| Year |
Citation |
Score |
| 2020 |
Reichardt A, Shapiro AA, Otis R, Dillon RP, Borgonia JP, McEnerney BW, Hosemann P, Beese AM. Advances in additive manufacturing of metal-based functionally graded materials International Materials Reviews. 1-29. DOI: 10.1080/09506608.2019.1709354 |
0.308 |
|
| 2020 |
Bobbio LD, Bocklund B, Reichardt A, Otis R, Borgonia JP, Dillon RP, Shapiro AA, McEnerney BW, Hosemann P, Liu ZK, Beese AM. Analysis of formation and growth of the σ phase in additively manufactured functionally graded materials Journal of Alloys and Compounds. 814: 151729. DOI: 10.1016/J.Jallcom.2019.151729 |
0.327 |
|
| 2018 |
Bobbio LD, Bocklund B, Otis R, Borgonia JP, Dillon RP, Shapiro AA, McEnerney B, Liu Z, Beese AM. Experimental analysis and thermodynamic calculations of an additively manufactured functionally graded material of V to Invar 36 Journal of Materials Research. 33: 1642-1649. DOI: 10.1557/Jmr.2018.92 |
0.332 |
|
| 2017 |
Bobbio LD, Otis R, Borgonia JPC, Dillon RP, Shapiro AA, Liu Z, Beese AM. Additive manufacturing of a functionally graded material from Ti-6Al-4V to Invar: Experimental characterization and thermodynamic calculations Acta Materialia. 127: 133-142. DOI: 10.1016/J.Actamat.2016.12.070 |
0.352 |
|
| 2016 |
Shapiro AA, Borgonia JP, Chen QN, Dillon RP, McEnerney B, Polit-Casillas R, Soloway L. Additive Manufacturing for Aerospace Flight Applications Journal of Spacecraft and Rockets. 53: 952-959. DOI: 10.2514/1.A33544 |
0.306 |
|
| 2016 |
Reichardt A, Dillon RP, Borgonia JP, Shapiro AA, McEnerney BW, Momose T, Hosemann P. Development and characterization of Ti-6Al-4V to 304L stainless steel gradient components fabricated with laser deposition additive manufacturing Materials and Design. 104: 404-413. DOI: 10.1016/J.Matdes.2016.05.016 |
0.344 |
|
| 2016 |
Carroll BE, Otis RA, Borgonia JP, Suh JO, Dillon RP, Shapiro AA, Hofmann DC, Liu ZK, Beese AM. Functionally graded material of 304L stainless steel and inconel 625 fabricated by directed energy deposition: Characterization and thermodynamic modeling Acta Materialia. 108: 46-54. DOI: 10.1016/J.Actamat.2016.02.019 |
0.376 |
|
| 2014 |
Hofmann DC, Roberts S, Otis R, Kolodziejska J, Dillon RP, Suh JO, Shapiro AA, Liu ZK, Borgonia JP. Developing gradient metal alloys through radial deposition additive manufacturing. Scientific Reports. 4: 5357. PMID 24942329 DOI: 10.1038/Srep05357 |
0.346 |
|
| 2013 |
Lam CW, Lim SR, Ogunseitan OA, Shapiro AA, Saphores JD, Brock A, Schoenung JM. Integrating toxicity reduction strategies for materials and components into product design: a case study on utility meters. Integrated Environmental Assessment and Management. 9: 319-28. PMID 23192989 DOI: 10.1002/Ieam.1384 |
0.323 |
|
| 2013 |
Gdoutos E, Shapiro AA, Daraio C. Thin and Thermally Stable Periodic Metastructures Experimental Mechanics. 53: 1735-1742. DOI: 10.1007/S11340-013-9748-Z |
0.33 |
|
| 2012 |
Roberts S, Zachrisson C, Kozachkov H, Ullah A, Shapiro AA, Johnson WL, Hofmann DC. Cryogenic Charpy impact testing of metallic glass matrix composites Scripta Materialia. 66: 284-287. DOI: 10.1016/J.Scriptamat.2011.11.011 |
0.307 |
|
| 2010 |
Shapiro AA, Tudryn C, Schatzel D, Tseng S. Electronic packaging materials for extreme, low temperature, fatigue environments Ieee Transactions On Advanced Packaging. 33: 408-420. DOI: 10.1109/Tadvp.2010.2044504 |
0.331 |
|
| 2009 |
Ogunseitan OA, Schoenung JM, Saphores JD, Shapiro AA. Science and regulation. The electronics revolution: from e-wonderland to e-wasteland. Science (New York, N.Y.). 326: 670-1. PMID 19900918 DOI: 10.1126/Science.1176929 |
0.312 |
|
| 2008 |
Lincoln JD, Shapiro AA, Earthman JC, Saphores JDM, Ogunseitan OA. Design and evaluation of bioepoxy-flax composites for printed circuit boards Ieee Transactions On Electronics Packaging Manufacturing. 31: 211-220. DOI: 10.1109/Tepm.2008.926273 |
0.318 |
|
| 2007 |
Saphores JDM, Nixon H, Ogunseitan OA, Shapiro AA. California households' willingness to pay for 'green' electronics Journal of Environmental Planning and Management. 50: 113-133. DOI: 10.1080/09640560601048549 |
0.304 |
|
| 2006 |
Shapiro AA, Bonner JK, Ogunseitan OA, Saphores JDM, Schoenung JM. Implications of Pb-free microelectronics assembly in aerospace applications Ieee Transactions On Components and Packaging Technologies. 29: 60-70. DOI: 10.1109/Tcapt.2005.850514 |
0.317 |
|
| 2004 |
Schoenung JM, Ogunseitan OA, Saphores JDM, Shapiro AA. Adopting lead-free electronics: Policy differences and knowledge gaps Journal of Industrial Ecology. 8: 59-85. DOI: 10.1162/1088198043630496 |
0.345 |
|
| 2001 |
Vo HT, Todd M, Shi FG, Shapiro AA, Edwards M. Towards model-based engineering of underfill materials: CTE modeling Microelectronics Journal. 32: 331-338. DOI: 10.1016/S0026-2692(00)00152-X |
0.338 |
|
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