| Year |
Citation |
Score |
| 2014 |
Jimenez FJ, Dew SK, Field DJ. Comprehensive computer model for magnetron sputtering. II. Charged particle transport Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 32. DOI: 10.1116/1.4894270 |
0.382 |
|
| 2014 |
Olsen T, Ng J, Stepanova M, Dew SK. Programmed self-assembly of microscale components using biomolecular recognition through the avidin-biotin interaction Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics. 32. DOI: 10.1116/1.4893075 |
0.309 |
|
| 2013 |
Peters R, Fito T, Gutierrez-Rivera L, Dew S, Stepanova M. Study of multilayer systems in electron beam lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 31. DOI: 10.1116/1.4827813 |
0.356 |
|
| 2013 |
Gutierrez-Rivera L, Peters RF, Dew SK, Stepanova M. Application of EBL fabricated nanostructured substrates for surface enhanced Raman spectroscopy detection of protein A in aqueous solution Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 31. DOI: 10.1116/1.4821800 |
0.33 |
|
| 2012 |
Mohammad MA, Koshelev K, Fito T, Zheng DAZ, Stepanova M, Dew S. Study of development processes for ZEP-520 as a high-resolution positive and negative tone electron beam lithography resist Japanese Journal of Applied Physics. 51. DOI: 10.1143/Jjap.51.06Fc05 |
0.329 |
|
| 2012 |
Ali Mohammad M, Poulose Santo K, Dew SK, Stepanova M. Study of the interaction of polymethylmethacrylate fragments with methyl isobutyl ketone and isopropyl alcohol Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 30. DOI: 10.1116/1.4766318 |
0.313 |
|
| 2012 |
Jimenez FJ, Dew SK. Comprehensive computer model for magnetron sputtering. I. Gas heating and rarefaction Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 30. DOI: 10.1116/1.4712534 |
0.407 |
|
| 2011 |
Bhuiyan AK, Dew SK, Stepanova M. Kinetic Monte Carlo simulation of metallic nanoislands grown by physical vapor deposition Communications in Computational Physics. 9: 49-67. DOI: 10.4208/Cicp.311209.230410A |
0.461 |
|
| 2011 |
Adeyenuwo AP, Stepanova M, Dew SK. Density multiplication of nanostructures fabricated by ultralow voltage electron beam lithography using PMMA as positive- and negative-tone resist Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 29. DOI: 10.1116/1.3657512 |
0.333 |
|
| 2011 |
Koshelev K, Ali Mohammad M, Fito T, Westra KL, Dew SK, Stepanova M. Comparison between ZEP and PMMA resists for nanoscale electron beam lithography experimentally and by numerical modeling Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 29. DOI: 10.1116/1.3640794 |
0.303 |
|
| 2011 |
Muhammad M, Buswell SC, Dew SK, Stepanova M. Nanopatterning of PMMA on insulating surfaces with various anticharging schemes using 30 keV electron beam lithography Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 29. DOI: 10.1116/1.3636367 |
0.386 |
|
| 2011 |
Bhuiyan AK, Dew SK, Stepanova M. Controlled self-assembly of nanocrystalline arrays studied by 3D kinetic monte carlo modeling Journal of Physical Chemistry C. 115: 19557-19568. DOI: 10.1021/Jp205791T |
0.357 |
|
| 2011 |
Mohammad MA, Dew SK, Evoy S, Stepanova M. Fabrication of sub-10 nm silicon carbon nitride resonators using a hydrogen silsesquioxane mask patterned by electron beam lithography Microelectronic Engineering. 88: 2338-2341. DOI: 10.1016/J.Mee.2010.11.045 |
