Year |
Citation |
Score |
2022 |
Noh C, Han C, Won SM, Shin C. Vertical Gate-All-Around Device Architecture to Improve the Device Performance for Sub-5-nm Technology. Micromachines. 13. PMID 36144174 DOI: 10.3390/mi13091551 |
0.39 |
|
2022 |
Sun M, Baac HW, Shin C. Simulation Study: The Impact of Structural Variations on the Characteristics of a Buried-Channel-Array Transistor (BCAT) in DRAM. Micromachines. 13. PMID 36144099 DOI: 10.3390/mi13091476 |
0.395 |
|
2021 |
Park J, Jang W, Shin C. Gate-Stack Engineering to Improve the Performance of 28 nm Low-Power High-K/Metal-Gate Device. Micromachines. 12. PMID 34442508 DOI: 10.3390/mi12080886 |
0.361 |
|
2020 |
Yoon C, Moon S, Shin C. Study of a hysteresis window of FinFET and fully-depleted silicon-on-insulator (FDSOI) MOSFET with ferroelectric capacitor. Nano Convergence. 7: 19. PMID 32483648 DOI: 10.1186/S40580-020-00230-X |
0.376 |
|
2020 |
Choi Y, Shin J, Moon S, Shin C. Investigation on Threshold Voltage Adjustment of Threshold Switching Devices with HfO/AlO Superlattice on Transparent ITO/Glass Substrate. Micromachines. 11. PMID 32455725 DOI: 10.3390/Mi11050525 |
0.432 |
|
2020 |
Park J, Kim J, Showdhury S, Shin C, Rhee H, Yeo MS, Cho E, Yi J. Electrical Characteristics of Bulk FinFET According to Spacer Length Electronics. 9: 1283. DOI: 10.3390/Electronics9081283 |
0.421 |
|
2020 |
Yoon C, Shin C. Electrical Characteristics of Nanoelectromechanical Relay with Multi-Domain HfO2-Based Ferroelectric Materials Electronics. 9: 1208. DOI: 10.3390/Electronics9081208 |
0.339 |
|
2020 |
Moon S, Shin J, Shin C. Understanding of Polarization-Induced Threshold Voltage Shift in Ferroelectric-Gated Field Effect Transistor for Neuromorphic Applications Electronics. 9: 704. DOI: 10.3390/Electronics9050704 |
0.436 |
|
2020 |
Lee C, Sung J, Shin C. Understanding of Feedback Field-Effect Transistor and Its Applications Applied Sciences. 10: 3070. DOI: 10.3390/App10093070 |
0.306 |
|
2020 |
Lee C, Shin C. Study on Various Device Structures for Steep-Switching Silicon-on-Insulator Feedback Field-Effect Transistors Ieee Transactions On Electron Devices. 67: 1852-1858. DOI: 10.1109/Ted.2020.2975007 |
0.508 |
|
2020 |
Yoon C, Min J, Shin J, Shin C. Device Design Guideline for HfO₂-Based Ferroelectric-Gated Nanoelectromechanical System Ieee Journal of the Electron Devices Society. 8: 608-613. DOI: 10.1109/Jeds.2020.3001272 |
0.406 |
|
2020 |
Hong Y, Choi Y, Shin C. NCFET-Based 6-T SRAM: Yield Estimation Based on Variation-Aware Sensitivity Ieee Journal of the Electron Devices Society. 8: 182-188. DOI: 10.1109/Jeds.2020.2973966 |
0.357 |
|
2020 |
Seo J, Shin C. Experimental study of interface traps in MOS capacitor with Al-doped HfO2 Semiconductor Science and Technology. 35: 85029. DOI: 10.1088/1361-6641/Ab9847 |
0.333 |
|
2020 |
Jung T, Shin C. Device-design optimization of ferroelectric-gated vertical tunnel field-effect transistor to suppress ambipolar current Semiconductor Science and Technology. 35: 85010. DOI: 10.1088/1361-6641/Ab8E63 |
0.453 |
|
2020 |
Choi Y, Hong Y, Ko E, Shin C. Optimization of double metal-gate InAs/Si heterojunction nanowire TFET Semiconductor Science and Technology. 35: 75024. DOI: 10.1088/1361-6641/Ab8B1F |
0.342 |
|
