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Thomas P. Moffat - Publications

Affiliations: 
1989 Materials Science and Engineering Massachusetts Institute of Technology, Cambridge, MA, United States 
 1989-1991 University of Texas at Austin, Austin, Texas, U.S.A. 
 1991- Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, MD, United States 
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116 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2023 Moffat TP, Braun TM, Raciti D, Josell D. Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology. Accounts of Chemical Research. 56: 1004-1017. PMID 37076974 DOI: 10.1021/acs.accounts.2c00840  0.383
2021 Tackett BM, Raciti D, Hight Walker AR, Moffat TP. Surface Hydride Formation on Cu(111) and Its Decomposition to Form H in Acid Electrolytes. The Journal of Physical Chemistry Letters. 12: 10936-10941. PMID 34734717 DOI: 10.1021/acs.jpclett.1c03131  0.727
2020 Liu Y, You H, Kimmel YC, Esposito DV, Chen JG, Moffat TP. Self-terminating electrodeposition of Pt on WC electrocatalysts. Chemistry of Materials : a Publication of the American Chemical Society. 504. PMID 33311853 DOI: 10.1016/j.apsusc.2019.144472  0.44
2020 Groenenboom MC, Moffat TP, Schwarz KA. Halide-Induced Step Faceting and Dissolution Energetics from Atomistic Machine Learned Potentials on Cu(100) The Journal of Physical Chemistry C. 124: 12359-12369. DOI: 10.1021/Acs.Jpcc.0C00683  0.399
2020 Kim S, Lee H, Josell D, Moffat TP. Bottom-up Cu filling of annular through silicon vias: Microstructure and texture Electrochimica Acta. 335: 135612. DOI: 10.1016/J.Electacta.2020.135612  0.424
2020 Liu Y, You H, Kimmel YC, Esposito DV, Chen JG, Moffat TP. Self-terminating electrodeposition of Pt on WC electrocatalysts Applied Surface Science. 504: 144472. DOI: 10.1016/J.Apsusc.2019.144472  0.502
2019 Braun TM, Josell D, Silva M, Kildon J, Moffat TP. Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias Journal of the Electrochemical Society. 166: D3259-D3271. DOI: 10.1149/2.0341901Jes  0.361
2019 Braun TM, Josell D, John J, Moffat TP. Editors' Choice—Simulation of Copper Electrodeposition in Through-Hole Vias Journal of the Electrochemical Society. 167: 013510. DOI: 10.1149/2.0102001Jes  0.32
2018 Liu GK, Zou S, Josell D, Richter LJ, Moffat TP. SEIRAS Study of Chloride-Mediated Polyether Adsorption on Cu. The Journal of Physical Chemistry. C, Nanomaterials and Interfaces. 122. PMID 33042324 DOI: 10.1021/Acs.Jpcc.8B06644  0.42
2018 Ritzert NL, Szalai VA, Moffat TP. Mapping Electron Transfer at MoS using Scanning Electrochemical Microscopy. Langmuir : the Acs Journal of Surfaces and Colloids. PMID 30372618 DOI: 10.1021/Acs.Langmuir.8B02731  0.321
2018 Braun TM, Kim S, Lee H, Moffat TP, Josell D. Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction Journal of the Electrochemical Society. 165: D291-D300. DOI: 10.1149/2.0911807Jes  0.307
2018 Josell D, Moffat TP. Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown Journal of the Electrochemical Society. 165: D23-D30. DOI: 10.1149/2.0061802Jes  0.375
