116/1.2359728 |
0.599 |
|
| 2006 |
Vaswani S, Koskinen J, Hess DW. Sorption and desorption behaviors of hexadecane vapors in plasma deposited fluorocarbon films using a quartz crystal microbalance Journal of Vacuum Science and Technology. 24: 1737-1745. DOI: 10.1116/1.2217981 |
0.766 |
|
| 2006 |
Tamirisa PA, Hess DW. Water and Moisture Uptake by Plasma Polymerized Thermoresponsive Hydrogel Films Macromolecules. 39: 7092-7097. DOI: 10.1021/Ma060944U |
0.435 |
|
| 2006 |
Tamirisa PA, Koskinen J, Hess DW. Plasma polymerized hydrogel thin films Thin Solid Films. 515: 2618-2624. DOI: 10.1016/J.Tsf.2006.03.021 |
0.823 |
|
| 2006 |
Zhu L, Xu J, Xiu Y, Sun Y, Hess DW, Wong C. Growth and electrical characterization of high-aspect-ratio carbon nanotube arrays Carbon. 44: 253-258. DOI: 10.1016/J.Carbon.2005.07.037 |
0.788 |
|
| 2006 |
Zhu L, Xu J, Xiu Y, Hess DW, Wong CP. A rapid growth of aligned carbon nanotube films and high-aspect-ratio arrays Journal of Electronic Materials. 35: 195-199. DOI: 10.1007/Bf02692435 |
0.806 |
|
| 2006 |
Luo Q, Hess DW, Rees WS. Effect of oxidant on downstream microwave plasma enhanced CVD of hafnium oxynitride films Chemical Vapor Deposition. 12: 181-186. DOI: 10.1002/Cvde.200506440 |
0.413 |
|
| 2005 |
Diao J, Hess DW. Refractive index measurements of films with biaxial symmetry. 2. Determination of film thickness and refractive indices using polarized transmission spectra in the transparent wavelength range. The Journal of Physical Chemistry. B. 109: 12819-25. PMID 16852589 DOI: 10.1021/Jp0462761 |
0.626 |
|
| 2005 |
Diao J, Hess DW. Refractive index measurements of films with biaxial symmetry. 1. Determination of complex refractive indices using polarized reflectance/transmittance ratio. The Journal of Physical Chemistry. B. 109: 12800-18. PMID 16852588 DOI: 10.1021/Jp046277T |
0.603 |
|
| 2005 |
Zhu L, Xiu Y, Hess DW, Wong CP. Aligned carbon nanotube stacks by water-assisted selective etching. Nano Letters. 5: 2641-5. PMID 16351229 DOI: 10.1021/Nl051906B |
0.781 |
|
| 2005 |
Zhu L, Xiu Y, Xu J, Tamirisa PA, Hess DW, Wong CP. Superhydrophobicity on two-tier rough surfaces fabricated by controlled growth of aligned carbon nanotube arrays coated with fluorocarbon. Langmuir : the Acs Journal of Surfaces and Colloids. 21: 11208-12. PMID 16285792 DOI: 10.1021/La051410+ |
0.805 |
|
| 2005 |
Myneni S, Hess DW. Post Plasma Etch Residue Removal Using CO[sub 2]-Based Mixtures: Mechanistic Considerations Journal of the Electrochemical Society. 152: G757. DOI: 10.1149/1.2007147 |
0.735 |
|
| 2005 |
Levitin G, Hess DW. Ionic Conductivity of Elevated Pressure TMAHCO[sub 3]/MeOH/CO[sub 2] Mixtures Electrochemical and Solid-State Letters. 8: G23. DOI: 10.1149/1.1836116 |
0.363 |
|
| 2005 |
Spuller MT, Perchuk RS, Hess DW. Evaluating Photoresist Dissolution, Swelling, and Removal with an In Situ Film Refractive Index and Thickness Monitor Journal of the Electrochemical Society. 152: G40. DOI: 10.1149/1.1817716 |
0.794 |
|
| 2005 |
Myneni S, Peng HG, Gidley DW, Hess DW. Compatibility of high pressure cleaning mixtures with a porous low dielectric constant film: A positronium annihilation lifetime spectroscopic study Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 23: 1463-1469. DOI: 10.1116/1.1941227 |
0.723 |
|
| 2005 |
Diao J, Hess DW. Through-plane uniformity of optical anisotropy in spin-coated biphenyl dianhydride-p-phenylenediamine films Thin Solid Films. 483: 226-231. DOI: 10.1016/J.Tsf.2004.11.246 |
0.63 |
|
| 2005 |
Vaswani S, Koskinen J, Hess DW. Surface modification of paper and cellulose by plasma-assisted deposition of fluorocarbon films Surface & Coatings Technology. 195: 121-129. DOI: 10.1016/J.Surfcoat.2004.10.013 |
0.79 |
|
| 2004 |
Timmons CL, Hess DW. Electrochemical Cleaning of Post-Plasma Etch Fluorocarbon Residues Using Reductive Radical Anion Chemistry Electrochemical and Solid-State Letters. 7: G302. DOI: 10.1149/1.1813211 |
0.359 |
|
| 2004 |