2020 |
Wang CW, Ku H, Chiu CY, De S, Qiu BH, Shin C, Lu D. Compact model for PZT ferroelectric capacitors with voltage dependent switching behavior Semiconductor Science and Technology. 35: 55033. DOI: 10.1088/1361-6641/Ab7C79 |
0.385 |
|
2020 |
Park J, Shin C. Study of random dopant fluctuation in PNPN feedback FET Semiconductor Science and Technology. 35: 35019. DOI: 10.1088/1361-6641/Ab7146 |
0.449 |
|
2020 |
Choi Y, Hong Y, Shin C. Device design guideline for junctionless gate-all-around nanowire negative-capacitance FET with HfO2-based ferroelectric gate stack Semiconductor Science and Technology. 35: 15011. DOI: 10.1088/1361-6641/Ab5775 |
0.488 |
|
2020 |
Min J, Shin C. Study of Line Edge Roughness on Various Types of Gate-All-Around Field Effect Transistor Semiconductor Science and Technology. 35: 15004. DOI: 10.1088/1361-6641/Ab52E4 |
0.369 |
|
2020 |
Yoon C, Shin C. Time-resolved electrical characteristics of ferroelectric-gated fully depleted silicon on insulator devices Solid-State Electronics. 164: 107698. DOI: 10.1016/J.Sse.2019.107698 |
0.445 |
|
2020 |
Choe K, Park J, Shin C. Theoretical study of ferroelectric-gated nanoelectromechanical diode nonvolatile memory cell Solid-State Electronics. 163: 107662. DOI: 10.1016/J.Sse.2019.107662 |
0.323 |
|
2020 |
Min J, Choe G, Shin C. Gate-induced drain leakage (GIDL) in MFMIS and MFIS negative capacitance FinFETs Current Applied Physics. 20: 1222-1225. DOI: 10.1016/J.Cap.2020.08.008 |
0.401 |
|
2019 |
Kim J, Heo K, Kang DH, Shin C, Lee S, Yu HY, Park JH. Rhenium Diselenide (ReSe) Near-Infrared Photodetector: Performance Enhancement by Selective p-Doping Technique. Advanced Science (Weinheim, Baden-Wurttemberg, Germany). 6: 1901255. PMID 31728284 DOI: 10.1002/Advs.201901255 |
0.34 |
|
2019 |
Oh C, Tewari A, Kim K, Ulayil SK, Shin C, Ahn M, Jeon S. Comprehensive study of high pressure annealing on the ferroelectric properties of Hf0.5Zr0.5O2 thin films. Nanotechnology. PMID 31426039 DOI: 10.1088/1361-6528/Ab3C8F |
0.363 |
|
2019 |
Shim J, Jang SW, Lim JH, Kim H, Kang DH, Kim KH, Seo S, Heo K, Shin C, Yu HY, Lee S, Ko DH, Park JH. Polarity control in a single transition metal dichalcogenide (TMD) transistor for homogeneous complementary logic circuits. Nanoscale. PMID 31243409 DOI: 10.1039/C9Nr03441B |
0.471 |
|
2019 |
Ko E, Shin J, Shin C. Steep Slope Silicon-on-Insulator Field Effect Transistor with Negative Capacitance: Analysis on Hysteresis. Journal of Nanoscience and Nanotechnology. 19: 6128-6130. PMID 31026921 DOI: 10.1166/Jnn.2019.16990 |
0.448 |
|
2019 |
Park J, Shin C. Process-Induced Random Variation: Work-Function Variation in Stacked Nanowire Field Effect Transistor. Journal of Nanoscience and Nanotechnology. 19: 6091-6094. PMID 31026914 DOI: 10.1166/Jnn.2019.16993 |
0.474 |
|
2019 |
Cho H, Shin J, Shin C. Impact of Ferroelectric Capacitor's Electrode Area on the Performance of Negative Capacitance Field Effect Transistor. Journal of Nanoscience and Nanotechnology. 19: 6087-6090. PMID 31026913 DOI: 10.1166/Jnn.2019.16991 |
0.464 |
|
2019 |
Choe K, Shin C. Ferroelectric-Gated Nanoelectromechanical Nonvolatile Memory Cell Ieee Transactions On Electron Devices. 66: 407-412. DOI: 10.1109/Ted.2018.2881201 |
0.345 |