2018 Sun K, Ritzert N, John J, Tan H, Hale WG, Jiang J, Moreno-Hernandez I, Papadantonakis KM, Moffat TP, Brunschwig BS, Lewis NS. Performance and failure modes of Si anodes patterned with thin-film Ni catalyst islands for water oxidation Sustainable Energy & Fuels. 2: 983-998. DOI: 10.1039/C7Se00583K  0.354
2017 Josell D, Moffat TP. Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias. Journal of the Electrochemical Society. 164: D327-D334. PMID 28729743 DOI: 10.1149/2.1311706Jes  0.415
2016 Josell D, Moffat TP. Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias. Ecs Transactions. 163: D322-D331. PMID 29503673 DOI: 10.1149/2.1151607jes  0.302
2016 Josell D, Silva M, Moffat TP. Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias. Ecs Transactions. 75: 25-30. PMID 28690759 DOI: 10.1149/2.0861614Jes  0.395
2016 Ritzert NL, Moffat TP. Ultramicroelectrode Studies of Self-Terminated Nickel Electrodeposition and Nickel Hydroxide Formation upon Water Reduction. The Journal of Physical Chemistry. C, Nanomaterials and Interfaces. 120: 27478-27489. PMID 28217241 DOI: 10.1021/Acs.Jpcc.6B10006  0.386
2016 Labrador NY, Li X, Liu Y, Tan H, Wang R, Koberstein JT, Moffat TP, Esposito DV. Enhanced Performance of Si MIS Photocathodes Containing Oxide-Coated Nanoparticle Electrocatalysts. Nano Letters. PMID 27635659 DOI: 10.1021/Acs.Nanolett.6B02909  0.36
2016 Josell D, Moffat TP. Superconformal Bottom-up Nickel Deposition in High Aspect Ratio through Silicon Vias Ecs Transactions. 75: 19-24. DOI: 10.1149/2.1151607Jes  0.334
2016 Wang R, Bertocci U, Tan H, Bendersky LA, Moffat TP. Self-Terminated Electrodeposition of Ni, Co, and Fe Ultrathin Films The Journal of Physical Chemistry C. 120: 16228-16237. DOI: 10.1021/Acs.Jpcc.6B01901  0.396
2015 Schwarz KA, Sundararaman R, Moffat TP, Allison TC. Formic acid oxidation on platinum: a simple mechanistic study. Physical Chemistry Chemical Physics : Pccp. 17: 20805-13. PMID 26214401 DOI: 10.1039/C5Cp03045E  0.352
2015 Josell D, Levin I, Moffat TP. Morphological Transitions during Au Electrodeposition: From Porous Films to Compact Films and Nanowires Journal of the Electrochemical Society. 162. DOI: 10.1149/2.0221512Jes  0.335
2015 Ahn SH, Tan H, Haensch M, Liu Y, Bendersky LA, Moffat TP. Self-terminated electrodeposition of iridium electrocatalysts Energy & Environmental Science. 8: 3557-3562. DOI: 10.1039/C5Ee02541A  0.403
2015 Ahn SH, Liu Y, Moffat TP. Ultrathin Platinum Films for Methanol and Formic Acid Oxidation: Activity as a Function of Film Thickness and Coverage Acs Catalysis. 5: 2124-2136. DOI: 10.1021/Cs501228J  0.41
2015 Liu Y, Hangarter CM, Garcia D, Moffat TP. Self-terminating electrodeposition of ultrathin Pt films on Ni: An active, low-cost electrode for H2 production Surface Science. 631: 141-154. DOI: 10.1016/J.Susc.2014.06.002  0.452
2014 Josell D, Moffat TP. Superconformal Cu Electrodeposition from Cu(II)-EDTA Complexed Alkaline Electrolyte Journal of the Electrochemical Society. 161: D558-D563. DOI: 10.1149/2.0961410Jes  0.369
2014 Josell D, Moffat TP. Superconformal Copper Electrodeposition in Complexed Alkaline Electrolyte Journal of the Electrochemical Society. 161: D287-D292. DOI: 10.1149/2.074405Jes  0.321
