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Deepika Priyadarshini, Ph.D. - Publications

Affiliations: 
2011 Carnegie Mellon University, Pittsburgh, PA 
Area:
surface chemistry
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10 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2017 Priyadarshini D, Nguyen SV, Shobha H, Liniger E, Chen JH-, Huang H, Cohen SA, Grill A. Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 35: 21201. DOI: 10.1116/1.4974317  0.337
2016 Murray CE, Priyadarshini D, Nguyen S, Ryan ET. Tailoring capping layers to reduce stress gradients in copper metallization Applied Physics Letters. 109: 231907. DOI: 10.1063/1.4971395  0.374
2015 Murray CE, Jordan-Sweet J, Priyadarshini D, Nguyen S. Linking strain anisotropy and plasticity in copper metallization Applied Physics Letters. 106. DOI: 10.1063/1.4919788  0.32
2014 Batra P, Skordas S, LaTulipe D, Winstel K, Kothandaraman C, Himmel B, Maier G, He B, Wehella Gamage D, Golz J, Lin W, Vo T, Priyadarshini D, Hubbard A, Cauffman K, et al. Three-dimensional wafer stacking using Cu TSV integrated with 45 nm high performance SOI-CMOS embedded DRAM technology Journal of Low Power Electronics and Applications. 4: 77-89. DOI: 10.3390/Jlpea4020077  0.304
2014 Priyadarshini D, Nguyen S, Shobha H, Cohen S, Shaw T, Liniger E, Hu CK, Parks C, Adams E, Burnham J, Simon AH, Bonilla G, Grill A, Canaperi D, Edelstein D, et al. Advanced metal and dielectric barrier cap films for Cu low k interconnects 2014 Ieee International Interconnect Technology Conference / Advanced Metallization Conference, Iitc/Amc 2014. 185-188. DOI: 10.1109/IITC.2014.6831866  0.329
2014 Grill A, Gates SM, Ryan TE, Nguyen SV, Priyadarshini D. Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects - State of the art Applied Physics Reviews. 1. DOI: 10.1063/1.4861876  0.319
2012 Priyadarshini D, Kondratyuk P, Miller JB, Gellman AJ. Compact tool for deposition of composition spread alloy films Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 30. DOI: 10.1116/1.3664078  0.523
2012 Miller JB, Priyadarshini D, Gellman AJ. Segregation at the surfaces of Cu xPd 1 - X alloys in the presence of adsorbed S Surface Science. 606: 1520-1526. DOI: 10.1016/J.Susc.2012.05.020  0.54
2011 Priyadarshini D, Kondratyuk P, Picard YN, Morreale BD, Gellman AJ, Miller JB. High-throughput characterization of surface segregation in Cu xPd1-x alloys Journal of Physical Chemistry C. 115: 10155-10163. DOI: 10.1021/Jp201793D  0.585
2008 Gellman AJ, Miller JB, Priyadarshini D. High throughput methodology for study of surface segregation Aiche Annual Meeting, Conference Proceedings.  0.412
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