|
2019 |
Lee C, Ko E, Shin C. Steep Slope Silicon-On-Insulator Feedback Field-Effect Transistor: Design and Performance Analysis Ieee Transactions On Electron Devices. 66: 286-291. DOI: 10.1109/Ted.2018.2879653 |
0.486 |
|
2019 |
Yoon JS, Tewari A, Shin C, Jeon S. Influence of High-Pressure Annealing on Memory Properties of Hf 0.5 Zr 0.5 O 2 Based 1T-FeRAM Ieee Electron Device Letters. 40: 1076-1079. DOI: 10.1109/Led.2019.2918797 |
0.365 |
|
2019 |
Park J, Shin C. Tunnel Field-Effect Transistor With Segmented Channel Ieee Journal of the Electron Devices Society. 7: 621-625. DOI: 10.1109/Jeds.2019.2919331 |
0.448 |
|
2019 |
Shin J, Shin C. External Resistor-Free Gate Configuration Phase Transition FDSOI MOSFET Ieee Journal of the Electron Devices Society. 7: 186-190. DOI: 10.1109/Jeds.2018.2888888 |
0.465 |
|
2019 |
Park J, Shin C. Study of work-function variation in stacked multiple-channel-structure device Semiconductor Science and Technology. 34: 125003. DOI: 10.1088/1361-6641/Ab4B7D |
0.395 |
|
2019 |
Shin C. Experimental understanding of polarization switching in PZT ferroelectric capacitor Semiconductor Science and Technology. 34: 75004. DOI: 10.1088/1361-6641/Ab1D2E |
0.351 |
|
2019 |
Shin J, Shin C. DIBL improvement in hysteresis-free and ferroelectric-gated FinFETs Semiconductor Science and Technology. 34: 65001. DOI: 10.1088/1361-6641/Ab13Fc |
0.382 |
|
2019 |
Cho H, Shin C. DIBL enhancement in ferroelectric-gated FinFET Semiconductor Science and Technology. 34: 25004. DOI: 10.1088/1361-6641/Aaf518 |
0.458 |
|
2019 |
Shin J, Shin C. Experimental observation of zero DIBL in short-channel hysteresis-free ferroelectric-gated FinFET Solid-State Electronics. 153: 12-15. DOI: 10.1016/J.Sse.2018.12.012 |
0.476 |
|
2019 |
Shin S, Koh CW, Vincent P, Goo JS, Bae J, Lee J, Shin C, Kim H, Woo HY, Shim JW. Ultra-thick semi-crystalline photoactive donor polymer for efficient indoor organic photovoltaics Nano Energy. 58: 466-475. DOI: 10.1016/J.Nanoen.2019.01.061 |
0.373 |
|
2019 |
Choi H, Park J, Shim JW, Shin C. Negative quantum capacitance effect from Bi2Te1.5Se1.5 with frequency dependent capacitance of polyvinyl alcohol (PVA) film in MOS structure Applied Surface Science. 463: 1046-1050. DOI: 10.1016/J.Apsusc.2018.09.051 |
0.422 |
|
2019 |
Choi H, Shin C. Negative Capacitance Transistor with Two‐Dimensional Channel Material (Molybdenum disulfide, MoS2) Physica Status Solidi (a). 216: 1900177. DOI: 10.1002/Pssa.201900177 |
0.37 |
|
2018 |
Cho K, Shin C. Simulation Techniques for Nanoelectromechanical (NEM) Relay. Journal of Nanoscience and Nanotechnology. 18: 6615-6618. PMID 29677845 DOI: 10.1166/Jnn.2018.15701 |
0.416 |
|
2018 |
Ko E, Shin J, Shin C. Steep switching devices for low power applications: negative differential capacitance/resistance field effect transistors. Nano Convergence. 5: 2. PMID 29399434 DOI: 10.1186/S40580-018-0135-4 |
0.422 |
|
2018 |
Nam H, Shin C, Park J. Impact of the Metal-Gate Material Properties in FinFET (Versus FD-SOI MOSFET) on High- $\kappa$ /Metal-Gate Work-Function Variation Ieee Transactions On Electron Devices. 65: 4780-4785. DOI: 10.1109/Ted.2018.2872586 |
0.444 |
|
2018 |