2014 Hangarter CM, Liu Y, Pagonis D, Bertocci U, Moffat TP. Electrodeposition of ternary Pt100-Cx-CyCoxNi y alloys Journal of the Electrochemical Society. 161. DOI: 10.1149/2.022401Jes  0.406
2013 Esposito DV, Levin I, Moffat TP, Talin AA. H2 evolution at Si-based metal-insulator-semiconductor photoelectrodes enhanced by inversion channel charge collection and H spillover. Nature Materials. 12: 562-8. PMID 23644521 DOI: 10.1038/Nmat3626  0.316
2013 Wheeler D, Moffat TP, Josell D. Spatial-temporal modeling of extreme bottom-up filling of through-silicon-vias Journal of the Electrochemical Society. 160: D3260-D3265. DOI: 10.1149/2.040312Jes  0.384
2013 Josell D, Moffat TP. Superfilling Damascene Trenches with Gold in a Sulfite Electrolyte Journal of the Electrochemical Society. 160: D3009-D3014. DOI: 10.1149/2.003312Jes  0.315
2012 Liu Y, Gokcen D, Bertocci U, Moffat TP. Self-terminating growth of platinum films by electrochemical deposition. Science (New York, N.Y.). 338: 1327-30. PMID 23224552 DOI: 10.1126/science.1228925  0.332
2012 Josell D, Wheeler D, Moffat TP. Modeling extreme bottom-up filling of through silicon vias Journal of the Electrochemical Society. 159: D570-D576. DOI: 10.1149/2.009210Jes  0.422
2012 Liu Y, Hangarter CM, Bertocci U, Moffat TP. Oxygen reduction reaction on electrodeposited Pt 100-xNi x: Influence of alloy composition and dealloying Journal of Physical Chemistry C. 116: 7848-7862. DOI: 10.1021/Jp300672H  0.404
2011 Hwang S, Bonevich JE, Kim JJ, Moffat TP. Formic Acid Oxidation on Pt100−xPbx Thin Films Electrodeposited on Au Journal of the Electrochemical Society. 158: B1019. DOI: 10.1149/1.3599913  0.6
2011 Lee CH, Bonevich JE, Bertocci U, Steffens KL, Moffat TP. Superconformal Ni electrodeposition using 2-mercaptobenzimidazole Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3572055  0.46
2011 Hwang S, Bonevich JE, Kim JJ, Moffat TP. Electrodeposition of Pt100−xPbx Metastable Alloys and Intermetallics Journal of the Electrochemical Society. 158: D307. DOI: 10.1149/1.3572049  0.6
2011 Brennan RG, Phillips MM, Yang LYO, Moffat TP. Characterization and purification of commercial SPS and MPS by ion chromatography and mass spectrometry Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3537819  0.327
2010 Hwang S, Lee CH, Kim JJ, Moffat TP. Oxygen reduction reaction on electrodeposited Pt100−x−yNixPdy thin films Electrochimica Acta. 55: 8938-8946. DOI: 10.1016/J.Electacta.2010.08.013  0.584
2010 Lee CH, Moffat TP. A modified Damascene electrodeposition process for bottom-up filling of recessed surface features Electrochimica Acta. 55: 8527-8531. DOI: 10.1016/J.Electacta.2010.07.045  0.443
2010 Moffat TP, Josell D. Superconformal Electrodeposition for 3-Dimensional Interconnects Israel Journal of Chemistry. 50: 312-320. DOI: 10.1002/Ijch.201000029  0.432
2009 Mallett JJ, Bertocci U, Bonevich JE, Moffat TP. Compositional Control in Electrodeposited Pt[sub 100−x]Cu[sub x] Alloys Journal of the Electrochemical Society. 156: D531. DOI: 10.1149/1.3232216  0.446
