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Fred Barlow - Publications

Affiliations: 
1999-2006 University of Arkansas, Fayetteville, Fayetteville, AR, United States 
 2006-2015 Electrical and Computer Engineering University of Idaho, Moscow, ID, United States 
 2015-2019 University of Alaska Anchorage 
 2019- Engineering and Engineering Technology Metropolitan State University of Denver 
Area:
Electronics and Electrical Engineering, Materials Science Engineering, Inorganic Chemistry
Website:
https://webapp.msudenver.edu/directory/profile.php?uName=fbarlow1
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15 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2014 Barannyk LL, Aboutaleb HA, Elshabini A, Barlow F. Causality Verification Using Polynomial Periodic Continuations for Electrical Interconnects Journal of Microelectronics and Electronic Packaging. 11: 181-196. DOI: 10.4071/Imaps.428  0.608
2013 Tork HS, Elshabini A, Barlow F. Tunable BaSrTiO3, BaZrTiO3 Ferroelectric Capacitors Embedded Inside Low Temperature Cofired Ceramics (LTCC) Journal of Microelectronics and Electronic Packaging. 10: 95-101. DOI: 10.4071/Imaps.380  0.653
2013 Xu F, Han TJ, Jiang D, Tolbert LM, Wang F, Nagashima J, Kim SJ, Kulkarni S, Barlow F. Development of a SiC JFET-Based Six-Pack Power Module for a Fully Integrated Inverter Ieee Transactions On Power Electronics. 28: 1464-1478. DOI: 10.1109/Tpel.2012.2205946  0.342
2011 Abousaif E, Elshabini A, Barlow F. A novel design of substrate integrated waveguide (SIW) E-Plane inductive strip filter implemented using LTCC Journal of Microelectronics and Electronic Packaging. 8: 121-128. DOI: 10.4071/Imaps.304  0.486
2011 Abdelnaby AH, Potirniche GP, Elshabini A, Barlow F, Parker R. A Comparison of Back Grinding Processes for Bare Silicon and Through-Silicon Via Wafers Using Numerical Simulations Journal of Microelectronics and Electronic Packaging. 8: 146-153. DOI: 10.4071/Imaps.298  0.602
2009 Barlow F, Wood J, Elshabini A, Stephens EF, Feeler R, Kemner G, Junghans J. Fabrication of precise fluidic structures in LTCC International Journal of Applied Ceramic Technology. 6: 18-23. DOI: 10.1111/J.1744-7402.2008.02315.X  0.634
2008 Feeler R, Junghans J, Stephens E, Kemner G, Barlow F, Wood J, Elshabini A. Advanced Laser Diode Cooling Concepts Mrs Proceedings. 1076. DOI: 10.1557/Proc-1076-K07-06  0.58
2007 Funaki T, Balda JC, Junghans J, Kashyap AS, Mantooth HA, Barlow F, Kimoto T, Hikihara T. Power conversion with SiC devices at extremely high ambient temperatures Ieee Transactions On Power Electronics. 22: 1321-1329. DOI: 10.1109/Tpel.2007.900561  0.305
2006 Wang G, Folk EC, Barlow F, Elshabini A. Fabrication of microvias for multilayer LTCC substrates Ieee Transactions On Electronics Packaging Manufacturing. 29: 32-41. DOI: 10.1109/Tepm.2005.862633  0.62
2005 Wang G, Van M, Barlow F, Elshabini A. An interdigital bandpass filter embedded in LTCC for 5-GHz wireless LAN applications Ieee Microwave and Wireless Components Letters. 15: 357-359. DOI: 10.1109/Lmwc.2005.847711  0.71
2002 Barlow F, Lostetter A, Elshabini A. Low cost flex substrates for miniaturized electronic assemblies Microelectronics Reliability. 42: 1091-1099. DOI: 10.1016/S0026-2714(02)00061-6  0.652
2002 Wang G, Barlow F, Elshabini A. Modeling and control of resistance tolerance for embedded resistors in LTCC Proceedings - Electronic Components and Technology Conference. 516-525.  0.603
2000 Lostetter AB, Barlow F, Elshabini A. An overview to integrated power module design for high power electronics packaging Microelectronics Reliability. 40: 365-379. DOI: 10.1016/S0026-2714(99)00219-X  0.633
1998 Barlow F, Elshabini A. Compact low voltage high current power supply for digital applications Proceedings of Spie - the International Society For Optical Engineering. 3582: 138-143.  0.603
1998 Lostetter AB, Barlow F, Elshabini A. Multilayer interconnects for a high power packaging strategy Proceedings of Spie - the International Society For Optical Engineering. 3582: 330-334.  0.625
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