Year |
Citation |
Score |
2023 |
Ustad RE, Chavan VD, Kim H, Shin MH, Kim SK, Choi KK, Kim DK. Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films. Nanomaterials (Basel, Switzerland). 13. PMID 37836283 DOI: 10.3390/nano13192642 |
0.311 |
|
2014 |
Kim D. Improved electrical and optical properties of GZO films with a thin TiO2 buffer layer deposited by RF magnetron sputtering Ceramics International. 40: 1457-1460. DOI: 10.1016/j.ceramint.2013.07.029 |
0.319 |
|
2013 |
Kim D. Effect of a TiO2 buffer layer on the properties of ITO films prepared by RF magnetron sputtering Transactions On Electrical and Electronic Materials. 14: 242-245. DOI: 10.4313/TEEM.2013.14.5.242 |
0.318 |
|
2013 |
Ahn JS, Kim DK, Joo SK. Effect of electric field on amorphous silicon thin films during Ni induced lateral crystallization Journal of Applied Physics. 113. DOI: 10.1063/1.4811350 |
0.329 |
|
2012 |
Kim D. The influence of Au thickness on the structural, optical and electrical properties of ZnO/Au/ZnO multilayer films Optics Communications. 285: 1212-1214. DOI: 10.1016/j.optcom.2011.10.043 |
0.338 |
|
2010 |
Kim D. Characterization of TiO2/Au/TiO2 films deposited by magnetron sputtering on polycarbonate substrates Applied Surface Science. 257: 704-707. DOI: 10.1016/j.apsusc.2010.07.038 |
0.312 |
|
2003 |
Kim D. Deposition of indium tin oxide films on polycarbonate substrates by direct metal ion beam deposition Applied Surface Science. 218: 70-77. DOI: 10.1016/S0169-4332(03)00542-7 |
0.309 |
|
2001 |
Kim DK, Nix WD, Vinci RP, Deal MD, Plummer JD. Study of the effect of grain boundary migration on hillock formation in Al thin films Journal of Applied Physics. 90: 781-788. DOI: 10.1063/1.1381045 |
0.537 |
|
2000 |
Kim DK, Nix WD, Arzt E, Deal MD, Plummer JD. Diffusional hillock formation in Al thin films controlled by creep Materials Research Society Symposium - Proceedings. 594: 129-134. DOI: 10.1557/Proc-594-129 |
0.551 |
|
2000 |
Kim DK, Nix WD, Deal MD, Plummer JD. Creep-controlled diffusional hillock formation in blanket aluminum thin films as a mechanism of stress relaxation Journal of Materials Research. 15: 1709-1718. DOI: 10.1557/Jmr.2000.0246 |
0.529 |
|
2000 |
Kim DK, Heiland B, Nix WD, Arzt E, Deal MD, Plummer JD. Microstructure of thermal hillocks on blanket Al thin films Thin Solid Films. 371: 278-282. DOI: 10.1016/S0040-6090(00)00971-8 |
0.555 |
|
1992 |
Kim D, Fahrenbruch AL, Lopez-Otero A, Bube RH. Effect of Electron Irradiation and Excess Cd on Ion-Assisted Doping of p-CdTe Thin Films Mrs Proceedings. 262. DOI: 10.1557/Proc-262-187 |
0.331 |
|
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