2009 Josell D, Beauchamp CR, Jung S, Hamadani BH, Motayed A, Richter LJ, Williams M, Bonevich JE, Shapiro A, Zhitenev N, Moffat TP. Three dimensionally structured CdTe thin-film photovoltaic devices with self-aligned back-contacts: Electrodeposition on interdigitated electrodes Journal of the Electrochemical Society. 156: H654-H660. DOI: 10.1149/1.3148182  0.368
2009 Lee CH, Bonevich JE, Davies JE, Moffat TP. Superconformal Electrodeposition of Co and Co–Fe Alloys Using 2-Mercapto-5-benzimidazolesulfonic Acid Journal of the Electrochemical Society. 156: D301. DOI: 10.1149/1.3142427  0.383
2008 Moffat TP, Wheeler D, Josell D. Superconformal deposition and the CEAC mechanism Ecs Transactions. 13: 129-137. DOI: 10.1149/1.2908625  0.307
2008 Lee CH, Bonevich JE, Davies JE, Moffat TP. Magnetic Materials for Three-Dimensional Damascene Metallization: Void-Free Electrodeposition of Ni and Ni[sub 70]Fe[sub 30] Using 2-Mercapto-5-benzimidazolesulfonic Acid Journal of the Electrochemical Society. 155: D499. DOI: 10.1149/1.2907433  0.381
2008 Mallett JJ, Svedberg EB, Bonevich JE, Shapiro AJ, Egelhoff WF, Moffat TP. Compositional control in electrodeposited Nix Pt1-x Films Journal of the Electrochemical Society. 155: D1-D9. DOI: 10.1149/1.2799072  0.335
2007 Kim S, Bonevich JE, Josell D, Moffat TP. Electrodeposition of Ni in Submicrometer Trenches Journal of the Electrochemical Society. 154: D443. DOI: 10.1149/1.2749188  0.428
2007 Walker ML, Richter LJ, Moffat TP. Potential dependence of competitive adsorption of PEG, Cl-, and SPS/MPS on Cu Journal of the Electrochemical Society. 154: D277-D282. DOI: 10.1149/1.2710200  0.353
2007 Josell D, Moffat TP, Wheeler D. Superfilling when adsorbed accelerators are mobile Journal of the Electrochemical Society. 154: D208-D214. DOI: 10.1149/1.2434684  0.361
2007 Mallett JJ, Svedberg EB, Vaudin MD, Bendersky LA, Shapiro AJ, Egelhoff WF, Moffat TP. Electrodeposited epitaxialFe100−xCoxfilms onn−GaAs(100) Physical Review B. 75. DOI: 10.1103/Physrevb.75.085304  0.376
2007 Wu GY, Bae SE, Gewirth AA, Gray J, Zhu XD, Moffat TP, Schwarzacher W. Pb electrodeposition on polycrystalline Cu in the presence and absence of Cl-: A combined oblique incidence reflectivity difference and in situ AFM study Surface Science. 601: 1886-1891. DOI: 10.1016/J.Susc.2007.02.016  0.607
2007 Moffat TP, Wheeler D, Kim SK, Josell D. Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing Electrochimica Acta. 53: 145-154. DOI: 10.1016/J.Electacta.2007.03.025  0.357
2006 Kim S, Josell D, Moffat TP. Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling Journal of the Electrochemical Society. 153: C826. DOI: 10.1149/1.2354456  0.422
2006 Svedberg EB, Mallett JJ, Bendersky LA, Roy AG, Egelhoff WF, Moffat TP. A Structural Study of Electrodeposited Fe on n-GaAs(001) Journal of the Electrochemical Society. 153: C807. DOI: 10.1149/1.2353782  0.346
2006 Kim S, Josell D, Moffat TP. Electrodeposition of Cu in the PEI-PEG-Cl-SPS Additive System Journal of the Electrochemical Society. 153: C616. DOI: 10.1149/1.2216356  0.363
2006 Walker ML, Richter LJ, Moffat TP. Competitive adsorption of PEG, Cl -, and SPS/MPS on Cu: An in situ ellipsometric study Journal of the Electrochemical Society. 153: C557-C561. DOI: 10.1149/1.2206999  0.402
