Ferdous Sarwar, Ph.D. - Publications
Affiliations: | 2012 | Industrial and Manufacturing Engineering | North Dakota State University, Fargo, ND, United States |
Area:
Packaging Engineering, Mechanical Engineering, Electronics and Electrical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2020 | Sarwar F, Chowdhury NH, Uddin SH. Modelling and optimisation of facility layout problem using firefly algorithm International Journal of Services and Operations Management. 36: 189-203. DOI: 10.1504/Ijsom.2020.10028977 | 0.315 | |||
2012 | Sarwar F, Marinov VR. Reliability of embedded ultrathin chips subjected to cyclic stresses Journal of Microelectronics and Electronic Packaging. 9: 104-111. DOI: 10.4071/Imaps.330 | 0.603 | |||
2012 | Marinov V, Swenson O, Miller R, Sarwar F, Atanasov Y, Semler M, Datta S. Laser-enabled advanced packaging of ultrathin bare dice in flexible substrates Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 569-577. DOI: 10.1109/Tcpmt.2011.2176941 | 0.3 | |||
2011 | Sarwar F, Chen Z, Wu J, Webster DC, Marinov VR. Excimer laser ablation of high aspect ratio microvias using a novel sensitizer-enhanced photopolymer Journal of Microelectronics and Electronic Packaging. 8: 66-71. DOI: 10.4071/Imaps.294 | 0.607 | |||
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