Year |
Citation |
Score |
2022 |
Alamri A, Wu C, Nasreen S, Tran H, Yassin O, Gentile R, Kamal D, Ramprasad R, Cao Y, Sotzing G. High dielectric constant and high breakdown strength polyimide tin complexation of the polyamide acid precursor. Rsc Advances. 12: 9095-9100. PMID 35424840 DOI: 10.1039/d1ra06302b |
0.554 |
|
2021 |
Linker T, Wang Y, Mishra A, Kamal D, Cao Y, Kalia RK, Nakano A, Ramprasad R, Shimojo F, Sotzing G, Vashishta P. Deep Well Trapping of Hot Carriers in a Hexagonal Boron Nitride Coating of Polymer Dielectrics. Acs Applied Materials & Interfaces. PMID 34890506 DOI: 10.1021/acsami.1c14587 |
0.581 |
|
2021 |
Wang Y, Nasreen S, Kamal D, Li Z, Wu C, Huo J, Chen L, Ramprasad R, Cao Y. Tuning Surface States of Metal/Polymer Contacts Toward Highly Insulating Polymer-Based Dielectrics. Acs Applied Materials & Interfaces. PMID 34520160 DOI: 10.1021/acsami.1c12854 |
0.578 |
|
2021 |
Wu C, Chen L, Deshmukh A, Kamal D, Li Z, Shetty P, Zhou J, Sahu H, Tran H, Sotzing G, Ramprasad R, Cao Y. Dielectric Polymers Tolerant to Electric Field and Temperature Extremes: Integration of Phenomenology, Informatics, and Experimental Validation. Acs Applied Materials & Interfaces. PMID 34436852 DOI: 10.1021/acsami.1c11885 |
0.602 |
|
2021 |
Kamal D, Tran H, Kim C, Wang Y, Chen L, Cao Y, Joseph VR, Ramprasad R. Novel high voltage polymer insulators using computational and data-driven techniques. The Journal of Chemical Physics. 154: 174906. PMID 34241081 DOI: 10.1063/5.0044306 |
0.601 |
|
2020 |
Kamal D, Wang Y, Tran HD, Chen L, Li Z, Wu C, Nasreen S, Cao Y, Ramprasad R. Computable Bulk and Interfacial Electronic Structure Features as Proxies for Dielectric Breakdown of Polymers. Acs Applied Materials & Interfaces. PMID 32705867 DOI: 10.1021/Acsami.0C09555 |
0.62 |
|
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