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Bing Dang, Ph.D. - Publications

Affiliations: 
2006 Georgia Institute of Technology, Atlanta, GA 
Area:
Microelectronics/Microsystems
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6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2012 Dickson TO, Liu Y, Rylov SV, Dang B, Tsang CK, Andry PS, Bulzacchelli JF, Ainspan HA, Gu X, Turlapati L, Beakes MP, Parker BD, Knickerbocker JU, Friedman DJ. An 8x 10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects Ieee Journal of Solid-State Circuits. 47: 884-896. DOI: 10.1109/Jssc.2012.2185184  0.318
2007 Bakir MS, Dang B, Ogunsola OOA, Sarvari R, Meindl JD. Electrical and optical chip I/O interconnections for gigascale systems Ieee Transactions On Electron Devices. 54: 2426-2437. DOI: 10.1109/Ted.2007.903203  0.659
2006 Dang B, Bakir MS, Meindl JD. Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink Ieee Electron Device Letters. 27: 117-119. DOI: 10.1109/Led.2005.862693  0.643
2006 Dang B, Bakir MS, Patel CS, Thacker HD, Meindl JD. Sea-of-Leads MEMS I/O interconnects for low-k IC packaging Journal of Microelectromechanical Systems. 15: 523-530. DOI: 10.1109/Jmems.2006.876792  0.642
2005 Bakir MS, Dang B, Emery R, Vandentop G, Kohl PA, Meindl JD. Sea of leads compliant I/O interconnect process integration for the ultimate enabling of chips with low-k interlayer dielectrics Ieee Transactions On Advanced Packaging. 28: 488-494. DOI: 10.1109/Tadvp.2005.848386  0.658
2004 Ogunsola OO, Dang B, Bakir MS, Villalaz RA, Gaylord TK, Meindl JD. Polymer pillar optical transmittance analysis Frontiers in Optics. DOI: 10.1364/Fio.2004.Fthm5  0.616
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