2006 Josell D, Witt C, Moffat TP. Erratum: Osmium Barriers for Direct Copper Electrodeposition in Damascene Processing [Electrochem. Solid-State Lett., 9, C41 (2006)] Electrochemical and Solid-State Letters. 9: L3. DOI: 10.1149/1.2179769  0.312
2006 Walker ML, Richter LJ, Josell D, Moffat TP. An in situ ellipsometric study of Cl- -Induced adsorption of PEG on Ru and on underpotential deposited Cu on Ru Journal of the Electrochemical Society. 153: C235-C241. DOI: 10.1149/1.2170587  0.442
2006 Moffat TP, Wheeler D, Kim SK, Josell D. Curvature enhanced adsorbate coverage model for electrodeposition Journal of the Electrochemical Society. 153: C127-C132. DOI: 10.1149/1.2165580  0.374
2006 Moffat TP, Walker M, Chen PJ, Bonevich JE, Egelhoff WF, Richter L, Witt C, Aaltonen T, Ritala M, Leskelä M, Josell D. Erratum: Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing [J. Electrochem. Soc., 153, C37 (2005)] Journal of the Electrochemical Society. 153: L5. DOI: 10.1149/1.2162179  0.363
2006 Josell D, Witt C, Moffat TP. Osmium Barriers for Direct Copper Electrodeposition in Damascene Processing Electrochemical and Solid-State Letters. 9: C41-C43. DOI: 10.1149/1.2149214  0.372
2006 Moffat TP, Walker M, Chen PJ, Bonevich JE, Egelhoff WF, Richter L, Witt C, Aaltonen T, Ritala M, Leskelä M, Josell D. Electrodeposition of Cu on Ru barrier layers for damascene processing Journal of the Electrochemical Society. 153: C37-C50. DOI: 10.1149/1.2131826  0.471
2006 Josell D, Wheeler D, Moffat TP. Gold superfill in submicrometer trenches: Experiment and prediction Journal of the Electrochemical Society. 153: C11-C18. DOI: 10.1149/1.2128765  0.397
2005 Walker ML, Richter LJ, Moffat TP. In situ ellipsometric study of PEG/Cl- coadsorption on Cu, Ag, and Au Journal of the Electrochemical Society. 152: C403-C407. DOI: 10.1149/1.1915271  0.431
2005 Josell D, Beauchamp CR, Kelley DR, Witt CA, Moffat TP. Gold superfill in sub-micrometer trenches Electrochemical and Solid-State Letters. 8. DOI: 10.1149/1.1854777  0.346
2005 Mallett JJ, Svedberg EB, Sayan S, Shapiro AJ, Wielunski L, Madey TE, Chen PJ, Egelhoff WF, Moffat TP. Compositional control in electrodeposited CoxPt1-x films Electrochemical and Solid-State Letters. 8: C15-C18. DOI: 10.1149/1.1833651  0.382
2005 Moffat TP, Wheeler D, Edelstein MD, Josell D. Superconformal film growth: Mechanism and quantification Ibm Journal of Research and Development. 49: 19-36. DOI: 10.1147/Rd.491.0019  0.401
2005 Maranville BB, Mallett J, Moffat TP, McMichael RD, Chen AP, Egelhoff WF. Effect of conformal roughness on ferromagnetic resonance linewidth in thin Permalloy films Journal of Applied Physics. 97. DOI: 10.1063/1.1860271  0.319
2004 Mallett JJ, Svedberg EB, Sayan S, Shapiro AJ, Wielunski L, Madey TE, Egelhoff WF, Moffat TP. Compositional control in electrodeposition of FePt films Electrochemical and Solid-State Letters. 7: C121-C124. DOI: 10.1149/1.1792251  0.351
2004 Wheeler D, Moffat TP, McFadden GB, Coriell S, Josell D. Influence of a catalytic surfactant on roughness evolution during film growth Journal of the Electrochemical Society. 151: C538-C544. DOI: 10.1149/1.1767351  0.381