Levitin G, Myneni S, Hess DW. Post Plasma Etch Residue Removal Using CO[sub 2]-TMAHCO[sub 3] Mixtures: Comparison of Single-Phase and Two-Phase Mixtures Journal of the Electrochemical Society. 151: G380. DOI: 10.1149/1.1723503 |
0.712 |
|
| 2004 |
McCoy K, Hess DW, Henderson CL, Tolbert LM. Patterning via surface monolayer initiated polymerization: A study of surface initiator photoreaction kinetics Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 22: 3503-3508. DOI: 10.1116/1.1824061 |
0.381 |
|
| 2004 |
Mays EL, Hess DW, Rees WS. Deposition and characterization of zirconium tin titanate thin films as a potential high-k material for electronic devices Journal of Crystal Growth. 261: 309-315. DOI: 10.1016/J.Jcrysgro.2003.11.039 |
0.427 |
|
| 2004 |
Diao J, Hess DW. Use of angle-resolved XPS to determine depth profiles based on Fick's second law of diffusion: Description of method and simulation study Journal of Electron Spectroscopy and Related Phenomena. 135: 87-104. DOI: 10.1016/J.Elspec.2003.12.008 |
0.581 |
|
| 2003 |
Myneni S, Hess DW. Post-Plasma-Etch Residue Removal Using CO[sub 2]-Based Fluids Journal of the Electrochemical Society. 150: G744. DOI: 10.1149/1.1621879 |
0.723 |
|
| 2003 |
Spuller MT, Hess DW. Incomplete Wetting of Nanoscale Thin-Film Structures Journal of the Electrochemical Society. 150. DOI: 10.1149/1.1588303 |
0.776 |
|
| 2003 |
Levitin G, Myneni S, Hess DW. Reactions Between CO[sub 2] and Tetramethylammonium Hydroxide in Cleaning Solutions Electrochemical and Solid-State Letters. 6: G101. DOI: 10.1149/1.1583372 |
0.367 |
|
| 2003 |
Chavez KL, Hess DW. Removal of Resist Materials Using Acetic Acid Journal of the Electrochemical Society. 150: G284. DOI: 10.1149/1.1557085 |
0.353 |
|
| 2002 |
Henderson CL, Barstow S, Jeyakumar A, McCoy K, Hess DW, Tolbert LM. Novel approaches to nanopatterning: From surface monolayer initiated polymerization to hybrid organometallic-organic bilayers Materials Research Society Symposium - Proceedings. 705: 3-14. DOI: 10.1557/Proc-705-Y2.6 |
0.355 |
|
| 2002 |
Li Y, Hess DW. Plasma etching of thick polynorbornene layers for electronic packaging applications Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 20: 2007. DOI: 10.1116/1.1506175 |
0.358 |
|
| 2002 |
Tanikella RV, Agraharam S, Allen SAB, Hess DW, Kohl PA. Moisture absorption studies of fluorocarbon films deposited from pentafluoroethane and octafluorocyclobutane plasmas Journal of Electronic Materials. 31: 1096-1103. DOI: 10.1007/S11664-002-0048-0 |
0.45 |
|
| 2001 |
Chavez KL, Hess DW. A Novel Method of Etching Copper Oxide Using Acetic Acid Journal of the Electrochemical Society. 148: G640. DOI: 10.1149/1.1409400 |
0.307 |
|
| 2001 |
Agraharam S, Hess DW, Kohl PA, Allen SAB. Electrical Properties and Temperature-Humidity Studies of Fluorocarbon Films Deposited from Pentafluoroethane/Argon Plasmas Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1366629 |
0.424 |
|
| 2001 |
Chavez KL, Bakker GL, Hess DW. Ion-implanted photoresist removal using water/carbon dioxide mixtures at elevated temperature and pressure Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 19: 2144. DOI: 10.1116/1.1415519 |
0.337 |
|
| 2001 |
Chen X, Tolbert LM, Henderson CL, Hess DW, Ruhe J. Polymer pattern formation on SiO2 surfaces using surface monolayer initiated polymerization Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 19: 2013-2019. DOI: 10.1116/1.1409391 |
0.388 |
|
| 2001 |
Agraharam S, Hess DW, Kohl PA, Bidstrup Allen SA. Comparison of plasma chemistries and structure-property relationships of fluorocarbon films deposited from octafluorocyclobutane and pentafluoroethane monomers Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 19: 439-446. DOI: 10.1116/1.1354980 |
0.427 |
|
| 2001 |
Chen X, Tolbert LM, Hess DW, Henderson C. A Bergman Cyclization Approach to Polymers for Thin-Film Lithography Macromolecules. 34: 4104-4108. DOI: 10.1021/Ma002071O |
0.343 |
|
| 2000 |
Kamal T, Hess DW. Photoresist Removal Using Low Molecular Weight Alcohols Journal of the Electrochemical Society. 147: 2749. DOI: 10.1149/1.1393600 |
