Year |
Citation |
Score |
2014 |
Barannyk LL, Aboutaleb HA, Elshabini A, Barlow F. Causality Verification Using Polynomial Periodic Continuations for Electrical Interconnects Journal of Microelectronics and Electronic Packaging. 11: 181-196. DOI: 10.4071/Imaps.428 |
0.588 |
|
2013 |
Tork HS, Elshabini A, Barlow F. Tunable BaSrTiO3, BaZrTiO3 Ferroelectric Capacitors Embedded Inside Low Temperature Cofired Ceramics (LTCC) Journal of Microelectronics and Electronic Packaging. 10: 95-101. DOI: 10.4071/Imaps.380 |
0.635 |
|
2011 |
Abousaif E, Elshabini A, Barlow F. A novel design of substrate integrated waveguide (SIW) E-Plane inductive strip filter implemented using LTCC Journal of Microelectronics and Electronic Packaging. 8: 121-128. DOI: 10.4071/Imaps.304 |
0.459 |
|
2011 |
Abdelnaby AH, Potirniche GP, Elshabini A, Barlow F, Parker R. A Comparison of Back Grinding Processes for Bare Silicon and Through-Silicon Via Wafers Using Numerical Simulations Journal of Microelectronics and Electronic Packaging. 8: 146-153. DOI: 10.4071/Imaps.298 |
0.581 |
|
2011 |
Abousaif E, Elshabini A, Barlow F. Waveguide inductive strip filter embedded in LTCC Proceedings - 2011 Imaps/Acers 7th International Conference and Exhibition On Ceramic Interconnect and Ceramic Microsystems Technologies, Cicmt 2011. 43-49. |
0.512 |
|
2010 |
Rabeea AA, Barlow F, Elshabini A. Develop procedure for designing fourth order microstrip dual-mode bandpass filters 2010 10th Mediterranean Microwave Symposium, Mms 2010. 236-240. DOI: 10.1109/MMW.2010.5605183 |
0.414 |
|
2009 |
Barlow F, Wood J, Elshabini A, Stephens EF, Feeler R, Kemner G, Junghans J. Fabrication of precise fluidic structures in LTCC International Journal of Applied Ceramic Technology. 6: 18-23. DOI: 10.1111/J.1744-7402.2008.02315.X |
0.614 |
|
2009 |
Rabeea AA, Barlow F, Elshabini A. Design methodology for designing second order microstrip dual-mode filters 2009 Mediterrannean Microwave Symposium, Mms 2009. DOI: 10.1109/MMS.2009.5409787 |
0.399 |
|
2008 |
Feeler R, Junghans J, Stephens E, Kemner G, Barlow F, Wood J, Elshabini A. Advanced Laser Diode Cooling Concepts Mrs Proceedings. 1076. DOI: 10.1557/Proc-1076-K07-06 |
0.554 |
|
2006 |
Wang G, Folk EC, Barlow F, Elshabini A. Fabrication of microvias for multilayer LTCC substrates Ieee Transactions On Electronics Packaging Manufacturing. 29: 32-41. DOI: 10.1109/Tepm.2005.862633 |
0.598 |
|
2005 |
Wang G, Van M, Barlow F, Elshabini A. An interdigital bandpass filter embedded in LTCC for 5-GHz wireless LAN applications Ieee Microwave and Wireless Components Letters. 15: 357-359. DOI: 10.1109/Lmwc.2005.847711 |
0.705 |
|
2003 |
Folk M, Wang V, Elshabini A, Barlow F. Embedded Passives in Low-Temperature Co-Fired Ceramic for RF & Microwave Applications Proceedings of Spie - the International Society For Optical Engineering. 5288: 627-632. |
0.312 |
|
2003 |
Magableh F, Wang V, Elshabini A, Barlow F. LTCC based slow wave filters for wireless and handheld products Proceedings of Spie - the International Society For Optical Engineering. 5231: 18-22. |
0.428 |
|
2002 |
Barlow F, Lostetter A, Elshabini A. Low cost flex substrates for miniaturized electronic assemblies Microelectronics Reliability. 42: 1091-1099. DOI: 10.1016/S0026-2714(02)00061-6 |
0.633 |
|
2002 |
Wang G, Barlow F, Elshabini A. Modeling and control of resistance tolerance for embedded resistors in LTCC Proceedings - Electronic Components and Technology Conference. 516-525. |
0.579 |
|
2002 |
Wang G, Barlow FD, Elshabini A. Simulation, characterization and design of embedded resistors in LTCC for high frequency applications Proceedings of Spie - the International Society For Optical Engineering. 4931: 851-859. |
0.334 |
|
2001 |
Wang G, Rajagopalan V, Barlow FD, Elshabini A, Brown W, Ang SS. Design and fabrication of embedded resistors in LTCC for high frequency applications Proceedings of Spie - the International Society For Optical Engineering. 4587: 325-331. |
0.313 |
|
2000 |
Lostetter AB, Barlow F, Elshabini A. An overview to integrated power module design for high power electronics packaging Microelectronics Reliability. 40: 365-379. DOI: 10.1016/S0026-2714(99)00219-X |
0.611 |
|
1998 |
Barlow F, Elshabini A. Compact low voltage high current power supply for digital applications Proceedings of Spie - the International Society For Optical Engineering. 3582: 138-143. |
0.575 |
|
1998 |
Lostetter AB, Barlow F, Elshabini A. Multilayer interconnects for a high power packaging strategy Proceedings of Spie - the International Society For Optical Engineering. 3582: 330-334. |
0.6 |
|
1998 |
Lostetter AB, Barlow F, Elshabini A. Integrated Power Modules (IPMs), a novel MCM approach to high power electronics design and packaging International Journal of Microcircuits and Electronic Packaging. 21: 274-278. |
0.312 |
|
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