0.31 |
|
| 2010 |
Mohammad MA, Guthy C, Evoy S, Dew SK, Stepanova M. Nanomachining and clamping point optimization of silicon carbon nitride resonators using low voltage electron beam lithography and cold development Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 28. DOI: 10.1116/1.3517683 |
0.318 |
|
| 2010 |
Stepanova M, Fito T, Szabó Z, Alti K, Adeyenuwo AP, Koshelev K, Aktary M, Dew SK. Simulation of electron beam lithography of nanostructures Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 28. DOI: 10.1116/1.3497019 |
0.396 |
|
| 2010 |
Ekpe SD, Jimenez FJ, Dew SK. Effect of process conditions on the microstructural formation of dc reactively sputter deposited AlN Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 28: 1210-1214. DOI: 10.1116/1.3478670 |
0.462 |
|
| 2010 |
Mohammad MA, Fito T, Chen J, Aktary M, Stepanova M, Dew SK. Interdependence of optimum exposure dose regimes and the kinetics of resist dissolution for electron beam nanolithography of polymethylmethacrylate Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 28. DOI: 10.1116/1.3268131 |
0.309 |
|
| 2010 |
Mohammad MA, Fito T, Chen J, Buswell S, Aktary M, Stepanova M, Dew SK. Systematic study of the interdependence of exposure and development conditions and kinetic modelling for optimizing low-energy electron beam nanolithography Microelectronic Engineering. 87: 1104-1107. DOI: 10.1016/J.Mee.2009.11.047 |
0.305 |
|
| 2009 |
Stepanova M, Dew SK. Ion beam sputtering nanopatterning of thin metal films: the synergism of kinetic self-organization and coarsening. Journal of Physics. Condensed Matter : An Institute of Physics Journal. 21: 224014. PMID 21715752 DOI: 10.1088/0953-8984/21/22/224014 |
0.336 |
|
| 2009 |
Bhuiyan A, Dew SK, Stepanova M. Trends of Nanoclusters' Growth by Physical Vapor Deposition Studied by Atomistic Simulation Mrs Proceedings. 1177. DOI: 10.1557/Proc-1177-Z09-05 |
0.419 |
|
| 2009 |
Ekpe SD, Jimenez FJ, Field DJ, Davis MJ, Dew SK. Effect of magnetic field strength on deposition rate and energy flux in a dc magnetron sputtering system Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 27: 1275-1280. DOI: 10.1116/1.3222874 |
0.31 |
|
| 2009 |
Bhuiyan AK, Dew SK, Stepanova M. Trends of nanoclusters' growth by physical vapor deposition studied by atomistic simulation Materials Research Society Symposium Proceedings. 1177: 68-73. |
0.311 |
|
| 2007 |
Mohammad MA, Dew SK, Westra K, Li P, Aktary M, Lauw Y, Kovalenko A, Stepanova M. Nanoscale resist morphologies of dense gratings using electron-beam lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 25: 745-753. DOI: 10.1116/1.2731330 |
0.321 |
|
| 2006 |
Jimenez F, Ekpe SD, Dew SK. Inhomogeneous rarefaction of the process gas in a direct current magnetron sputtering system Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 24: 1530-1534. DOI: 10.1116/1.2210005 |
0.389 |
|
| 2006 |
Aktary M, Stepanova M, Dew SK. Simulation of the spatial distribution and molecular weight of polymethylmethacrylate fragments in electron beam lithography exposures Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 768-779. DOI: 10.1116/1.2181580 |
0.344 |
|
| 2006 |
