☰

Anis B. Zribi, Ph.D. - Publications

Affiliations: 
2002 State University of New York at Binghamton, Vestal, NY, United States 
Area:
Materials Science Engineering, Condensed Matter Physics, Physical Chemistry
Tree Info Similar researchers PubMed Report error

5 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2002 Zavalij L, Zribi A, Chromik RR, Pitely S, Zavalij PY, Cotts EJ. Crystal structure of Au1-xNixSn4 intermetallic alloys Journal of Alloys and Compounds. 334: 79-85. DOI: 10.1016/S0925-8388(01)01780-7  0.593
2002 Zribi A, Kinyanjui R, Borgesen P, Zavalij L, Cotts EJ. Aspects of the structural evolution of lead-free solder joints Jom. 54: 38-40. DOI: 10.1007/Bf02701848  0.703
2001 Zribi A, Borgesen P, Zavalij L, Cotts EJ. Growth of Cu-Ni-Sn alloys in Pb free CuSnAg solder/Au-Ni metallization reactions Materials Research Society Symposium - Proceedings. 652. DOI: 10.1557/Proc-652-Y8.10  0.717
2001 Zribi A, Clark A, Zavalij L, Borgesen P, Cotts EJ. The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure Journal of Electronic Materials. 30: 1157-1164. DOI: 10.1007/S11664-001-0144-6  0.679
1999 Zribi A, Chromik RR, Presthus R, Clum J, Teed K, Zavalij L, De Vita J, Tova J, Cotts EJ. Solder metalization interdiffusion in microelectronic interconnects Proceedings - Electronic Components and Technology Conference. 451-457. DOI: 10.1109/6144.846778  0.612
Show low-probability matches.