0.358 |
|
| 2000 |
Agraharam S, Hess DW, Kohl PA, Bidstrup Allen SA. Thermal stability of fluorocarbon films deposited from pentafluoroethane/argon plasmas Journal of the Electrochemical Society. 147: 2665-2670. DOI: 10.1149/1.1393587 |
0.411 |
|
| 1999 |
Agraharam S, Hess DW, Kohl PA, Bidstrup Allen SA. Plasma chemistry in fluorocarbon film deposition from pentafluoroethane/argon mixtures Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 17: 3265-3271. DOI: 10.1116/1.582053 |
0.428 |
|
| 1998 |
Chen X, Tolbert LM, Ning ZY, Hess DW. Deposition and Etching of Amorphous Carbon Films Prepared by ECR-Plasma-Enhanced Benzene Chemical Vapor Deposition Mrs Proceedings. 555. DOI: 10.1557/Proc-555-315 |
0.453 |
|
| 1998 |
Kaluri SR, Hess DW. Nitrogen Incorporation in Thin Silicon Oxides in a N 2 O Plasma: Effects of Processing Conditions Journal of the Electrochemical Society. 145: 662-668. DOI: 10.1149/1.1838320 |
0.323 |
|
| 1998 |
Bakker GL, Hess DW. Surface Cleaning and Carbonaceous Film Removal Using High Pressure, High Temperature Water, and Water/ CO 2 Mixtures Journal of the Electrochemical Society. 145: 284-291. DOI: 10.1149/1.1838248 |
0.428 |
|
| 1997 |
Kaluri SR, Hess DW. Constant Current N 2 O Plasma Anodization of Silicon Journal of the Electrochemical Society. 144: 2200-2205. DOI: 10.1149/1.1837765 |
0.303 |
|
| 1996 |
Zhao Q, Lu HY, Hess DW. In Situ Infrared Studies of Polyvinyl Chloride Films Exposed to H 2 / O 2 / Ar Downstream Microwave Plasmas Journal of the Electrochemical Society. 143: 2896-2905. DOI: 10.1149/1.1837124 |
0.436 |
|
| 1996 |
Kaluri SR, Hess DW. Nitrogen incorporation in thin oxides by constant current N2O plasma anodization of silicon and N2 plasma nitridation of silicon oxides Applied Physics Letters. 69: 1053-1055. DOI: 10.1063/1.116928 |
0.312 |
|
| 1995 |
Bakker GL, Hess DW. Removal of Thermally Grown Silicon Dioxide Films Using Water at Elevated Temperature and Pressure Journal of the Electrochemical Society. 142: 3940-3944. DOI: 10.1149/1.2048438 |
0.444 |
|
| 1992 |
Bell SA, Hess DW. Radiation Damage to Thermal Silicon Dioxide Films in Radio Frequency and Microwave Downstream Photoresist Stripping Systems Journal of the Electrochemical Society. 139: 2904-2908. DOI: 10.1149/1.2069004 |
0.348 |
|
| 1992 |
Martz JC, Hess DW, Petersen EE. A generalized model of heat effects in surface reactions. II. Application to plasma etching reactions Journal of Applied Physics. 72: 3289-3293. DOI: 10.1063/1.351450 |
0.317 |
|
| 1992 |
Martz JC, Hess DW, Petersen EE. A generalized model of heat effects in surface reactions. I. Model development Journal of Applied Physics. 72: 3282-3288. DOI: 10.1063/1.351449 |
0.311 |
|
| 1990 |
Hess DW. Plasma material interactions Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 8: 1677-1684. DOI: 10.1116/1.576829 |
0.466 |
|
| 1989 |
Chiang JN, Hess DW. Plasma Deposited Silicon Nitride Film Chemistry Mrs Proceedings. 165. DOI: 10.1557/Proc-165-79 |
0.433 |
|
| 1988 |
Greene WM, Oldham WG, Hess DW. Comparison of low‐pressure and plasma‐enhanced chemical vapor deposited tungsten thin films Applied Physics Letters. 52: 1133-1135. DOI: 10.1063/1.99184 |
0.441 |
|
| 1988 |
Livengood RE, Petrich MA, Hess DW, Reimer JA. Structure and optical properties of plasma-deposited fluorinated silicon nitride thin films Journal of Applied Physics. 63: 2651-2659. DOI: 10.1063/1.341005 |
0.404 |
|
| 1984 |
Hess DW. Plasma‐enhanced CVD: Oxides, nitrides, transition metals, and transition metal silicides Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 2: 244-252. DOI: 10.1116/1.572734 |
0.397 |
|
| 1984 |
Flack WW, Soong DS, Bell AT, Hess DW. A mathematical model for spin coating of polymer resists Journal of Applied Physics. 56: 1199-1206. DOI: 10.1063/1.334049 |
0.36 |
|
| 1977 |
Hess DW. Effect of Chlorine on the Negative Bias Instability in MOS Structures Journal of the Electrochemical Society. 124: 740-743. DOI: 10.1149/1.2133397 |
0.307 |
|
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