Stepanova M, Dew SK. Self-organized Cu nanowires on glass and Si substrates from sputter etching Cu/substrate interfaces Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 592-598. DOI: 10.1116/1.2172249 |
0.359 |
|
| 2006 |
Ekpe SD, Dew SK. 3D numerical simulation of gas heating effects in a magnetron sputter deposition system Journal of Physics D: Applied Physics. 39: 1413-1421. DOI: 10.1088/0022-3727/39/7/012 |
0.329 |
|
| 2005 |
Stepanova M, Dew SK, Soshnikov IP. Copper nanopattern on Si O2 from sputter etching a CuSi O2 interface Applied Physics Letters. 86: 1-3. DOI: 10.1063/1.1864247 |
0.362 |
|
| 2005 |
Ekpe SD, Bezuidenhout LW, Dew SK. Deposition rate model of magnetron sputtered particles Thin Solid Films. 474: 330-336. DOI: 10.1016/J.Tsf.2004.09.007 |
0.448 |
|
| 2005 |
Stepanova M, Dew SK. Fabrication and atomistic modeling of ion-etch nanostructures on substrates Materials Research Society Symposium Proceedings. 849: 35-40. |
0.372 |
|
| 2004 |
Stepanova M, Dew SK. Fabrication and Atomistic Modeling of Ion-Etch Nanostructures on Substrates Mrs Proceedings. 849. DOI: 10.1557/Proc-849-Kk6.9 |
0.466 |
|
| 2004 |
Ekpe SD, Dew SK. Measurement of energy flux at the substrate in a magnetron sputter system using an integrated sensor Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 22: 1420-1424. DOI: 10.1116/1.1705640 |
0.31 |
|
| 2004 |
Stepanova M, Dew SK. Surface relaxation in ion-etch nanopatterning Applied Physics Letters. 84: 1374-1376. DOI: 10.1063/1.1650546 |
0.33 |
|
| 2004 |
Stepanova M, Dew SK. Anisotropic energies of sputtered atoms under oblique ion incidence Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions With Materials and Atoms. 215: 357-365. DOI: 10.1016/J.Nimb.2003.09.013 |
0.342 |
|
| 2003 |
Ekpe SD, Dew SK. Theoretical and experimental determination of the energy flux during magnetron sputter deposition onto an unbiased substrate Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 21: 476-483. DOI: 10.1116/1.1554971 |
0.39 |
|
| 2002 |
Ekpe SD, Dew SK. Investigation of thermal flux to the substrate during sputter deposition of aluminum Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 20: 1877-1885. DOI: 10.1116/1.1507342 |
0.43 |
|
| 2002 |
Stepanova M, Dew SK, Soshnikov IP. Sputtering from ion-beam-roughened Cu surfaces Physical Review B - Condensed Matter and Materials Physics. 66: 1254071-1254078. DOI: 10.1103/Physrevb.66.125407 |
0.342 |
|
| 2002 |
Stepanova M, Dew SK. Discrete-path transport theory of physical sputtering Journal of Applied Physics. 92: 1699-1708. DOI: 10.1063/1.1488245 |
0.323 |
|
| 2002 |
Smy T, Dew SK, Joshi RV. Modeling 3D effects of substrate topography on step coverage and film morphology of thin metal films Thin Solid Films. 415: 32-45. DOI: 10.1016/S0040-6090(02)00502-3 |
0.506 |
|
| 2001 |
Stepanova M, Dew SK. Estimates of differential sputtering yields for deposition applications Journal of Vacuum Science and Technology, Part a: Vacuum, Surfaces and Films. 19: 2805-2816. DOI: 10.1116/1.1405515 |
0.331 |
|
| 2001 |
Smy T, Dew SK, Joshi RV. Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator Journal of Vacuum Science and Technology. 19: 251-261. DOI: 10.1116/1.1329124 |
0.505 |
|
| 2000 |