Shin J, Ko E, Shin C. Analysis on the Operation of Negative Differential Resistance FinFET With Pb(Zr 0.52 Ti 0.48 )O 3 Threshold Selector Ieee Transactions On Electron Devices. 65: 19-22. DOI: 10.1109/Ted.2017.2773042 |
0.426 |
|
2018 |
Shin J, Ko E, Park J, Kim SG, Lee JW, Yu H, Shin C. Super steep-switching (SS ≈ 2 mV/decade) phase-FinFET with Pb(Zr0.52Ti0.48)O3 threshold switching device Applied Physics Letters. 113: 102104. DOI: 10.1063/1.5030966 |
0.413 |
|
2017 |
Kim GS, Kim SH, Lee TI, Cho BJ, Choi C, Shin C, Shim JH, Kim J, Yu HY. Fermi-Level Unpinning Technique with Excellent Thermal Stability for n-type Germanium. Acs Applied Materials & Interfaces. PMID 28952716 DOI: 10.1021/Acsami.7B10346 |
0.31 |
|
2017 |
Yeom SW, You B, Cho K, Jung HY, Park J, Shin C, Ju BK, Kim JW. Silver Nanowire/Colorless-Polyimide Composite Electrode: Application in Flexible and Transparent Resistive Switching Memory. Scientific Reports. 7: 3438. PMID 28611411 DOI: 10.1038/S41598-017-03746-1 |
0.305 |
|
2017 |
Choi H, Shin J, Shin C. Impact of Source/Drain Metal Work Function on the Electrical Characteristics of Anatase TiO2-Based Thin Film Transistors Ecs Journal of Solid State Science and Technology. 6: 379. DOI: 10.1149/2.0121707Jss |
0.42 |
|
2017 |
Jo J, Kim MG, Lee H, Choi H, Shin C. Transconductance Amplification by the Negative Capacitance in Ferroelectric-Gated P3HT Thin-Film Transistor Ieee Transactions On Electron Devices. 64: 4974-4979. DOI: 10.1109/Ted.2017.2764508 |
0.438 |
|
2017 |
Choe K, Shin C. Adjusting the Operating Voltage of an Nanoelectromechanical Relay Using Negative Capacitance Ieee Transactions On Electron Devices. 64: 5270-5273. DOI: 10.1109/Ted.2017.2756676 |
0.448 |
|
2017 |
Park J, Shin C. Impact of Interface Traps and Surface Roughness on the Device Performance of Stacked-Nanowire FETs Ieee Transactions On Electron Devices. 64: 4025-4030. DOI: 10.1109/Ted.2017.2741979 |
0.389 |
|
2017 |
Lee Y, Shin C. Impact of Equivalent Oxide Thickness on Threshold Voltage Variation Induced by Work-Function Variation in Multigate Devices Ieee Transactions On Electron Devices. 64: 2452-2456. DOI: 10.1109/Ted.2017.2673859 |
0.46 |
|
2017 |
Lee H, Yoon Y, Shin C. Current-Voltage Model for Negative Capacitance Field-Effect Transistors Ieee Electron Device Letters. 38: 669-672. DOI: 10.1109/Led.2017.2679102 |
0.46 |
|
2017 |
Ko E, Lee JW, Shin C. Negative Capacitance FinFET With Sub-20-mV/decade Subthreshold Slope and Minimal Hysteresis of 0.48 V Ieee Electron Device Letters. 38: 418-421. DOI: 10.1109/Led.2017.2672967 |
0.408 |
|
2017 |
Ko E, Lee H, Goh Y, Jeon S, Shin C. Sub-60-mV/decade Negative Capacitance FinFET With Sub-10-nm Hafnium-Based Ferroelectric Capacitor Ieee Journal of the Electron Devices Society. 5: 306-309. DOI: 10.1109/Jeds.2017.2731401 |
0.482 |
|
2017 |
Ku H, Shin C. Transient Response of Negative Capacitance in P(VDF 0.75 -TrFE 0.25 ) Organic Ferroelectric Capacitor Ieee Journal of the Electron Devices Society. 5: 232-236. DOI: 10.1109/Jeds.2017.2670546 |
0.329 |
|
2017 |
Ko E, Shin C. Effective drive current in steep slope FinFET (vs. conventional FinFET) Applied Physics Letters. 111: 152105. DOI: 10.1063/1.4998508 |
0.481 |
|
2017 |