2004 Moffat TP, Wheeler D, Josell D. Electrodeposition of Copper in the SPS-PEG-CL Additive System I. Kinetic Measurements: Influence of SPS Journal of the Electrochemical Society. 151: C262-C271. DOI: 10.1149/1.1651530  0.434
2004 Josell D, Moffat TP, Wheeler D. An exact algebraic solution for the incubation period of superfill Journal of the Electrochemical Society. 151: C19-C24. DOI: 10.1149/1.1626672  0.353
2004 Mallett J, Svedberg E, Ettedgui H, Moffat T, Egelhoff W. Absence of ballistic magnetoresistance in Ni contacts controlled by an electrochemical feedback system Physical Review B. 70. DOI: 10.1103/Physrevb.70.172406  0.306
2004 Svedberg EB, Mallett JJ, Sayan S, Shapiro AJ, Egelhoff WF, Moffat T. Recrystallization texture, epitaxy, and magnetic properties of electrodeposited FePt on Cu(001) Applied Physics Letters. 85: 1353-1355. DOI: 10.1063/1.1784525  0.396
2004 Josell D, Burkhard C, Li Y, Cheng YW, Keller RR, Witt CA, Kelley DR, Bonevich JE, Baker BC, Moffat TP. Electrical properties of superfilled sub-micrometer silver metallizations Journal of Applied Physics. 96: 759-768. DOI: 10.1063/1.1757655  0.319
2004 Egelhoff WF, Gan L, Ettedgui H, Kadmon Y, Powell CJ, Chen PJ, Shapiro AJ, McMichael RD, Mallett JJ, Moffat TP, Stiles MD, Svedberg EB. Artifacts in ballistic magnetoresistance measurements (invited) Journal of Applied Physics. 95: 7554-7559. DOI: 10.1063/1.1688533  0.312
2004 Svedberg EB, Mallett JJ, Ettedgui H, Gan L, Chen PJ, Shapiro AJ, Moffat TP, Egelhoff WF. Resistance changes similar to ballistic magnetoresistance in electrodeposited nanocontacts Applied Physics Letters. 84: 236-238. DOI: 10.1063/1.1639147  0.301
2003 Ford A, Bonevich JE, McMichael RD, Vaudin M, Moffat TP. Structure and Magnetic Anisotropy of Electrodeposited Co on n-GaAs(001) Journal of the Electrochemical Society. 150. DOI: 10.1149/1.1611491  0.338
2003 Josell D, Wheeler D, Witt C, Moffat TP. Seedless superfill: Copper electrodepositon in trenches with ruthenium barriers Electrochemical and Solid-State Letters. 6: C143-C145. DOI: 10.1149/1.1605271  0.401
2003 McFadden GB, Coriell SR, Moffat TP, Josell D, Wheeler D, Schwarzacher W, Mallett J. A Mechanism for Brightening: Linear Stability Analysis of the Curvature-Enhanced Coverage Model Journal of the Electrochemical Society. 150: C591-C599. DOI: 10.1149/1.1593042  0.373
2003 Josell D, Kim S, Wheeler D, Moffat TP, Pyo SG. Interconnect fabrication by superconformal iodine-catalyzed chemical vapor deposition of copper Journal of the Electrochemical Society. 150: C368-C373. DOI: 10.1149/1.1566960  0.424
2003 Wheeler D, Josell D, Moffat TP. Modeling superconformal electrodeposition using the level set method Journal of the Electrochemical Society. 150: C302-C310. DOI: 10.1149/1.1562598  0.382
2003 Baker BC, Witt C, Wheeler D, Josell D, Moffat TP. Superconformal silver deposition using KSeCN derivatized substrates Electrochemical and Solid-State Letters. 6: C67-C69. DOI: 10.1149/1.1561280  0.387
2003 Moffat TP, Baker B, Wheeler D, Josell D. Accelerator aging effects during copper electrodeposition Electrochemical and Solid-State Letters. 6: C59-C62. DOI: 10.1149/1.1553936  0.417
