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Juline Shoeb, Ph.D. - Publications

Affiliations: 
2012 Electrical and Computer Engineering Iowa State University, Ames, IA, United States 
Area:
Electronics and Electrical Engineering, Nanotechnology, Fluid and Plasma Physics
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6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2012 Shoeb J, Kushner MJ. Damage by radicals and photons during plasma cleaning of porous low-k SiOCH. II. Water uptake and change in dielectric constant Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 30. DOI: 10.1116/1.4718447  0.622
2012 Shoeb J, Wang MM, Kushner MJ. Damage by radicals and photons during plasma cleaning of porous low-k SiOCH. I. Ar/O 2 and He/H 2 plasmas Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 30. DOI: 10.1116/1.4718444  0.646
2011 Shoeb J, Kushner MJ. Mechanisms for sealing of porous low-k SiOCH by combined He and NH 3 plasma treatment Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 29. DOI: 10.1116/1.3626534  0.602
2011 Shoeb J, Kushner MJ. Polymer cleaning from porous low-k dielectrics in He/H2 plasmas Ieee Transactions On Plasma Science. 39: 2828-2829. DOI: 10.1109/Tps.2011.2152862  0.606
2009 Shoeb J, Kushner MJ. Mechanisms for plasma etching of HfO2 gate stacks with Si selectivity and photoresist trimming Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 27: 1289-1302. DOI: 10.1116/1.3231480  0.548
2009 Shoeb J, Kushner MJ. Simulation of porous low-k dielectric sealing by combined He and NH 3 plasma treatment Ieee International Conference On Plasma Science. DOI: 10.1109/PLASMA.2009.5227599  0.563
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