Hong SB, Park JH, Lee TH, Lim JH, Shin C, Park YW, Kim TG. Variation of poly-Si grain structures under thermal annealing and its effect on the performance of TiN/Al2O3/Si3N4/SiO2/poly-Si capacitors Applied Surface Science. 477: 104-110. DOI: 10.1016/J.Apsusc.2017.11.226 |
0.35 |
|
2017 |
Choi H, Kim TG, Shin C. Measurement of the quantum capacitance from two-dimensional surface state of a topological insulator at room temperature Applied Surface Science. 407: 16-20. DOI: 10.1016/J.Apsusc.2017.02.090 |
0.401 |
|
2016 |
Kim GS, Kim SW, Kim SH, Park J, Seo Y, Cho BJ, Shin C, Shim JH, Yu HY. Effective Schottky Barrier Height Lowering of Metal/n-Ge with a TiO2/GeO2 Interlayer Stack. Acs Applied Materials & Interfaces. PMID 27977113 DOI: 10.1021/Acsami.6B10947 |
0.384 |
|
2016 |
Lee H, Cho K, Shin C, Shin H. Impact of Trap Position on Random Telegraph Noise in a 70-Å Nanowire Field-Effect Transistor Journal of Semiconductor Technology and Science. 16: 185-190. DOI: 10.5573/Jsts.2016.16.2.185 |
0.44 |
|
2016 |
Ko E, Lee H, Park J, Shin C. Vertical Tunnel FET: Design Optimization With Triple Metal-Gate Layers Ieee Transactions On Electron Devices. 63: 5030-5035. DOI: 10.1109/Ted.2016.2619372 |
0.507 |
|
2016 |
Park J, Lee H, Oh S, Shin C. Design for Variation-Immunity in Sub-10-nm Stacked-Nanowire FETs to Suppress LER-induced Random Variations Ieee Transactions On Electron Devices. 63: 5048-5054. DOI: 10.1109/Ted.2016.2615868 |
0.36 |
|
2016 |
Oh S, Shin C. 3-D Quasi-Atomistic Model for Line Edge Roughness in Nonplanar MOSFETs Ieee Transactions On Electron Devices. 63: 4617-4623. DOI: 10.1109/Ted.2016.2614490 |
0.437 |
|
2016 |
Shin C, Kim JK, Kim GS, Lee H, Cho BJ, Yu HY. Random Dopant Fluctuation-Induced Threshold Voltage Variation-Immune Ge FinFET With Metal-Interlayer-Semiconductor Source/Drain Ieee Transactions On Electron Devices. DOI: 10.1109/Ted.2016.2606511 |
0.406 |
|
2016 |
Nam H, Lee Y, Park J, Shin C. Study of Work-Function Variation in High- $\kappa $ /Metal-Gate Gate-All-Around Nanowire MOSFET Ieee Transactions On Electron Devices. 63: 3338-3341. DOI: 10.1109/Ted.2016.2574328 |
0.389 |
|
2016 |
Lee H, Park JD, Shin C. Study of Random Variation in Germanium-Source Vertical Tunnel FET Ieee Transactions On Electron Devices. DOI: 10.1109/Ted.2016.2539209 |
0.43 |
|
2016 |
Lee H, Park J, Shin C. Performance Booster for Vertical Tunnel Field-Effect Transistor: Field-Enhanced High- $\kappa $ Layer Ieee Electron Device Letters. 37: 1383-1386. DOI: 10.1109/Led.2016.2606660 |
0.41 |
|
2016 |
Kim GS, Yoo G, Seo Y, Kim SH, Cho K, Cho BJ, Shin C, Park JH, Yu HY. Effect of Hydrogen Annealing on Contact Resistance Reduction of Metal-Interlayer-n-Germanium Source/Drain Structure Ieee Electron Device Letters. 37: 709-712. DOI: 10.1109/Led.2016.2558582 |
0.37 |
|
2016 |
Ahn J, Kim JK, Kim SW, Kim GS, Shin C, Cho BJ, Yu HY. Effect of Metal Nitride on Contact Resistivity of Metal-Interlayer-Ge Source/Drain in Sub-10-nm n-Type Ge FinFET Ieee Electron Device Letters. 37: 705-708. DOI: 10.1109/Led.2016.2553132 |
0.344 |
|
2016 |
Jo J, Shin C. Negative capacitance field effect transistor with hysteresis-free sub-60-mV/decade switching Ieee Electron Device Letters. 37: 245-248. DOI: 10.1109/Led.2016.2523681 |
0.456 |
|
2016 |
