| Year |
Citation |
Score |
| 2020 |
Hemmati S, Harris MT, Barkey DP. Polyol Silver Nanowire Synthesis and the Outlook for a Green Process Journal of Nanomaterials. 2020: 1-25. DOI: 10.1155/2020/9341983 |
0.309 |
|
| 2019 |
Barkey D, Oberholtzer F, Wu Q. Kinetic anisotropy and dendritic growth in electrochemical deposition. Physical Review Letters. 75: 2980-2983. PMID 10059458 DOI: 10.1103/Physrevlett.75.2980 |
0.346 |
|
| 2018 |
Lu J, Barkey DP. A Thermodynamic Study of Adsorption of Benzyl Viologen and Polyethylene Glycol and Their Displacement by 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition Journal of the Electrochemical Society. 165. DOI: 10.1149/2.1351805Jes |
0.383 |
|
| 2015 |
Hemmati S, Barkey DP, Gupta N, Banfield R. Synthesis and characterization of silver nanowire suspensions for printable conductive media Ecs Journal of Solid State Science and Technology. 4: P3075-P3079. DOI: 10.1149/2.0121504Jss |
0.31 |
|
| 2014 |
Barkey D, Chang R, Liu D, Chen J. Observation of a Limit Cycle in Potential Oscillations during Copper Electrodeposition in a Leveler/Accelerant System Journal of the Electrochemical Society. 161. DOI: 10.1149/2.041403Jes |
0.335 |
|
| 2014 |
Kreider A, Barkey DP, Wong EH. On the displacement of adsorbed polyethylene glycol by 3-mercapto-1-propanesulfonate during copper electrodeposition Journal of the Electrochemical Society. 161: D663-D665. DOI: 10.1149/2.0371412Jes |
0.54 |
|
| 2011 |
Garcia-Cardona E, Wong EH, Barkey DP. NMR spectral studies of interactions between the accelerants SPS and MPS and copper chlorides Journal of the Electrochemical Society. 158: D143-D148. DOI: 10.1149/1.3529937 |
0.347 |
|
| 2007 |
Zhang Z, Barkey DP. Nucleation of Tin and Tin–Silver Alloy on Copper and Nickel in Acid Plating Baths Journal of the Electrochemical Society. 154. DOI: 10.1149/1.2768905 |
0.36 |
|
| 2005 |
Kondo K, Yonezawa T, Mikami D, Okubo T, Taguchi Y, Takahashi K, Barkey DP. High-Aspect-Ratio Copper-Via-Filling for Three-Dimensional Chip Stacking II. Reduced Electrodeposition Process Time Journal of the Electrochemical Society. 152: 173-177. DOI: 10.1149/1.2041047 |
0.357 |
|
| 2005 |
Pasquale MA, Barkey DP, Arvia AJ. Influence of Additives on the Growth Velocity and Morphology of Branching Copper Electrodeposits Journal of the Electrochemical Society. 152. DOI: 10.1149/1.1860514 |
0.44 |
|
| 2005 |
Jin Y, Kondo K, Suzuki Y, Matsumoto T, Barkey DP. Surface Adsorption of PEG and Cl − Additives for Copper Damascene Electrodeposition Electrochemical and Solid State Letters. 8. DOI: 10.1149/1.1830371 |
0.435 |
|
| 2003 |
Wu A, Barkey DP. Pattern Recognition and Scaling Studies of Copper Electrodeposition on Cu(100) in the Presence of Additives Journal of the Electrochemical Society. 150. DOI: 10.1149/1.1590993 |
0.398 |
|
| 2000 |
Wu Q, Barkey D. Faceting and Roughening Transitions on Copper Single Crystals in Acid Sulfate Plating Baths with Chloride Journal of the Electrochemical Society. 147: 1038-1045. DOI: 10.1149/1.1393310 |
0.391 |
|
| 1998 |
Barkey DP, Oberholtzer F, Wu Q. A Reaction‐Plane Model for the Open‐Circuit Potential of Copper in Aerated Copper Sulfate Solution Journal of the Electrochemical Society. 145: 590-595. DOI: 10.1149/1.1838308 |
0.388 |
|
| 1998 |
Oberholtzer F, Barkey D, Wu Q. Kinetic selection of morphology and growth velocity in electrochemical deposition Physical Review E. 57: 6955-6961. DOI: 10.1103/Physreve.57.6955 |
0.427 |
|
| 1997 |
Wu Q, Barkey D. Atomic Force Microscopic Imaging and Velocity Measurement of Monoatomic Terrace Motion on the (111) Cu Surface during Electrodeposition Journal of the Electrochemical Society. 144. DOI: 10.1149/1.1837938 |
0.36 |
|
| 1996 |
Fleury V, Barkey D. Runaway growth in two-dimensional electrodeposition Epl. 36: 253-258. DOI: 10.1209/Epl/I1996-00218-2 |
0.344 |
|
| 1996 |
Fleury V, Barkey D. Branched copper electrodeposition on a substrate Physica a-Statistical Mechanics and Its Applications. 233: 730-741. DOI: 10.1016/S0378-4371(96)00202-6 |
0.398 |
|
| 1994 |
Barkey DP, Watt D, Liu Z, Raber S. The Role of Induced Convection in Branched Electrodeposit Morphology Selection Journal of the Electrochemical Society. 141: 1206-1212. DOI: 10.1149/1.2054897 |
0.38 |
|
| 1992 |
Barkey D, Garik P, Ben-Jacob E, Miller B, Orr B. Growth Velocity, the Limiting Current, and Morphology Selection in Electrodeposition of Branched Aggregates Journal of the Electrochemical Society. 139: 1044-1050. DOI: 10.1149/1.2069337 |
0.376 |
|
| 1992 |
Ren S, Barkey D. Electrochemically Prepared Poly(3-Methylthiophene) Films for Passivation of 430 Stainless Sreel Journal of the Electrochemical Society. 139: 1021-1026. DOI: 10.1149/1.2069334 |
0.305 |
|
| 1991 |
Garik P, Hetrick J, Orr B, Barkey D, Ben-Jacob E. Interfacial cellular mixing and a conjecture on global deposit morphology. Physical Review Letters. 66: 1606-1609. PMID 10043253 DOI: 10.1103/Physrevlett.66.1606 |
0.327 |
|
| 1991 |
Barkey D. Morphology Selection and the Concentration Boundary Layer in Electrochemical Deposition Journal of the Electrochemical Society. 138: 2912-2917. DOI: 10.1149/1.2085338 |
0.322 |
|
| 1989 |
Barkey DP, Muller RH, Tobias CW. Roughness development in metal electrodeposition: I. Experimental results Journal of the Electrochemical Society. 136: 2199-2207. DOI: 10.1149/1.2097258 |
0.358 |
|
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