Smy T, Vick D, Brett MJ, Dew SK, Wu AT, Sit JC, Harris KD. Simulation of 3D films deposited by glancing angle deposition using 3D-films Materials Research Society Symposium - Proceedings. 616: 141-146. DOI: 10.1557/Proc-616-141 |
0.488 |
|
| 2000 |
Li M, Dew S, Brett M, Smy T. Kinetic simulation of metal chemical-vapor deposition on high aspect ratio features in modern very-large-scale-integrated processing Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 18: 1343-1347. DOI: 10.1116/1.591384 |
0.35 |
|
| 2000 |
Smy T, Vick D, Brett MJ, Dew SK, Wu AT, Sit JC, Harris KD. Three-dimensional simulation of film microstructure produced by glancing angle deposition Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 18: 2507-2512. DOI: 10.1116/1.1286394 |
0.513 |
|
| 2000 |
Smy T, Joshi RV, Dew SK. Simulation of barrier layer deposition for VLSI applications using 3D-films Advanced Metallization Conference (Amc). 361-366. |
0.411 |
|
| 2000 |
Smy T, Crisan S, Joshi RV, Dew SK. Modeling film and via electrical resistance for 3D structures using 3D-films Advanced Metallization Conference (Amc). 463-468. |
0.364 |
|
| 1999 |
Friedrich LJ, Dew SK, Brett MJ, Smy T. Integrating system and feature scale models to study copper reflow Journal of Vacuum Science & Technology B. 17: 186-193. DOI: 10.1116/1.590534 |
0.48 |
|
| 1999 |
Friedrich LJ, Dew SK, Brett MJ, Smy T. A simulation study of copper reflow characteristics in vias Ieee Transactions On Semiconductor Manufacturing. 12: 353-365. DOI: 10.1109/66.778203 |
0.386 |
|
| 1999 |
Vick D, Freiedrich L, Dew S, Brett M, Robbie K, Seto M, Smy T. Erratum to “Self-shadowing and surface diffusion effects in obliquely deposited thin films” [Thin solid Films 339 (1999) 88–94] Thin Solid Films. 349: 303. DOI: 10.1016/S0040-6090(99)00314-4 |
0.468 |
|
| 1999 |
Vick D, Friedrich L, Dew S, Brett M, Robbie K, Seto M, Smy T. Self-shadowing and surface diffusion effects in obliquely deposited thin films Thin Solid Films. 339: 88-94. DOI: 10.1016/S0040-6090(98)01154-7 |
0.502 |
|
| 1999 |
Vick D, Friedrich LJ, Dew SK, Brett MJ, Robbie K, Seto M, Smy T. Self-shadowing and surface diffusion effects in obliquely deposited thin films Thin Solid Films. 339: 88-94. |
0.413 |
|
| 1998 |
Smy T, Tan L, Chan K, Tait RN, Broughton JN, Dew SK, Brett MJ. A simulation study of long throw sputtering for diffusion barrier deposition into high aspect vias and contacts Ieee Transactions On Electron Devices. 45: 1414-1425. DOI: 10.1109/16.701470 |
0.519 |
|
| 1998 |
Smy T, Joshi RV, Tait N, Dew SK, Brett MJ. An analysis of the role of high energy neutral bombardment in longthrow/collimated sputtering of refractory metal barrier layers Journal of Applied Physics. 84: 5315-5325. DOI: 10.1063/1.368780 |
0.517 |
|
| 1998 |
Dew SK, Gui X. Use of a dynamic network for the TLM solution of diffusion problems International Journal of Numerical Modelling: Electronic Networks, Devices and Fields. 11: 259-271. DOI: 10.1002/(Sici)1099-1204(199809/10)11:5<259::Aid-Jnm311>3.0.Co;2-5 |
0.348 |
|
| 1998 |
Smy T, Joshi RV, Tait N, Dew SK, Brett MJ. Deposition and simulation of refractory barriers into high aspect ratio re-entrant features using directional sputtering Technical Digest - International Electron Devices Meeting. 311-314. |
0.408 |
|
| 1998 |