Choi H, Lee H, Park J, Yu H, Kim TG, Shin C. Experimental evidence of negative quantum capacitance in topological insulator for sub-60-mV/decade steep switching device Applied Physics Letters. 109: 203505. DOI: 10.1063/1.4968183 |
0.41 |
|
2016 |
Shin C, Kim JK, Yu HY. Threshold voltage variation-immune FinFET design with metal-interlayer-semiconductor source/drain structure Current Applied Physics. 16: 618-622. DOI: 10.1016/J.Cap.2016.03.006 |
0.418 |
|
2015 |
Jo J, Choi WY, Park JD, Shim JW, Yu HY, Shin C. Negative Capacitance in Organic/Ferroelectric Capacitor to Implement Steep Switching MOS Devices. Nano Letters. 15: 4553-6. PMID 26103511 DOI: 10.1021/Acs.Nanolett.5B01130 |
0.483 |
|
2015 |
Jung H, Chae SY, Shin C, Min BK, Joo OS, Hwang YJ. Effect of the Si/TiO2/BiVO4 heterojunction on the onset potential of photocurrents for solar water oxidation. Acs Applied Materials & Interfaces. 7: 5788-96. PMID 25720751 DOI: 10.1021/Am5086484 |
0.314 |
|
2015 |
Oh S, Shin C, Kwon W. A compact effective-current model for power performance analysis on state-of-the-art technology development and benchmarking Japanese Journal of Applied Physics. 54: 124302. DOI: 10.7567/Jjap.54.124302 |
0.385 |
|
2015 |
Oh S, Jo J, Lee H, Lee GS, Park JD, Shin C. Worst case sampling method with confidence ellipse for estimating the impact of random variation on static random access memory (SRAM) Journal of Semiconductor Technology and Science. 15: 374-380. DOI: 10.5573/Jsts.2015.15.3.374 |
0.302 |
|
2015 |
Kwon W, Park IJ, Shin C. Highly Scalable NAND Flash Memory Cell Design Embracing Backside Charge Storage Journal of Semiconductor Technology and Science. 15: 286-291. DOI: 10.5573/Jsts.2015.15.2.286 |
0.378 |
|
2015 |
Park S, Lee JH, Shin C. Impact of the double-patterning technique on the LER-induced threshold voltage variation in symmetric tunnel field-effect transistor Ieice Electronics Express. 12: 20150349-20150349. DOI: 10.1587/Elex.12.20150349 |
0.385 |
|
2015 |
Lee Y, Nam H, Park JD, Shin C. Study of work-function variation for high-κ/metal-gate Ge-source tunnel field-effect transistors Ieee Transactions On Electron Devices. 62: 2143-2147. DOI: 10.1109/Ted.2015.2436815 |
0.463 |
|
2015 |
Lee H, Park S, Lee Y, Nam H, Shin C. Random Variation Analysis and Variation-Aware Design of Symmetric Tunnel Field-Effect Transistor Ieee Transactions On Electron Devices. 62: 1778-1783. DOI: 10.1109/Ted.2014.2365805 |
0.464 |
|
2015 |
Lee GS, Shin C. Worst case sampling method to estimate the impact of random variation on static random access memory Ieee Transactions On Electron Devices. 62: 1705-1709. DOI: 10.1109/Ted.2014.2361913 |
0.342 |
|
2015 |
Kim SH, Kim GS, Kim JK, Park JH, Shin C, Choi C, Yu HY. Fermi-Level Unpinning Using a Ge-Passivated Metal-Interlayer-Semiconductor Structure for Non-Alloyed Ohmic Contact of High-Electron-Mobility Transistors Ieee Electron Device Letters. 36: 884-886. DOI: 10.1109/Led.2015.2453479 |
0.385 |
|
2015 |
Kim GS, Kim SH, Kim JK, Shin C, Park JH, Saraswat KC, Cho BJ, Yu HY. Surface Passivation of Germanium Using SF6 Plasma to Reduce Source/Drain Contact Resistance in Germanium n-FET Ieee Electron Device Letters. 36: 745-747. DOI: 10.1109/Led.2015.2440434 |
0.505 |
|
2015 |