2003 Baker BC, Freeman M, Melnick B, Wheeler D, Josell D, Moffat TP. Superconformal electrodeposition of silver from a KAg(CN)2-KCN-KSeCN electrolyte Journal of the Electrochemical Society. 150: C61-C66. DOI: 10.1149/1.1531195  0.351
2003 Pyo SG, Kim S, Wheeler D, Moffat TP, Josell D. Seam-free fabrication of submicrometer copper interconnects by iodine-catalyzed chemical vapor deposition Journal of Applied Physics. 93: 1257-1261. DOI: 10.1063/1.1532931  0.416
2002 Moffat TP, Wheeler D, Witt C, Josell D. Superconformal electrodeposition using derivitized substrates Electrochemical and Solid-State Letters. 5: C110-C112. DOI: 10.1149/1.1521290  0.391
2002 Josell D, Baker B, Witt C, Wheeler D, Moffat TP. Via filling by electrodeposition superconformal silver and copper and conformal nickel Journal of the Electrochemical Society. 149: C637-C641. DOI: 10.1149/1.1517583  0.39
2002 Shima M, Salamanca-Riba L, McMichael RD, Moffat TP. Magnetic properties of ultrathin laminated Co/Cu films prepared by electrodeposition Journal of the Electrochemical Society. 149. DOI: 10.1149/1.1494826  0.408
2002 Moffat TP, Baker B, Wheeler D, Bonevich JE, Edelstein M, Kelly DR, Gan L, Stafford GR, Chen PJ, Egelhoff WF, Josell D. Superconformal electrodeposition of silver in submicrometer features Journal of the Electrochemical Society. 149: C423-C428. DOI: 10.1149/1.1490357  0.444
2002 Josell D, Wheeler D, Moffat TP. Superconformal electrodeposition in vias Electrochemical and Solid-State Letters. 5: C49-C52. DOI: 10.1149/1.1452485  0.37
2002 Josell D, Wheeler D, Moffat TP. Superconformal deposition by surfactant-catalyzed chemical vapor deposition Electrochemical and Solid-State Letters. 5: C44-C47. DOI: 10.1149/1.1449304  0.456
2001 Josell D, Wheeler D, Huber WH, Moffat TP. Superconformal electrodeposition in submicron features. Physical Review Letters. 87: 016102. PMID 11461478 DOI: 10.1103/Physrevlett.87.016102  0.391
2001 Moffat TP, Wheeler D, Huber WH, Josell D. Superconformal Electrodeposition of Copper [Electrochemical and Solid-State Letters, 4, C26 (2001)] Electrochemical and Solid-State Letters. 4: L5. DOI: 10.1149/1.1395511  0.302
2001 Shima M, Salamanca-Riba LG, McMichael RD, Moffat TP. Correlation between Structural Imperfection and Giant Magnetoresistance in Electrodeposited Co/Cu Multilayers Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1379948  0.412
2001 Moffat TP, Wheeler D, Huber WH, Josell D. Superconformal electrodeposition of copper Electrochemical and Solid-State Letters. 4: C26-C29. DOI: 10.1149/1.1354496  0.419
2001 Stafford G, Moffat T, Jovic V, Kelley D, Bonevich J, Josell D, Vaudin M, Armstrong N, Huber W, Stanishevsky A. Cu electrodeposition for on-chip interconnections Characterization and Metrology For Ulsi Technology. 550: 402-406. DOI: 10.1063/1.1354432  0.45
2000 Moffat TP, Bonevich JE, Huber WH, Stanishevsky A, Kelly DR, Stafford GR, Josell D. Superconformal electrodeposition of copper in 500-90 nm features Journal of the Electrochemical Society. 147: 4524-4535. DOI: 10.1149/1.1394096  0.427
1999 Shima M, Salamanca-Riba L, Moffat TP. Dissolution dynamics of artificially structured materials Electrochemical and Solid-State Letters. 2: 271-274. DOI: 10.1149/1.1390808  0.404