Smy T, Joshi RV, Tait N, Dew SK, Brett MJ. An analysis of the role of high energy neutral bombardment in longthrow/collimated sputtering of refractory metal barrier layers Journal of Applied Physics. 84: 5315-5325. |
0.438 |
|
| 1997 |
Smy T, Tan L, Dew SK, Brett MJ, Shacham‐Diamand Y, Desilva M. Simulation of Electroless Deposition of Cu Thin Films for Very Large Scale Integration Metallization Journal of the Electrochemical Society. 144: 2115-2122. DOI: 10.1149/1.1837750 |
0.478 |
|
| 1997 |
Smy T, Tan L, Winterton SS, Dew SK, Brett MJ. Simulation of sputter deposition at high pressures Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 15: 2847-2853. DOI: 10.1116/1.580838 |
0.383 |
|
| 1997 |
Backhouse CJ, Este G, Sit JC, Dew SK, Brett MJ. WSiX thin films for resistors Thin Solid Films. 311: 299-303. DOI: 10.1016/S0040-6090(97)00700-1 |
0.486 |
|
| 1997 |
Friedrich LJ, Gardner DS, Dew SK, Brett MJ, Smy T. Study of the copper reflow process using the GROFILMS simulator Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 15: 1780-1787. |
0.372 |
|
| 1997 |
Smy T, Tan L, Dew SK, Brett MJ, Shacham-Diamand Y, Desilva M. Simulation of electroless deposition of Cu thin films for very large scale integration metallization Journal of the Electrochemical Society. 144: 2115-2122. |
0.398 |
|
| 1996 |
Sheergar MK, Smy T, Dew SK, Brett MJ. Simulation of three‐dimensional refractory metal step coverage over contact cuts and vias Journal of Vacuum Science & Technology B. 14: 2595-2602. DOI: 10.1116/1.588992 |
0.512 |
|
| 1996 |
Backhouse CJ, Robbie K, Parks J, Broughton JN, Dew S, Este G, Brett MJ. Electrostatic scattering of ionic species in low pressure sputtering of Ti and TiN Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 14: 2175-2181. DOI: 10.1116/1.580043 |
0.411 |
|
| 1996 |
Backhouse CJ, Dew SK, Brett MJ. Hollow‐cathode assisted sputtering Journal of Vacuum Science and Technology. 14: 2674-2676. DOI: 10.1116/1.580002 |
0.378 |
|
| 1996 |
Broughton JN, Brett MJ, Dew SK, Este G. Titanium sputter deposition at low pressures and long throw distances Ieee Transactions On Semiconductor Manufacturing. 9: 122-127. DOI: 10.1109/66.484292 |
0.383 |
|
| 1996 |
Brett MJ, Dew SK, Smy TJ. Thin film microstructure and process simulation using SIMBAD Thin Films. 22: 1-79. DOI: 10.1016/S1079-4050(96)80003-2 |
0.54 |
|
| 1996 |
Tait RN, Dew SK, Tsai W, Hodul D, Smy T, Brett MJ. Simulation of uniformity and lifetime effects in collimated sputtering Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 14: 679-686. |
0.421 |
|
| 1996 |
Tait RN, Dew SK, Tsai W, Hodul D, Smy T, Brett MJ. Simulation of uniformity and lifetime effects in collimated sputtering Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 14: 679-686. |
0.421 |
|
| 1996 |
Tait RN, Dew SK, Tsai W, Hodul D, Smy T, Brett MJ. Simulation of uniformity and lifetime effects in collimated sputtering Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 14: 679-686. |
0.421 |
|
| 1995 |
Smy T, Dew SK, Brett MJ. Simulation of Microstructure and Surface Profiles of Thin Films for VLSI Metallization Mrs Bulletin. 20: 65-69. DOI: 10.1557/S0883769400045619 |
0.346 |
|
| 1995 |
Tait R, Dew S, Tsai W, Hodul D, Brett M, Smyd T. Simulation of Uniformity and Lifetime Effects in Collimated Sputtering Mrs Proceedings. 389. DOI: 10.1116/1.589156 |
