Year |
Citation |
Score |
2015 |
Semler MR, Hoey JM, Guruvenket S, Swenson OF, Hobbie EK. Impact of substrate composition on the morphology and conductivity of laser-crystallized silicon films Applied Physics a: Materials Science and Processing. DOI: 10.1007/S00339-015-9354-2 |
0.411 |
|
2014 |
Semler MR, Hoey JM, Guruvenket S, Gette CR, Swenson OF, Hobbie EK. Structural and electronic characterization of 355 nm laser-crystallized silicon: Interplay of film thickness and laser fluence Journal of Applied Physics. 115. DOI: 10.1063/1.4872464 |
0.333 |
|
2013 |
Marinov VR, Swenson O, Atanasov Y, Schneck N. Laser-assisted ultrathin bare die packaging: A route to a new class of microelectronic devices Proceedings of Spie - the International Society For Optical Engineering. 8608. DOI: 10.1117/12.2004344 |
0.311 |
|
2013 |
Marinov VR, Swenson O, Atanasov Y, Schneck N. Laser-assisted ultrathin die packaging: Insights from a process study Microelectronic Engineering. 101: 23-30. DOI: 10.1016/J.Mee.2012.08.016 |
0.325 |
|
2012 |
Iyer GR, Hobbie EK, Guruvenket S, Hoey JM, Anderson KJ, Lovaasen J, Gette C, Schulz DL, Swenson OF, Elangovan A, Boudjouk P. Solution-based synthesis of crystalline silicon from liquid silane through laser and chemical annealing. Acs Applied Materials & Interfaces. 4: 2680-5. PMID 22545711 DOI: 10.1021/Am300334P |
0.434 |
|
2012 |
Miller R, Marinov V, Swenson O, Chen Z, Semler M. Noncontact selective laser-assisted placement of thinned semiconductor dice Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 971-978. DOI: 10.1109/Tcpmt.2012.2183594 |
0.336 |
|
2012 |
Marinov V, Swenson O, Miller R, Sarwar F, Atanasov Y, Semler M, Datta S. Laser-enabled advanced packaging of ultrathin bare dice in flexible substrates Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 569-577. DOI: 10.1109/Tcpmt.2011.2176941 |
0.315 |
|
2010 |
Schulz DL, Hoey JM, Thompson D, Swenson OF, Han S, Lovaasen J, Dai X, Braun C, Keller K, Akhatov IS. Collimated aerosol beam deposition: sub-5-μm resolution of printed actives and passives Ieee Transactions On Advanced Packaging. 33: 421-427. DOI: 10.1109/Tadvp.2009.2038615 |
0.335 |
|
2008 |
Khan A, Rasmussen N, Marinov V, Swenson OF. Laser Sintering of Silver Nanomaterial on Polymer Substrates Journal of Microelectronics and Electronic Packaging. 5: 77-86. DOI: 10.4071/1551-4897-5.2.77 |
0.309 |
|
2008 |
Khan A, Rasmussen N, Marinov V, Swenson OF. Laser sintering of direct write silver nano-ink conductors for microelectronic applications Proceedings of Spie - the International Society For Optical Engineering. 6879. DOI: 10.1117/12.759164 |
0.323 |
|
2008 |
Han S, Dai X, Loy P, Lovaasen J, Huether J, Hoey JM, Wagner A, Sandstrom J, Bunzow D, Swenson OF, Akhatov IS, Schulz DL. Printed silicon as diode and FET materials - Preliminary results Journal of Non-Crystalline Solids. 354: 2623-2626. DOI: 10.1016/J.Jnoncrysol.2007.10.090 |
0.498 |
|
1983 |
Swenson OF, Luke TE, Hengehold RL. Luminescence study of thallium implanted silicon Journal of Applied Physics. 54: 6329-6335. DOI: 10.1063/1.331907 |
0.326 |
|
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