Jo J, Shin C. Impact of temperature on negative capacitance field-effect transistor Electronics Letters. 51: 106-108. DOI: 10.1049/El.2014.3515 |
0.403 |
|
2015 |
Jo J, Shin C. Experimental observation of voltage amplification using negative capacitance for sub-60 mV/decade CMOS devices Current Applied Physics. 15: 352-355. DOI: 10.1016/J.Cap.2014.12.029 |
0.471 |
|
2015 |
Nam H, Cho MH, Shin C. Symmetric tunnel field-effect transistor (S-TFET) Current Applied Physics. 15: 71-77. DOI: 10.1016/J.Cap.2014.11.006 |
0.471 |
|
2014 |
Nam H, Park S, Shin C. Performance and Variation-Immunity Benefits of Segmented-Channel MOSFETs (SegFETs) Using HfO 2 or SiO 2 Trench Isolation Journal of Semiconductor Technology and Science. 14: 427-435. DOI: 10.5573/Jsts.2014.14.4.427 |
0.318 |
|
2014 |
Shin C. Assistive circuit for lowering minimum operating voltage and balancing read/write margins in an SRAM array Journal of Semiconductor Technology and Science. 14: 184-188. DOI: 10.5573/Jsts.2014.14.2.184 |
0.365 |
|
2014 |
Lee GS, Shin C. Computing-inexpensive matrix model for estimating the threshold voltage variation by workfunction variation in high-κ/metal-gate MOSFETs Journal of Semiconductor Technology and Science. 14: 96-99. DOI: 10.5573/Jsts.2014.14.1.096 |
0.387 |
|
2014 |
Nam H, Lee GS, Lee H, Park IJ, Shin C. Analysis of Random Variations and Variation-Robust Advanced Device Structures Journal of Semiconductor Technology and Science. 14: 8-22. DOI: 10.5573/Jsts.2014.14.1.008 |
0.444 |
|
2014 |
Shin C. State-of-the-art silicon device miniaturization technology and its challenges Ieice Electronics Express. 11. DOI: 10.1587/Elex.11.20142005 |
0.388 |
|
2014 |
Shin C, Lee GG, Han DH, Han SP, Tokumitsu E, Ohmi SI, Kim DJ, Ishiwara H, Park M, Kim SH, Lee WG, Hwang YJ, Park BE. Experimental demonstration of a ferroelectric FET using paper substrate Ieice Electronics Express. 11. DOI: 10.1587/Elex.11.20140447 |
0.436 |
|
2014 |
Park IJ, Jeon SG, Shin C. A new slit-type vacuum-channel transistor Ieee Transactions On Electron Devices. 61: 4186-4191. DOI: 10.1109/Ted.2014.2361912 |
0.463 |
|
2014 |
Nam H, Shin C. Impact of current flow shape in tapered (versus rectangular) FinFET on threshold voltage variation induced by work-function variation Ieee Transactions On Electron Devices. 61: 2007-2011. DOI: 10.1109/Ted.2014.2318696 |
0.395 |
|
2014 |
Kim JK, Kim GS, Nam H, Shin C, Park JH, Cho BJ, Saraswat KC, Yu HY. The efficacy of metal-interfacial layer-semiconductor source/drain structure on sub-10-nm n-type ge FinFET performances Ieee Electron Device Letters. 35: 1185-1187. DOI: 10.1109/Led.2014.2364574 |
0.519 |
|
2014 |
Kim GS, Kim JK, Kim SH, Jo J, Shin C, Park JH, Saraswat KC, Yu HY. Specific contact resistivity reduction through Ar plasma-treated TiO2-x interfacial layer to metal/Ge contact Ieee Electron Device Letters. 35: 1076-1078. DOI: 10.1109/Led.2014.2354679 |
0.503 |
|
2014 |
Kim JK, Kim GS, Shin C, Park JH, Saraswat KC, Yu HY. Analytical study of interfacial layer doping effect on contact resistivity in metal-interfacial layer-Ge structure Ieee Electron Device Letters. 35: 705-707. DOI: 10.1109/Led.2014.2323256 |
0.526 |
|
2013 |
