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Ming Kong, Ph.D.

Affiliations: 
2012 Mechanical Engineering University of Colorado, Boulder, Boulder, CO, United States 
Area:
Mechanical Engineering
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"Ming Kong"
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Y.C Lee grad student 2012 CU Boulder
 (Experimental and modeling studies on solder self-alignment for optoelectronic packaging.)

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Publications

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Kong M, Jeon S, Au H, et al. (2011) Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1523-1532
Kong M, Dai J, Lao J, et al. (2007) Crystallization of amorphous SiC and superhardness effect in TiN/SiC nanomultilayers Applied Surface Science. 253: 4734-4739
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