Year |
Citation |
Score |
2011 |
Hatch JJ, Willey MJ, Gewirth AA. Influence of aromatic functionality on quaternary ammonium levelers for Cu plating Journal of the Electrochemical Society. 158: D323-D329. DOI: 10.1149/1.3575636 |
0.478 |
|
2009 |
Gallaway JW, Willey MJ, West AC. Copper filling of 100 nm trenches using PEG, PPG, and a triblock copolymer as plating suppressors Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3142422 |
0.587 |
|
2009 |
Gallaway JW, Willey MJ, West AC. Acceleration kinetics of PEG, PPG, and a triblock copolymer by SPS during copper electroplating Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3078405 |
0.617 |
|
2009 |
Willey MJ, McInerney EJ. Adsorption and Desorption Kinetics of a Block Copolymer Wetting Agent Used in Copper Electroplating Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3058600 |
0.42 |
|
2008 |
Willey MJ, Emekli U, West AC. Uniformity effects when electrodepositing Cu onto resistive substrates in the presence of organic additives Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2837857 |
0.53 |
|
2007 |
Willey MJ, Reid J, West AC. Adsorption kinetics of polyvinylpyrrolidone during copper electrodeposition Electrochemical and Solid-State Letters. 10. DOI: 10.1149/1.2436653 |
0.67 |
|
2007 |
Willey MJ, West AC. SPS adsorption and desorption during copper electrodeposition and its impact on PEG adsorption Journal of the Electrochemical Society. 154. DOI: 10.1149/1.2431320 |
0.616 |
|
2007 |
Willey MJ, West AC. Nucleation on resistive substrates: Analysis of effect on film uniformity Electrochimica Acta. 52: 6484-6489. DOI: 10.1016/J.Electacta.2007.04.049 |
0.656 |
|
2006 |
Willey MJ, West AC. Microfluidic studies of adsorption and desorption of polyethylene glycol during copper electrodeposition Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2335587 |
0.612 |
|
2006 |
Willey MJ, West AC. A microfluidic device to measure electrode response to changes in electrolyte composition Electrochemical and Solid-State Letters. 9. DOI: 10.1149/1.2201253 |
0.597 |
|
2005 |
Zheng M, Willey M, West AC. Electrochemical nucleation of copper on ruthenium effect of Cl -, PEG, and SPS Electrochemical and Solid-State Letters. 8. DOI: 10.1149/1.2035701 |
0.64 |
|
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