Year |
Citation |
Score |
2004 |
Abdo AY, Engelstad RL, Beckman WA, Lovell EG. Thermal response of optical reticles: Experimental verification of finite element models Journal of Microlithography, Microfabrication and Microsystems. 3: 232-238. DOI: 10.1117/1.1669489 |
0.542 |
|
2004 |
Wei AC, Nellis GF, Abdo AY, Engelstad RL, Chen CF, Switkes M, Rothschild M. Microfluidic simulations for immersion lithography Journal of Microlithography, Microfabrication and Microsystems. 3: 28-34. DOI: 10.1117/1.1632500 |
0.596 |
|
2004 |
Nellis GF, Abdo AY, Engelstad RL, Cotte EP. Theoretical analysis of 157-nm hard pellicle system purification via a cyclic purge/fill process Journal of Microlithography, Microfabrication and Microsystems. 3: 122-129. DOI: 10.1117/1.1630313 |
0.406 |
|
2004 |
Abdo A, Schuetter S, Nellis G, Wei A, Engelstad R, Truskett V. Predicting the fluid behavior during the dispensing process for step-and-flash imprint lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 22: 3279-3282. DOI: 10.1116/1.1825016 |
0.446 |
|
2004 |
Abdo A, Nellis G, Wei A, El-Morsi M, Engelstad R, Brueck SRJ, Neumann A. Optimizing the fluid dispensing process for immersion lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 22: 3454-3458. DOI: 10.1116/1.1824065 |
0.528 |
|
2004 |
Wei A, Ei-Morsi M, Nellis G, Abdo A, Engelstad R. Predicting air entrainment due to topography during the filling and scanning process for immersion lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 22: 3444-3449. DOI: 10.1116/1.1808736 |
0.52 |
|
2004 |
Abdo AY, Zheng L, Wei A, Mikkelson A, Nellis G, Engelstad RL, Lovell EG. Simulating fabrication and imprinting distortions in step-and-flash imprint lithography templates Microelectronic Engineering. 73: 161-166. DOI: 10.1016/J.Mee.2004.02.034 |
0.367 |
|
2004 |
Wei A, Abdo A, Nellis G, Engelstad RL, Chang J, Lovell EG, Beckman W. Modeling fluid thermomechanical response for immersion lithography scanning Microelectronic Engineering. 73: 29-34. DOI: 10.1016/J.Mee.2004.02.011 |
0.577 |
|
2003 |
Wei A, Abdo A, Nellis G, Engelstad R, Chang J, Lovell E, Beckman W. Simulating fluid flow characteristics during the scanning process for immersion lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 21: 2788-2793. DOI: 10.1116/1.1622939 |
0.583 |
|
2002 |
Cotte EP, Abdo AY, Engelstad RL, Lovell EG. Dynamic studies of hard pellicle response during exposure scanning Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 20: 2995-2999. DOI: 10.1116/1.1520573 |
0.344 |
|
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