1999 Nikitenko VI, Gornakov VS, Dedukh LM, Khapikov AF, Moffat TP, Shapiro AJ, Shull RD, Shima M, Salamanca-Riba L. Direct experimental study of the microscopic remagnetization mechanism in Co/Cu magnetic superlattices Journal of Magnetism and Magnetic Materials. 198: 477-479. DOI: 10.1016/S0304-8853(98)01151-2  0.378
1999 Shima M, Salamanca-Riba L, Moffat TP, McMichael RD. Structural and magnetic properties of electrodeposited Co/Cu multilayers Journal of Magnetism and Magnetic Materials. 198: 52-54. DOI: 10.1016/S0304-8853(98)00616-7  0.377
1998 Shima M, Salamanca-Riba L, Moffat TP, McMichael RD, Swartzendruber LJ. Structural and magnetic fourfold symmetry of Co/Cu multilayers electrodeposited on Si(001) substrates Journal of Applied Physics. 84: 1504-1507. DOI: 10.1063/1.368254  0.387
1996 Moffat TP. Stm Study of the Influence of Adsorption on Step Dynamics Mrs Proceedings. 451. DOI: 10.1557/PROC-451-75  0.341
1996 Moffat TP. Electrodeposition of Strained-Layer Superlattices Mrs Proceedings. 451. DOI: 10.1557/PROC-451-413  0.359
1995 Moffat TP. An in Situ Stm Study of Cu and Ni Electrodeposition Mrs Proceedings. 404. DOI: 10.1557/Proc-404-3  0.456
1995 Moffat TP, Yang H. Patterned Metal Electrodeposition Using an Alkanethiolate Mask Journal of the Electrochemical Society. 142: L220-L222. DOI: 10.1149/1.2048452  0.386
1995 Moffat TP. Electrochemical Production of Single‐Crystal Cu‐Ni Strained‐Layer Superlattices on Cu(100) Journal of the Electrochemical Society. 142: 3767-3770. DOI: 10.1149/1.2048411  0.399
1995 Moffat T, Latanision R, Ruf R. An X-ray photoelectron spectroscopy study of chromium-metalloid alloys—III Electrochimica Acta. 40: 1723-1734. DOI: 10.1016/0013-4686(95)00015-7  0.394
1994 Moffat TP. Electrodeposition of Ni1 − x Al x in a Chloroaluminate Melt Journal of the Electrochemical Society. 141: 3059-3070. DOI: 10.1149/1.2059279  0.398
1994 Yau SL, Fan FRF, Moffat TP, Bard AJ. In situ Scanning Tunneling Microscopy of Ni(100) in 1 M NaOH The Journal of Physical Chemistry. 98: 5493-5499. DOI: 10.1021/J100072A016  0.348
1992 Moffat TP, Latanision RM. An Electrochemical and X‐Ray Photoelectron Spectroscopy Study of the Passive State of Chromium Journal of the Electrochemical Society. 139: 1869-1879. DOI: 10.1149/1.2069514  0.366
1992 Moffat TP, Yang H, Fan FF, Bard AJ. Electron‐Transfer Reactions on Passive Chromium Journal of the Electrochemical Society. 139: 3158-3167. DOI: 10.1149/1.2069049  0.451
1992 Yau S, Moffat TP, Bard AJ, Zhang Z, Lerner MM. STM of the (010) surface of orthorhombic phosphorus Chemical Physics Letters. 198: 383-388. DOI: 10.1016/0009-2614(92)85069-M  0.364
1991 Moffat TP, Fan FF, Bard AJ. Electrochemical and Scanning Tunneling Microscopic Study of Dealloying of Cu3Au Journal of the Electrochemical Society. 138: 3224-3235. DOI: 10.1149/1.2085396  0.526
1987 Moffat TP, Flanagan WF, Lichter BD. Effects of Alloy Chemistry on the Corrosion of FeNi Metal-Metalloid Metallic Glasses Corrosion. 43: 589-593. DOI: 10.5006/1.3583834  0.309
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