Mark J. Willey, Ph.D.
Affiliations: | 2007 | Columbia University, New York, NY |
Area:
Chemical EngineeringGoogle:
"Mark Willey"Parents
Sign in to add mentor| Alan C. West | grad student | 2007 | Columbia | |
| (Microfluidic studies of copper electroplating additives.) | ||||
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Publications
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| Hatch JJ, Willey MJ, Gewirth AA. (2011) Influence of aromatic functionality on quaternary ammonium levelers for Cu plating Journal of the Electrochemical Society. 158: D323-D329 |
| Gallaway JW, Willey MJ, West AC. (2009) Copper filling of 100 nm trenches using PEG, PPG, and a triblock copolymer as plating suppressors Journal of the Electrochemical Society. 156 |
| Gallaway JW, Willey MJ, West AC. (2009) Acceleration kinetics of PEG, PPG, and a triblock copolymer by SPS during copper electroplating Journal of the Electrochemical Society. 156 |
| Willey MJ, McInerney EJ. (2009) Adsorption and Desorption Kinetics of a Block Copolymer Wetting Agent Used in Copper Electroplating Journal of the Electrochemical Society. 156 |
| Willey MJ, Emekli U, West AC. (2008) Uniformity effects when electrodepositing Cu onto resistive substrates in the presence of organic additives Journal of the Electrochemical Society. 155 |
| Willey MJ, Reid J, West AC. (2007) Adsorption kinetics of polyvinylpyrrolidone during copper electrodeposition Electrochemical and Solid-State Letters. 10 |
| Willey MJ, West AC. (2007) SPS adsorption and desorption during copper electrodeposition and its impact on PEG adsorption Journal of the Electrochemical Society. 154 |
| Willey MJ, West AC. (2007) Nucleation on resistive substrates: Analysis of effect on film uniformity Electrochimica Acta. 52: 6484-6489 |
| Willey MJ, West AC. (2006) Microfluidic studies of adsorption and desorption of polyethylene glycol during copper electrodeposition Journal of the Electrochemical Society. 153 |
| Willey MJ, West AC. (2006) A microfluidic device to measure electrode response to changes in electrolyte composition Electrochemical and Solid-State Letters. 9 |