Yu-Min Lee, Ph.D. - Publications
Affiliations: | 2003 | University of Wisconsin, Madison, Madison, WI |
Area:
Electronics and Electrical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2017 | Lee Y, Ho C. InTraSim: Incremental Transient Simulation of Power Grids Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 36: 2052-2065. DOI: 10.1109/Tcad.2017.2681082 | 0.386 | |||
2016 | Chiou H, Lee Y. Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs Journal of Computational Chemistry. 4: 33-45. DOI: 10.4236/Jcc.2016.415003 | 0.34 | |||
2015 | Lee YM, Pan CW, Huang PY, Yang CP. LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 34: 1250-1263. DOI: 10.1109/Tcad.2015.2401578 | 0.35 | |||
2009 | Huang PY, Lee YM. Full-Chip thermal analysis for the early design stage via generalized integral transforms Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 17: 613-626. DOI: 10.1109/Tvlsi.2008.2006043 | 0.399 | |||
2005 | Lee Y, Cao Y, Chen T, Wang JM, Chen CC-. HiPRIME: hierarchical and passivity preserved interconnect macromodeling engine for RLKC power delivery Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 24: 797-806. DOI: 10.1109/Tcad.2005.847938 | 0.438 | |||
2003 | Lee Y, Chen CC-. The power grid transient simulation in linear time based on 3-D alternating-direction-implicit method Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 22: 1545-1550. DOI: 10.1109/Tcad.2003.818373 | 0.445 | |||
2002 | Lee YM, Chen CCP. Power grid transient simulation in linear time based on transmission-line-modeling alternating-direction-implicit method Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 21: 1343-1352. DOI: 10.1109/Tcad.2002.804082 | 0.463 | |||
2002 | Lee Y, Chen CCP, Chang YW, Wong DF. Simultaneous Buffer-sizing and Wire-sizing for Clock Trees Based on Lagrangian Relaxation Vlsi Design. 15: 587-594. DOI: 10.1080/1065514021000012200 | 0.371 | |||
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