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Yarui Peng, Ph.D. - Publications

Affiliations: 
2017- Department of Computer Science and Computer Engineering University of Arkansas, Little Rock, AR 
Area:
computer-aided design, analysis, and optimization for VLSI circuits and emerging technologies, such as 2.5D and 3D ICs, high band-gap power electronics and systems, and high-efficiency digital designs and memory systems
Website:
https://e3da.csce.uark.edu/people/#Faculty
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10 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Hermanns K, Peng Y, Mantooth A. The Increasing Role of Design Automation in Power Electronics: Gathering What Is Needed Ieee Power Electronics Magazine. 7: 46-50. DOI: 10.1109/Mpel.2019.2959706  0.38
2019 Evans TM, Le Q, Mukherjee S, Razi IA, Vrotsos T, Peng Y, Mantooth HA. PowerSynth: A Power Module Layout Generation Tool Ieee Transactions On Power Electronics. 34: 5063-5078. DOI: 10.1109/Tpel.2018.2870346  0.395
2018 Peng Y, Petranovic D, Samadi K, Kamal P, Du Y, Lim SK. Interdie Coupling Extraction and Physical Design Optimization for Face-to-Face 3-D ICs Ieee Transactions On Nanotechnology. 17: 634-644. DOI: 10.1109/Tnano.2017.2735361  0.635
2017 Jung M, Song T, Peng Y, Lim SK. Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning Ieee Transactions On Very Large Scale Integration Systems. 25: 2109-2117. DOI: 10.1109/Tvlsi.2017.2670508  0.757
2017 Peng Y, Song T, Petranovic D, Lim SK. Parasitic Extraction for Heterogeneous Face-to-Face Bonded 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 912-924. DOI: 10.1109/Tcpmt.2017.2677963  0.712
2015 Song T, Liu C, Peng Y, Lim SK. Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. DOI: 10.1109/Tvlsi.2015.2471098  0.715
2015 Jung M, Song T, Peng Y, Lim SK. Fine-Grained 3-D IC Partitioning Study With a Multicore Processor Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2470124  0.689
2015 Samal SK, Peng Y, Pathak M, Lim SK. Ultralow Power Circuit Design With Subthreshold/Near-Threshold 3-D IC Technologies Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2441066  0.731
2015 Peng Y, Petranovic D, Lim SK. Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 34: 1964-1976. DOI: 10.1109/Tcad.2015.2446934  0.47
2014 Peng Y, Song T, Petranovic D, Lim SK. Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 33: 1900-1913. DOI: 10.1109/Tcad.2014.2359578  0.706
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