0.501 |
|
| 1995 |
Robbie K, Smy T, Friedrich LJ, Dew SK, Brett MJ. Fabrication of thin films with highly porous microstructures Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 13: 1032-1035. DOI: 10.1116/1.579579 |
0.521 |
|
| 1995 |
Gui X, Friedrich LJ, Dew SK, Brett MJ, Smy T. Grain-boundary diffusion modeling and efficiency evaluation of thin-film diffusion barriers considering microstructure effects Journal of Applied Physics. 78: 4438-4443. DOI: 10.1063/1.360744 |
0.392 |
|
| 1995 |
Winterton SS, Smy T, Dew SK, Brett MJ. Simulation of the effect of bulk vacancy diffusion on the shape of sputtered films deposited onto trenches and vias Journal of Applied Physics. 78: 3572-3579. DOI: 10.1063/1.360708 |
0.54 |
|
| 1995 |
Smy T, Salahuddin M, Dew SK, Brett MJ. Explanation of spurious features in tungsten deposition using an atomic momentum model Journal of Applied Physics. 78: 4157-4163. DOI: 10.1063/1.359875 |
0.54 |
|
| 1995 |
Tsai W, Hodul D, Sheng T, Dew S, Robbie K, Brett MJ, Smy T. Variation of composition of sputtered TiN films as a function of target nitridation, thermal anneal, and substrate topography Applied Physics Letters. 67: 220. DOI: 10.1063/1.114673 |
0.444 |
|
| 1995 |
Friedrich LJ, Dew SK, Brett M, Smy T. Thin film microstructure modelling through line-segment simulation Thin Solid Films. 266: 83-88. DOI: 10.1016/0040-6090(95)06672-1 |
0.505 |
|
| 1995 |
Smy T, Dew SK, Brett MJ. Simulation and experimental analysis of refractory metal and aluminum deposition over high aspect ratio vlsi topography Canadian Metallurgical Quarterly. 34: 195-202. DOI: 10.1016/0008-4433(95)00016-Q |
0.538 |
|
| 1995 |
Tait RN, Smy T, Dew SK, Brett MJ. Nodular defect growth and structure in vapor deposited films Journal of Electronic Materials. 24: 935-940. DOI: 10.1007/Bf02652964 |
0.508 |
|
| 1994 |
Dew S, Smy T, Brett M. Step Coverage, Uniformity and Composition Studies Using Integrated Vapour Transport and Film-Deposition Models Japanese Journal of Applied Physics. 33: 1140-1145. DOI: 10.1143/Jjap.33.1140 |
0.5 |
|
| 1994 |
Tait RN, Dew SK, Brett MJ, Smy T. Monte Carlo simulation and measurement of silicon reactive ion etching profiles Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 12: 1085-1089. DOI: 10.1116/1.579289 |
0.413 |
|
| 1994 |
Liu D, Dew SK, Brett MJ, Smy T, Tsai W. Compositional variations in Ti-W films sputtered over topographical features Journal of Applied Physics. 75: 8114-8120. DOI: 10.1063/1.356531 |
0.501 |
|
| 1994 |
Tsai W, Brett MJ, Dew SK, Liu D, Smy T, Tait RN. Bombardment and gas rarefaction effects on the properties of sputtered Ti thin films Thin Solid Films. 253: 386-390. DOI: 10.1016/0040-6090(94)90353-0 |
0.474 |
|
| 1994 |
Janacek T, Liu D, Dew SK, Brett MJ, Smy TJ. The effects of collimation on intrinsic stress in sputter-deposited metallic thin films Thin Solid Films. 253: 372-376. DOI: 10.1016/0040-6090(94)90350-6 |
0.49 |
|
| 1994 |
Smy T, Winterton SS, Dew SK, Brett MJ. Simulation and analysis of electromigration failure distributions Microelectronics Reliability. 34: 1047-1056. DOI: 10.1016/0026-2714(94)90069-8 |
0.312 |
|
| 1994 |
Li P, Smy T, Dew SK, Brett MJ. Simulation and experimental analysis of planarization of refractory metals using a multi-step sputter/sputter etch process Journal of Electronic Materials. 23: 1215-1220. DOI: 10.1007/Bf02649972 |
