Year |
Citation |
Score |
2018 |
Cerhan A, Ozdemir Z, Basim GB. Self-Cleaning Ability Quantization of Textiles with Degussa P-25 Materials Science Forum. 915: 129-134. DOI: 10.4028/www.scientific.net/MSF.915.129 |
0.329 |
|
2015 |
Akbar W, Karagoz A, Basim G, Noor M, Syed T, Lum J, Unluagac M. Nano-boron as an Antibacterial Agent for Functionalized Textiles Mrs Proceedings. 1793: 53-57. DOI: 10.1557/OPL.2015.728 |
0.496 |
|
2015 |
Karagoz A, Mai J, Basim GB. Understanding selectivity on germanium/SiO2 chemical mechanical planarization through design of experiments Materials Research Society Symposium Proceedings. 1790: 19-24. DOI: 10.1557/opl.2015.524 |
0.463 |
|
2012 |
Kincal S, Basim G. Impact of Pad Conditioning on Thickness Profile Control in Chemical Mechanical Planarization Journal of Electronic Materials. 42: 83-96. DOI: 10.1007/S11664-012-2250-Z |
0.369 |
|
2010 |
Vakarelski IU, Brown SC, Basim GB, Rabinovich YI, Moudgil BM. Tailoring silica nanotribology for CMP slurry optimization: Ca(2+) cation competition in C(12)TAB mediated lubrication. Acs Applied Materials & Interfaces. 2: 1228-35. PMID 20384310 DOI: 10.1021/Am100070E |
0.535 |
|
2003 |
Basim GB, Vakarelski IU, Moudgil BM. Role of interaction forces in controlling the stability and polishing performance of CMP slurries. Journal of Colloid and Interface Science. 263: 506-15. PMID 12909041 DOI: 10.1016/S0021-9797(03)00201-7 |
0.654 |
|
2003 |
Basim GB, Moudgil BM. Slurry Design for Chemical Mechanical Polishing Kona Powder and Particle Journal. 21: 178-184. DOI: 10.14356/kona.2003020 |
0.641 |
|
2002 |
Basim GB, Moudgil BM. Effect of soft agglomerates on CMP slurry performance Journal of Colloid and Interface Science. 256: 137-142. DOI: 10.1006/jcis.2002.8352 |
0.44 |
|
2002 |
Basim GB, Vakarelski I, Singh P, Moudgil BM. Engineering the interaction forces to optimize CMP performance Materials Research Society Symposium Proceedings. 732: 73-77. |
0.648 |
|
2000 |
Basim GB, Adler JJ, Mahajan U, Singh RK, Moudgil BM. Effect of particle size of chemical mechanical polishing slurries for enhanced polishing with minimal defects Journal of the Electrochemical Society. 147: 3523-3528. DOI: 10.1149/1.1393931 |
0.528 |
|
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