Park IJ, Shin C. Monte Carlo Simulation Study: the effects of double- patterning versus single-patterning on the line-edge- roughness (LER) in FDSOI Tri-gate MOSFETs Journal of Semiconductor Technology and Science. 13: 511-515. DOI: 10.5573/Jsts.2013.13.5.511 |
0.384 |
|
2013 |
Park IJ, Shin C. Effect of double-patterning and double-etching on the line-edge-roughness of multi-gate bulk MOSFETs Ieice Electronics Express. 10: 20130108-20130108. DOI: 10.1587/Elex.10.20130108 |
0.321 |
|
2013 |
Damrongplasit N, Kim SH, Shin C, Liu TK. Impact of Gate Line-Edge Roughness (LER) Versus Random Dopant Fluctuations (RDF) on Germanium-Source Tunnel FET Performance Ieee Transactions On Nanotechnology. 12: 1061-1067. DOI: 10.1109/Tnano.2013.2278153 |
0.456 |
|
2013 |
Ho B, Sun X, Shin C, Liu TK. Design Optimization of Multigate Bulk MOSFETs Ieee Transactions On Electron Devices. 60: 28-33. DOI: 10.1109/Ted.2012.2224870 |
0.678 |
|
2013 |
Nam H, Shin C. Study of high-k/metal-gate work function variation in FinFET: The modified RGG concept Ieee Electron Device Letters. 34: 1560-1562. DOI: 10.1109/Led.2013.2287283 |
0.432 |
|
2013 |
Shin C, Park IJ. Impact of Using Double-Patterning Versus Single-Patterning on Threshold Voltage $(V_{\rm TH})$ Variation in Quasi-Planar Tri-Gate Bulk MOSFETs Ieee Electron Device Letters. 34: 578-580. DOI: 10.1109/Led.2013.2249653 |
0.41 |
|
2013 |
Nam H, Shin C. Study of high-k/metal-gate work-function variation using rayleigh distribution Ieee Electron Device Letters. 34: 532-534. DOI: 10.1109/Led.2013.2247376 |
0.384 |
|
2011 |
Damrongplasit N, Shin C, Kim SH, Vega RA, King Liu TJ. Study of random dopant fluctuation effects in Germanium-source tunnel FETs Ieee Transactions On Electron Devices. 58: 3541-3548. DOI: 10.1109/Ted.2011.2161990 |
0.744 |
|
2011 |
Sun X, Moroz V, Damrongplasit N, Shin C, Liu TJK. Variation study of the planar ground-plane bulk MOSFET, SOI FinFET, and trigate bulk MOSFET designs Ieee Transactions On Electron Devices. 58: 3294-3299. DOI: 10.1109/Ted.2011.2161479 |
0.508 |
|
2011 |
Shin C, Damrongplasit N, Sun X, Tsukamoto Y, Nikolic B, Liu TJK. Performance and yield benefits of quasi-planar bulk CMOS technology for 6-T SRAM at the 22-nm node Ieee Transactions On Electron Devices. 58: 1846-1854. DOI: 10.1109/Ted.2011.2139213 |
0.512 |
|
2011 |
Shin C, Tsai CH, Wu MH, Chang CF, Liu YR, Kao CY, Lin GS, Chiu KL, Fu CS, Tsai CT, Liang CW, Nikolić B, Liu TJK. Quasi-planar bulk CMOS technology for improved SRAM scalability Solid-State Electronics. 65: 184-190. DOI: 10.1016/J.Sse.2011.06.022 |
0.391 |
|
2010 |
Shin C, Cho MH, Tsukamoto Y, Nguyen B, Mazuré C, Nikolić B, Liu TK. Performance and Area Scaling Benefits of FD-SOI Technology for 6-T SRAM Cells at the 22-nm Node Ieee Transactions On Electron Devices. 57: 1301-1309. DOI: 10.1109/Ted.2010.2046070 |
0.425 |
|
2009 |
Shin C, Sun X, Liu TK. Study of Random-Dopant-Fluctuation (RDF) Effects for the Trigate Bulk MOSFET Ieee Transactions On Electron Devices. 56: 1538-1542. DOI: 10.1109/Ted.2009.2020321 |
0.565 |
|
2008 |
Sun X, Lu Q, Moroz V, Takeuchi H, Gebara G, Wetzel J, Ikeda S, Shin C, King Liu TJ. Tri-gate bulk MOSFET design for CMOS scaling to the end of the roadmap Ieee Electron Device Letters. 29: 491-493. DOI: 10.1109/Led.2008.919795 |
0.751 |
|
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