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Vimal H. Desai - Publications

Affiliations: 
University of Central Florida, Orlando, FL, United States 
Area:
Materials Science Engineering, Aerospace Engineering
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30 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2008 Krishnan V, Bharani S, Kapat JS, Sohn YH, Desai VH. A simplistic model to study the influence of film cooling on low temperature hot corrosion rate in coal gas/syngas fired gas turbines International Journal of Heat and Mass Transfer. 51: 1049-1060. DOI: 10.1016/J.Ijheatmasstransfer.2007.05.017  0.344
2006 Jayaraj B, Vishweswariah S, Desai VH, Sohn YH. Changes in electrochemical impedance with microstructural development in TBCs Jom. 58: 60-63. DOI: 10.1007/S11837-006-0070-4  0.336
2005 Zhang J, Desai V. Determining thermal conductivity of plasma sprayed TBC by electrochemical impedance spectroscopy Surface and Coatings Technology. 190: 90-97. DOI: 10.1016/J.Surfcoat.2004.07.086  0.317
2005 Zhang J, Desai V. Evaluation of thickness, porosity and pore shape of plasma sprayed TBC by electrochemical impedance spectroscopy Surface and Coatings Technology. 190: 98-109. DOI: 10.1016/J.Surfcoat.2004.06.019  0.316
2005 Byeon JW, Jayaraj B, Vishweswaraiah S, Rhee S, Desai VH, Sohn YH. Non-destructive evaluation of degradation in multi-layered thermal barrier coatings by electrochemical impedance spectroscopy Materials Science and Engineering A. 407: 213-225. DOI: 10.1016/J.Msea.2005.07.004  0.374
2005 Jayaraj B, Vishweswaraiah S, Desai VH, Sohn YH. Damage detection of thermal barrier coatings by electrochemical impedance spectroscopy Ceramic Engineering and Science Proceedings. 26: 129-136.  0.334
2004 Du T, Tamboli D, Desai V, Seal S. Mechanism of Copper Removal during CMP in Acidic H 2 O 2 Slurry Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1648029  0.731
2004 Du T, Tamboli D, Desai V, Chathapuram VS, Sundaram KB. Chemical mechanical polishing of tantalum: oxidizer and pH effects Journal of Materials Science: Materials in Electronics. 15: 87-90. DOI: 10.1023/B:Jmse.0000005381.96813.0F  0.436
2004 Jayaraj B, Vishweswaraiah S, Desai VH, Sohn YH. Electrochemical impedance spectroscopy of thermal barrier coatings as a function of isothermal and cyclic thermal exposure Surface and Coatings Technology. 177: 140-151. DOI: 10.1016/J.Surfcoat.2003.08.092  0.421
2004 Jayaraj B, Desai VH, Lee CK, Sohn YH. Electrochemical impedance spectroscopy of porous ZrO2-8 wt.% Y2O3 and thermally grown oxide on nickel aluminide Materials Science and Engineering A. 372: 278-286. DOI: 10.1016/J.Msea.2004.01.005  0.456
2004 Sundaram KB, Alizadeh Z, Todi RM, Desai VH. Investigations on hardness of rf sputter deposited SiCN thin films Materials Science and Engineering A. 368: 103-108. DOI: 10.1016/J.Msea.2003.09.103  0.336
2004 Du T, Vijayakumar A, Sundaram KB, Desai V. Chemical mechanical polishing of nickel for applications in MEMS devices Microelectronic Engineering. 75: 234-241. DOI: 10.1016/J.Mee.2004.05.007  0.505
2004 Du T, Luo Y, Desai V. The combinatorial effect of complexing agent and inhibitor on chemical–mechanical planarization of copper Microelectronic Engineering. 71: 90-97. DOI: 10.1016/J.Mee.2003.08.008  0.565
2004 Du T, Vijayakumar A, Desai V. Effect of hydrogen peroxide on oxidation of copper in CMP slurries containing glycine and Cu ions Electrochimica Acta. 49: 4505-4512. DOI: 10.1016/J.Electacta.2004.05.008  0.557
