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Haibo Fan, Ph.D. - Publications

Affiliations: 
2005 Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong 
Area:
Electronics and Electrical Engineering, Packaging Engineering
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7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2012 Wong CK, Fan H, Zhang GQ, Yuen MM. Molecular design of self-assembled monolayer (SAM) coupling agent for reliable interfaces by molecular dynamics simulation Molecular Modeling and Multiscaling Issues For Electronic Material Applications. 133-148. DOI: 10.1007/978-1-4614-1728-6_9  0.571
2012 Fan H, Zhang K, Yuen MM. Thermal conductivity of carbon nanotube under external mechanical stresses and moisture by molecular dynamics simulation Molecular Modeling and Multiscaling Issues For Electronic Material Applications. 93-99. DOI: 10.1007/978-1-4614-1728-6_6  0.565
2012 Chan EK, Fan H, Yuen MM. A multiscale approach to investigate wettability of surfaces with designed coating Molecular Modeling and Multiscaling Issues For Electronic Material Applications. 203-212. DOI: 10.1007/978-1-4614-1728-6_12  0.551
2012 Fan H, Yuen MM. Investigation of interfacial delamination in electronic packages Molecular Modeling and Multiscaling Issues For Electronic Material Applications. 189-201. DOI: 10.1007/978-1-4614-1728-6_11  0.569
2010 Liu C, Fan HB, Zhang K, Yuen MM, Li Z. Flow dependence of interfacial thermal resistance in nanochannels. The Journal of Chemical Physics. 132: 094703. PMID 20210407 DOI: 10.1063/1.3327931  0.544
2010 Fan H, Yuen MMF. A multi-scale approach for investigation of interfacial delamination in electronic packages Microelectronics Reliability. 50: 893-899. DOI: 10.1016/J.Microrel.2010.02.029  0.372
2008 Wong CKY, Fan H, Yuen MMF. Interfacial Adhesion Study for SAM Induced Covalent Bonded Copper-EMC Interface by Molecular Dynamics Simulation Ieee Transactions On Components and Packaging Technologies. 31: 297-308. DOI: 10.1109/Tcapt.2008.921627  0.317
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