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Kyle Yazzie, Ph.D. - Publications

Affiliations: 
2012 Materials Science and Engineering Arizona State University, Tempe, AZ, United States 
Area:
Materials Science Engineering, Mechanical Engineering
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19 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2017 Subramanian V, Yazzie K, Alazar T, Penmecha B, Liu P, Bai Y, Malatkar P. Characterization of Bulk and Thin Film Fracture in Electronic Packaging Journal of Electronic Packaging. 139. DOI: 10.1115/1.4036661  0.368
2013 Williams JJ, Yazzie KE, Padilla E, Chawla N, Xiao X, De Carlo F. Understanding fatigue crack growth in aluminum alloys by in situ X-ray synchrotron tomography International Journal of Fatigue. 57: 79-85. DOI: 10.1016/J.Ijfatigue.2012.06.009  0.469
2013 Lotfian S, Rodríguez M, Yazzie KE, Chawla N, Llorca J, Molina-Aldareguía JM. High temperature micropillar compression of Al/SiC nanolaminates Acta Materialia. 61: 4439-4451. DOI: 10.1016/J.Actamat.2013.04.013  0.488
2013 Lotfian S, Molina-Aldareguia JM, Yazzie KE, Llorca J, Chawla N. Mechanical characterization of lead-free Sn-Ag-Cu solder joints by high-temperature nanoindentation Journal of Electronic Materials. 42: 1085-1091. DOI: 10.1007/S11664-013-2517-Z  0.471
2012 Lotfian S, Molina-Aldareguia JM, Yazzie KE, Llorca J, Chawla N. High-temperature nanoindentation behavior of Al/SiC multilayers Philosophical Magazine Letters. 92: 362-367. DOI: 10.1080/09500839.2012.674220  0.43
2012 Zhang J, An Y, Yazzie K, Chawla N, Jiang H. Finite element simulation of swelling-induced crack healing in gels Soft Matter. 8: 8107-8112. DOI: 10.1039/C2Sm25399B  0.51
2012 Yazzie KE, Xie HX, Williams JJ, Chawla N. On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints Scripta Materialia. 66: 586-589. DOI: 10.1016/J.Scriptamat.2012.01.009  0.567
2012 Yazzie KE, Williams JJ, Chawla N. Quantifying necking of rectangular tensile specimens using a mirror-based image analysis system Materials Letters. 74: 243-246. DOI: 10.1016/J.Matlet.2012.01.138  0.502
2012 Yazzie KE, Williams JJ, Phillips NC, De Carlo F, Chawla N. Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography Materials Characterization. 70: 33-41. DOI: 10.1016/J.Matchar.2012.05.004  0.467
2012 Yazzie KE, Fei HE, Jiang H, Chawla N. Rate-dependent behavior of Sn alloy-Cu couples: Effects of microstructure and composition on mechanical shock resistance Acta Materialia. 60: 4336-4348. DOI: 10.1016/J.Actamat.2012.04.018  0.588
2012 Yazzie KE, Williams JJ, Chawla N. Fracture behavior of Sn-3.5Ag-0.7Cu and pure Sn solders as a function of applied strain rate Journal of Electronic Materials. 41: 2519-2526. DOI: 10.1007/S11664-012-2180-9  0.586
2012 Fei H, Yazzie K, Chawla N, Jiang H. Modeling fracture of sn-rich (Pb-Free) solder joints under mechanical shock conditions Journal of Electronic Materials. 41: 2089-2099. DOI: 10.1007/S11664-012-2079-5  0.64
2012 Fei H, Yazzie K, Chawla N, Jiang H. The effect of random voids in the modified Gurson model Journal of Electronic Materials. 41: 177-183. DOI: 10.1007/S11664-011-1816-5  0.656
2012 Yazzie KE, Fei H, Jiang H, Chawla N. A self-consistent approach for necking correction in tensile specimens with rectangular cross-section using a novel mirror fixture Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 43: 5058-5066. DOI: 10.1007/S11661-012-1355-6  0.504
2012 Yazzie KE, Topliff J, Chawla N. Communication: On the asymmetric growth behavior of intermetallic compound layers during extended reflow of Sn-Rich Alloy on Cu Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 43: 3442-3446. DOI: 10.1007/S11661-012-1329-8  0.491
2011 Fei H, Yazzie K, Williams J, Chawla N, Jiang H. Multiscale modeling of the interfacial fracture behavior in the Sn-Cu 6 Sn 5-Cu system Journal of Computational and Theoretical Nanoscience. 8: 873-880. DOI: 10.1166/Jctn.2011.1767  0.641
2011 Williams JJ, Yazzie KE, Connor Phillips N, Chawla N, Xiao X, De Carlo F, Iyyer N, Kittur M. On the correlation between fatigue striation spacing and crack growth rate: A three-dimensional (3-D) X-ray synchrotron tomography study Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 42: 3845-3848. DOI: 10.1007/S11661-011-0963-X  0.488
2010 Yazzie KE, Williams JJ, Kingsbury D, Peralta P, Jiang H, Chawla N. Digital image correlation analysis of the deformation behavior of Pb-free solders at intermediate strain rates Jom. 62: 16-21. DOI: 10.1007/S11837-010-0102-Y  0.557
2009 Yazzie KE, Fei H, Williams JJ, Jiang H, Chawla N. Mechanical shock behavior of bulk pure Sn solder Journal of Electronic Materials. 38: 2746-2755. DOI: 10.1007/S11664-009-0889-X  0.654
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