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Min Zheng, Ph.D.

Affiliations: 
2006 Columbia University, New York, NY 
Area:
Chemical Engineering
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"Min Zheng"
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Alan C. West grad student 2006 Columbia
 (The role of additives on direct copper electrodeposition on barriers.)

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Publications

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Liu Z, Zheng M, Hilty RD, et al. (2011) The effect of pulse reversal on morphology of cobalt hard gold Electrochimica Acta. 56: 2546-2551
Liu Z, Zheng M, Hilty RD, et al. (2010) Effect of morphology and hydrogen evolution on porosity of electroplated cobalt hard gold Journal of the Electrochemical Society. 157
Zheng M, Willey M, West AC. (2005) Electrochemical nucleation of copper on ruthenium effect of Cl -, PEG, and SPS Electrochemical and Solid-State Letters. 8
Zheng M, West AC. (2004) Simulation of the influence of reactant depletion on nucleation rate in electrodeposition Journal of the Electrochemical Society. 151
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