0.537 |
|
| 1994 |
Gui X, Dew SK, Brett MJ. Three-dimensional simulation of impurity diffusion in thin-film diffusion barriers Journal of Electronic Materials. 23: 1309-1314. DOI: 10.1007/Bf02649896 |
0.403 |
|
| 1993 |
Dew SK. Spatial and angular nonuniformities from collimated sputtering Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 11: 1281. DOI: 10.1116/1.586930 |
0.499 |
|
| 1993 |
Gui X, Dew SK, Brett MJ, De Cogan D. Transmission-line-matrix modeling of grain-boundary diffusion in thin films Journal of Applied Physics. 74: 7173-7180. DOI: 10.1063/1.355034 |
0.437 |
|
| 1993 |
Liu D, Dew SK, Brett MJ, Janacek T, Smy T, Tsai W. Experimental study and computer simulation of collimated sputtering of titanium thin films over topographical features Journal of Applied Physics. 74: 1339-1344. DOI: 10.1063/1.354889 |
0.523 |
|
| 1993 |
Liu D, Dew SK, Brett MJ, Janacek T, Smy T, Tsai W. Properties of titanium and aluminum thin films deposited by collimated sputtering Thin Solid Films. 236: 267-273. DOI: 10.1016/0040-6090(93)90681-E |
0.513 |
|
| 1992 |
Dew SK. Simulation of the microstructure of chemical vapor deposited refractory thin films Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 10: 618. DOI: 10.1116/1.586422 |
0.536 |
|
| 1992 |
Tait RN, Dew SK, Brett MJ, Smy T. Etching of thin metal films using a ballistic model Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 10: 912-915. DOI: 10.1116/1.577694 |
0.518 |
|
| 1992 |
Dew SK, Brett MJ, Smy T. Simulation of Elevated Temperature Aluminum Metallization Using SIMBAD Ieee Transactions On Electron Devices. 39: 1599-1606. DOI: 10.1109/16.141224 |
0.488 |
|
| 1992 |
Brett MJB, Tait RN, Dew SK, Kamasz S, Labun AH, Smy T. Nodular defect growth in thin films Journal of Materials Science: Materials in Electronics. 3: 200. DOI: 10.1007/Bf00695522 |
0.459 |
|
| 1991 |
Smy T, Tait RN, Brnft MJ, Dew SK. Modeling bias sputter planarization of metal films using a ballistic deposition simulation Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 9: 519-523. DOI: 10.1116/1.577401 |
0.534 |
|
| 1991 |
Tait RN, Dew SK, Smy T, Brett MJ. Density variation of tungsten films sputtered over topography Journal of Applied Physics. 70: 4295-4300. DOI: 10.1063/1.349107 |
0.506 |
|
| 1990 |
Tait RN, Dew SK, Smy T, Brett MJ. Ballistic simulation of optical coatings deposited over topography Proceedings of Spie - the International Society For Optical Engineering. 1324: 112-119. |
0.368 |
|
| 1989 |
Dew SK, Osborne NR, Mulhern PJ, Parsons RR. Effects and loss of lead in doped Bi-Sr-Ca-Cu-O films Applied Physics Letters. 54: 1929-1931. DOI: 10.1063/1.101499 |
0.321 |
|
| 1989 |
Osborne NR, Dew SK, Mulhern PJ, Parsons RR. Effects of lead on the formation of the 2223 phase in BiSrCaCuO films Thin Solid Films. 181: 165-172. DOI: 10.1016/0040-6090(89)90483-5 |
0.32 |
|
| 1987 |
Burbidge DS, Dew SK, Sullivan BT, Fortier N, Parsons RR, Mulhern PJ, Carolan JF, Chaklader A. DC magnetron sputtering of high Tc superconducting thin films Solid State Communications. 64: 749-751. DOI: 10.1016/0038-1098(87)90692-2 |
0.325 |
|
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