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Fei Chai, Ph.D. - Publications

Affiliations: 
2013 Mechanical Engineering University of Maryland, College Park, College Park, MD 
Area:
Mechanical Engineering
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2 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2014 Chai F, Osterman M, Pecht M. Strain-range-based solder life predictions under temperature cycling with varying amplitude and mean Ieee Transactions On Device and Materials Reliability. 14: 351-357. DOI: 10.1109/Tdmr.2013.2273121  0.404
2012 Chai F, Osterman M, Pecht M. Reliability of gull-wing and leadless packages subjected to temperature cycling after rework Ieee Transactions On Device and Materials Reliability. 12: 510-519. DOI: 10.1109/Tdmr.2012.2191786  0.396
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