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Taigon Song - Publications

Affiliations: 
2015 Georgia Institute of Technology, Atlanta, GA 
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11 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2017 Jung M, Song T, Peng Y, Lim SK. Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning Ieee Transactions On Very Large Scale Integration Systems. 25: 2109-2117. DOI: 10.1109/Tvlsi.2017.2670508  0.776
2017 Peng Y, Song T, Petranovic D, Lim SK. Parasitic Extraction for Heterogeneous Face-to-Face Bonded 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 912-924. DOI: 10.1109/Tcpmt.2017.2677963  0.755
2015 Song T, Lim SK. Full-Chip Power/Performance Benefits of Carbon Nanotube-Based Circuits Journal of Information and Communication Convergence Engineering. 13: 180-188. DOI: 10.6109/Jicce.2015.13.3.180  0.394
2015 Song T, Lim SK. Die-to-Die Parasitic Extraction Targeting Face-to-Face Bonded 3D ICs Journal of Information and Communication Convergence Engineering. 13: 172-179. DOI: 10.6109/Jicce.2015.13.3.172  0.461
2015 Song T, Liu C, Peng Y, Lim SK. Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. DOI: 10.1109/Tvlsi.2015.2471098  0.751
2015 Jung M, Song T, Peng Y, Lim SK. Fine-Grained 3-D IC Partitioning Study With a Multicore Processor Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2470124  0.725
2015 Kim DH, Athikulwongse K, Healy MB, Hossain MM, Jung M, Khorosh I, Kumar G, Lee YJ, Lewis DL, Lin TW, Liu C, Panth S, Pathak M, Ren M, Shen G, ... Song T, et al. Design and analysis of 3D-MAPS (3D Massively parallel processor with stacked memory) Ieee Transactions On Computers. 64: 112-125. DOI: 10.1109/Tc.2013.192  0.543
2014 Peng Y, Song T, Petranovic D, Lim SK. Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 33: 1900-1913. DOI: 10.1109/Tcad.2014.2359578  0.748
2011 Cho J, Song E, Yoon K, Pak JS, Kim J, Lee W, Song T, Kim K, Lee J, Lee H, Park K, Yang S, Suh M, Byun K, Kim J. Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 220-233. DOI: 10.1109/Tcpmt.2010.2101892  0.473
2011 Kim J, Pak JS, Cho J, Song E, Kim H, Song T, Lee J, Lee H, Park K, Yang S, Suh MS, Byun KY. High-frequency scalable electrical model and analysis of a through silicon via (TSV) Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 181-195. DOI: 10.1109/Tcpmt.2010.2101890  0.374
2011 Pak JS, Kim J, Cho J, Kim K, Song T, Ahn S, Lee J, Lee H, Park K, Kim J. PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 208-219. DOI: 10.1109/Tcpmt.2010.2101771  0.462
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