2004 Du T, Tamboli D, Luo Y, Desai V. Electrochemical characterization of copper chemical mechanical planarization in KIO3 slurry Applied Surface Science. 229: 167-174. DOI: 10.1016/J.Apsusc.2004.01.062  0.721
2004 An L, Wang Y, Bharadwaj L, Zhang L, Fan Y, Jiang D, Sohn YH, Desai VH, Kapat J, Chow LC. Silicoaluminum carbonitride with anomalously high resistance to oxidation and hot corrosion Advanced Engineering Materials. 6: 337-340+275. DOI: 10.1002/Adem.200400010  0.382
2003 Kuiry SC, Seal S, Fei W, Ramsdell J, Desai VH, Li Y, Babu SV, Wood B. Effect of pH and H2O2 on Ta chemical mechanical planarization. Electrochemistry and X-ray photoelectron spectroscopy studies Journal of the Electrochemical Society. 150. DOI: 10.1149/1.1528202  0.402
2003 Vijayakumar A, Du T, Sundaram KB, Desai V. Polishing mechanism of tantalum films by SiO 2 particles Microelectronic Engineering. 70: 93-101. DOI: 10.1016/S0167-9317(03)00398-8  0.407
2003 Du T, Tamboli D, Desai V. Electrochemical characterization of copper chemical mechanical polishing Microelectronic Engineering. 69: 1-9. DOI: 10.1016/S0167-9317(03)00222-3  0.729
2003 Chathapuram VS, Du T, Sundaram KB, Desai V. Role of oxidizer in the chemical mechanical planarization of the Ti/TiN barrier layer Microelectronic Engineering. 65: 478-488. DOI: 10.1016/S0167-9317(03)00177-1  0.503
2002 Wannaparhun S, Seal S, Desai V. Surface chemistry of Nextel-720, alumina and Nextel-720/alumina ceramic matrix composite (CMC) using XPS–A tool for nano-spectroscopy Applied Surface Science. 185: 183-196. DOI: 10.1016/S0169-4332(01)00594-3  0.326
2000 Zhang J, Desai V. Post-Exposure Evaluation of Thermal Barrier Coatings by Electrochemical Impedance Spectroscopy Mrs Proceedings. 645. DOI: 10.1557/Proc-645-M9.2.1  0.479
2000 Zhang J, Tamboli D, Desai V. Quality Assurance Evaluation of Thermal Barrier Coatings by Electrochemical Impedance Spectroscopy Mrs Proceedings. 645. DOI: 10.1557/Proc-645-M8.6.1  0.472
2000 Seal S, Sapre K, Kale A, Desai V, Gopal M, Jepson P. Effect of multiphase flow on corrosion of C-steel in presence of inhibitor: a surface morphological and chemical study Corrosion Science. 42: 1623-1634. DOI: 10.1016/S0010-938X(00)00013-5  0.345
1999 Tamboli D, Seal S, Desai V, Maury A. Studies on passivation behavior of tungsten in application to chemical mechanical polishing Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 17: 1168-1173. DOI: 10.1116/1.581790  0.715
1999 Seal S, Nardelli R, Kale A, Desai V, Armacanqui E. Role of surface chemistry on the nature of passive oxide film growth on Fe–Cr (low and high) steels at high temperatures Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 17: 1109-1115. DOI: 10.1116/1.581782  0.461
1998 Desai VH, Tamboli DC, Cheruvu NS. Oxidation characteristics of Nickel based superalloys in steam Proceedings of the Asme Turbo Expo. 5. DOI: 10.1115/98-GT-587  0.684
1995 Khanna AS, Gasser A, Wissenbach K, Li M, Desai VH, Quadakkers WJ. Oxidation and corrosion behaviour of mild steel laser alloyed with nickel and chromium Journal of Materials Science. 30: 4684-4691. DOI: 10.1007/Bf01153079  0.407
1993 Arora SM, Desai VH, Sundaram KB. The effect of processing parameters on the environmental stability of YBaCuO superconductor Journal of Materials Science. 28: 454-460. DOI: 10.1007/Bf00357823  0.318
1992 Sundaram KB, Seshan SS, Desai VH, Arora SM. Electrochemical etching of high Tc superconducting materials Journal of Materials Science: Materials in Electronics. 3: 26-28. DOI: 10.1007/Bf00701090  0.357
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