Yongsug Tak - Publications
Affiliations: | 1993 | Chemical Engineering | Iowa State University, Ames, IA, United States |
| 1994- | Chemical Engineering | Inha University, Incheon, South Korea |
Website:
http://mecl.inha.ac.kr/| Year | Citation | Score | |||
|---|---|---|---|---|---|
| 2011 | Shim S, Hong SH, Tak Y, Yoon J. Prevention of Pseudomonas aeruginosa adhesion by electric currents. Biofouling. 27: 217-24. PMID 21279861 DOI: 10.1080/08927014.2011.554831 | 0.347 | |||
| 2008 | Jung H, Hong C, Kil J, Kim J, Kim B, Tak Y. Pulse electrodeposition of Ni-W alloy for trench filling in microelectromechanical systems. Journal of Nanoscience and Nanotechnology. 8: 5321-5. PMID 19198447 DOI: 10.1166/jnn.2008.1189 | 0.37 | |||
| 2007 | Ko E, Choi J, Okamoto K, Tak Y, Lee J. Cu(2)O nanowires in an alumina template: electrochemical conditions for the synthesis and photoluminescence characteristics. Chemphyschem : a European Journal of Chemical Physics and Physical Chemistry. 7: 1505-9. PMID 16733843 DOI: 10.1002/Cphc.200600060 | 0.507 | |||
| 2000 | Tak Y, Sinha N, Hebert KR. Metal dissolution kinetics in aluminum etch tunnels Journal of the Electrochemical Society. 147: 4103-4110. DOI: 10.1149/1.1394026 | 0.599 | |||
| 1994 | Hebert KR, Tak Y. Initial Events During the Passivation of Rapidly Dissolving Aluminum Surfaces Journal of the Electrochemical Society. 141: 1453-1459. DOI: 10.1149/1.2054945 | 0.587 | |||
| 1994 | Tak Y. Evolution of Microscopic Surface Topography during Passivation of Aluminum Journal of the Electrochemical Society. 141: 1446. DOI: 10.1149/1.2054944 | 0.52 | |||
| 1991 | Wiersma BJ, Tak Y, Hebert KR. Passivation of Surfaces within Aluminum Etch Tunnels Journal of the Electrochemical Society. 138: 371-379. DOI: 10.1149/1.2085592 | 0.609 | |||
| Show low-probability matches. | |||||