| Year |
Citation |
Score |
| 2010 |
DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A. Studying the effect of temperature on the copper oxidation process using hydrogen peroxide for use in multi-step chemical mechanical planarization models Thin Solid Films. 518: 3903-3909. DOI: 10.1016/J.Tsf.2009.12.089 |
0.774 |
|
| 2010 |
DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A. A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry Thin Solid Films. 518: 3910-3916. DOI: 10.1016/J.Tsf.2009.12.088 |
0.784 |
|
| 2008 |
Rosales-Yeomans D, DeNardis D, Borucki L, Suzuki T, Sampurno Y, Philipossian A. Evaluation of Pad Groove Designs under Reduced Slurry Flow Rate Conditions during Copper CMP Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2966692 |
0.731 |
|
| 2008 |
Rosales-Yeomans D, DeNardis D, Borucki L, Suzuki T, Philipossian A. Analysis of pads with slanted grooves for copper CMP Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2963345 |
0.788 |
|
| 2008 |
Rosales-Yeomans D, Denardis D, Borucki L, Philipossian A. Design and evaluation of pad grooves for copper CMP Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2963268 |
0.786 |
|
| 2007 |
Lee H, DeNardis D, Philipossian A, Seike Y, Takaoka M, Miyachi K, Furukawa S, Terada A, Zhuang Y, Borucki L. Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP Transactions On Electrical and Electronic Materials. 8: 67-72. DOI: 10.4313/Teem.2007.8.2.067 |
0.699 |
|
| 2007 |
Lee H, DeNardis D, Philipossian A, Seike Y, Takaoka M, Miyachi K, Doi T. Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System Transactions On Electrical and Electronic Materials. 8: 26-31. DOI: 10.4313/Teem.2007.8.1.026 |
0.691 |
|
| 2006 |
Denardis D, Doi T, Hiskey B, Ichikawa K, Ichikawa D, Philipossian A. Modeling copper CMP removal rate dependency on wafer pressure, velocity, and dissolved oxygen concentration Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2180627 |
0.691 |
|
| 2006 |
DeNardis D, Seike Y, Takaoka M, Miyachi K, Philipossian A. Investigation of high-pressure micro jet technology as an alternative to diamond disc conditioning in ILD CMP Wear. 260: 1224-1231. DOI: 10.1016/J.Wear.2005.08.002 |
0.626 |
|
| 2005 |
Denardis D, Doi T, Hiskey B, Ichikawa K, Ichikawa D, Philipossian A. Impact of gaseous additives on copper CMP in neutral and alkaline solutions using a CAP system Journal of the Electrochemical Society. 152. DOI: 10.1149/1.2042908 |
0.669 |
|
| 2005 |
Seike Y, Denardis D, Sugiyama M, Miyachi K, Doi T, Philipossian A. Development and analysis of a high-pressure micro jet pad conditioning system for interlayer dielectric chemical mechanical planarization Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 44: 1225-1231. DOI: 10.1143/Jjap.44.1225 |
0.6 |
|
| 2005 |
DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A. Characterization of copper-hydrogen peroxide film growth kinetics 2005 Proceedings - 22nd International Vlsi Multilevel Interconnection Conference, Vmic 2005. 620-624. DOI: 10.1016/J.Tsf.2006.02.010 |
0.748 |
|
| 2004 |
Sorooshian J, DeNardis D, Charns L, Li Z, Shadman F, Boning D, Hetherington D, Philipossian A. Arrhenius Characterization of ILD and Copper CMP Processes Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1635388 |
0.732 |
|
| 2003 |
DeNardis D, Sorooshian J, Habiro M, Rogers C, Philipossian A. Tribology and Removal Rate Characteristics of Abrasive-Free Slurries for Copper CMP Applications Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 42: 6809-6814. DOI: 10.1143/Jjap.42.6809 |
0.756 |
|
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